Patents by Inventor Yu-Lin Chen

Yu-Lin Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230029820
    Abstract: An image sensor is provided. The image sensor includes a substrate, an isolation structure on the substrate, a photoelectric conversion layer, a transparent electrode layer, an encapsulation layer, a color filter layer, and a micro-lens. The isolation structure is electrically non-conductive and defines a plurality of pixel regions on the substrate. The isolation structure prevents cross-talk of electrical signals among pixels. The photoelectric conversion layer is disposed on the pixel regions defined by the isolation structure. The transparent electrode layer is disposed over the isolation structure and the photoelectric conversion layer. The encapsulation layer is disposed over the transparent electrode layer. The micro-lens is disposed on the color filter layer.
    Type: Application
    Filed: August 2, 2021
    Publication date: February 2, 2023
    Inventors: Wei-Lung TSAI, Shin-Hong KUO, Huang-Jen CHEN, Yu-Chi CHANG, Ching-Chiang WU, Han-Lin WU, Hung-Jen TSAI
  • Publication number: 20230022241
    Abstract: A ventilation fan is disclosure and includes a housing, a grille support, a fan module, a base, plural connecting columns and a function module. The grille support and the base form a grille structure mounted under a ceiling. The fan module disposed within the housing forms an airflow flowing. The base and the grille support are connected through the plural connecting columns and spaced apart from each other. An inlet radially formed between the base and the grille support is in communication with the outlet through the grille opening. The base includes a holder having a holding opening axially downward and faced away from the housing. The function module is disposed within the holder through the holding opening.
    Type: Application
    Filed: September 30, 2022
    Publication date: January 26, 2023
    Inventors: Yu-Hsiang Huang, Yen-Lin Chen, Chih-Hua Lin
  • Publication number: 20230018805
    Abstract: An oscillating device includes a first quartz crystal resonator, a driving circuit, a first waveform adjustment circuit, and at least two second quartz crystal resonators. The first quartz crystal resonator has a first resonant frequency. The driving circuit, coupled to the first quartz crystal resonator, drives the first quartz crystal resonator to generate a first oscillating signal having the first resonant frequency. The second quartz crystal resonators, coupled in parallel and coupled to the driving circuit and the first quartz crystal resonator, have a second resonant frequency and receive and rectify the first oscillating signal to generate a second oscillating signal having the second resonant frequency. The first waveform adjustment circuit, coupled to the second quartz crystal resonators, receives the second oscillating signal and adjusts the second oscillating signal to generate a first waveform adjustment signal.
    Type: Application
    Filed: August 29, 2022
    Publication date: January 19, 2023
    Applicant: TXC CORPORATION
    Inventors: Yu-Liang CHEN, Chih-Hsun CHEN, Wan-Lin HSIEH, Erh-Shuo HSU, Sheng-Hsiang KAO
  • Publication number: 20230016073
    Abstract: A foldable electronic device includes a first casing, a second casing, a hinge structure and a foldable display. The hinge structure connects the first casing and the second casing, and includes a plurality of supporting blocks, a plurality of first hinge blocks and a plurality of second hinge blocks. The supporting blocks are arranged side by side between the first casing and the second casing. The first hinge blocks and the second hinge blocks are respectively arranged at two sides of the supporting blocks. One of the first hinge blocks connects two of the supporting blocks adjacent to each other. One of the second hinge blocks connects two of the supporting blocks adjacent to each other. The foldable display includes a first bonding portion secured to the first casing, a second bonding portion secured to the second casing and a foldable portion aligned to the hinge structure.
    Type: Application
    Filed: September 27, 2022
    Publication date: January 19, 2023
    Applicant: Acer Incorporated
    Inventors: Hui-Ping Sun, Wei-Chih Wang, Chun-Hung Wen, Yu-Cheng Shih, Yen-Chou Chueh, Chi-Tai Ho, Kuan-Lin Chen, Chun-Hsien Chen, Chih-Heng Tsou
  • Publication number: 20230012045
    Abstract: A method for Co-Reception (Co-Rx) operation of multiple transceiver radios sharing the same antenna and Low Noise Amplifier (LNA) is provided. A first receiver radio of a wireless communication device determines the first gain mode of an LNA based on the first signal indicator. A second receiver radio of the wireless communication device determines the second gain mode of the LNA based on the second signal indicator. The LNA is shared by the first receiver radio and the second receiver radio and is coupled to an antenna. A Packet Traffic Arbitration (PTA) circuitry of the wireless communication device configures the LNA to operate in the first gain mode or the second gain mode based on the priority levels of the first receiver radio and the second receiver radio.
    Type: Application
    Filed: June 30, 2022
    Publication date: January 12, 2023
    Inventors: Li-Wei CHEN, Tsai-Yuan HSU, Chen-Feng LIU, Wen-Ying CHIEN, Chia-Hung HSU, Yu-Lin TSAI
  • Patent number: 11552241
    Abstract: A method for fabricating a semiconductor device includes the steps of: forming a first metal interconnection on a substrate; forming a stop layer on the first metal interconnection; removing the stop layer to form a first opening; forming an electromigration enhancing layer in the first opening; and forming a second metal interconnection on the electromigration enhancing layer. Preferably, top surfaces of the electromigration enhancing layer and the stop layer are coplanar.
    Type: Grant
    Filed: May 12, 2020
    Date of Patent: January 10, 2023
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Hui-Lin Wang, Po-Kai Hsu, Hung-Yueh Chen, Yu-Ping Wang
  • Patent number: 11550416
    Abstract: A touch display device and an operation method thereof are provided. The touch display device includes a touch display panel, a power management circuit, a display driving circuit, and a touch circuit. The display driving circuit drives the touch display panel to display an image, and notifies the power management circuit to perform a voltage adjustment of a common voltage supplied to the touch display panel in a voltage adjustment period. The touch circuit individually performs a touch sensing operation on multiple sensing lines of a touch sensing layer of the touch display panel, so as to generate multiple touch sensing data corresponding to the sensing lines. The touch circuit ignores the touch sensing data corresponding to the voltage adjustment period, or the touch circuit suspends performing the touch sensing operation on the sensing lines of the touch sensing layer during the voltage adjustment period.
    Type: Grant
    Filed: August 11, 2021
    Date of Patent: January 10, 2023
    Assignee: Novatek Microelectronics Corp.
    Inventors: Yu-Huang Chen, Feng-Lin Chan
  • Publication number: 20230005963
    Abstract: A driving circuit film configured to be bond at a periphery region of a display panel. The driving circuit film includes a flexible substrate, a gate driving circuit and a source driver. The gate driving circuit is disposed on the flexible substrate, and the gate driving circuit includes a Thin-Film Transistor. The source driver is disposed on the flexible substrate.
    Type: Application
    Filed: July 1, 2022
    Publication date: January 5, 2023
    Inventors: Yung-Sheng CHANG, Wei-Tsung CHEN, Yu-Lin WANG
  • Patent number: 11545560
    Abstract: A method for fabricating semiconductor device includes the steps of: forming a gate structure on a substrate; forming a first spacer and a second spacer around the gate structure; forming a recess adjacent to two sides of the second spacer; performing a cleaning process to trim the second spacer for forming a void between the first spacer and the substrate; and forming an epitaxial layer in the recess.
    Type: Grant
    Filed: January 28, 2021
    Date of Patent: January 3, 2023
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Wei-Chih Chuang, Chia-Jong Liu, Kuang-Hsiu Chen, Chung-Ting Huang, Chi-Hsuan Tang, Kai-Hsiang Wang, Bing-Yang Jiang, Yu-Lin Cheng, Chun-Jen Chen, Yu-Shu Lin, Jhong-Yi Huang, Chao-Nan Chen, Guan-Ying Wu
  • Publication number: 20220415776
    Abstract: A package structure includes a redistribution structure and a core substrate. The redistribution structure includes a plurality of connection pads. The core substrate is disposed on the redistribution structure and electrically connected to the plurality of connection pads. The core substrate includes a first interconnection layer and a plurality of conductive terminals. The first interconnection layer has a first region, a second region surrounding the first region, and a third region surrounding the second region, and includes a plurality of bonding pads located in the first region, the second region and the third region. The conductive terminals are electrically connecting the plurality of bonding pads to the plurality of connection pads of the redistribution structure, wherein the plurality of conductive terminals located over the first region, the second region and the third region of the first interconnection layer have different heights.
    Type: Application
    Filed: June 24, 2021
    Publication date: December 29, 2022
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chin-Liang Chen, Kuan-Lin Ho, Pei-Rong Ni, Chia-Min Lin, Yu-Min Liang, Jiun-Yi Wu
  • Publication number: 20220411628
    Abstract: A thermosetting resin composition and a prepreg are provided. The thermosetting resin composition includes a maleimide resin, a cyanate ester resin, and a crosslinking agent. The crosslinking agent is a silane-modified diallyl bisphenol compound whose structure is represented by Formula (1): In Formula (1), X is a linear or branched C1 to C6 alkyl, cycloalkyl, or sulfonyl group, R1 is a linear or branched C1 to C6 alkyl or aryl group, R2 is a C1 to C6 alkyl group, R3 is a functional group with a crosslinkable double bond, and n+m is a positive integer from 1 to 8.
    Type: Application
    Filed: August 25, 2021
    Publication date: December 29, 2022
    Applicant: Prior Company Limited
    Inventors: Yu Lin Huang, I-Ling Chen, Cheng-Hsin Tsai
  • Publication number: 20220406699
    Abstract: A semiconductor structure and a manufacturing method thereof are provided. The semiconductor structure includes a redistribution structure, conductive joints, conductive terminals, a circuit substrate, and an insulating encapsulation. The redistribution structure includes a first side and a second side opposite to the first side, wherein trenches are located on the second side of the redistribution structure and extend to an edge of the second side of the redistribution structure. The conductive joints are disposed over the first side of the redistribution structure. The conductive terminals are disposed over the second side of the redistribution structure. The circuit substrate electrically coupled to the redistribution structure through the conductive joints. The insulating encapsulation is disposed on the first side of the redistribution structure to cover the circuit substrate.
    Type: Application
    Filed: June 18, 2021
    Publication date: December 22, 2022
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Kuan-Lin Ho, Chin-Liang Chen, Pei-Rong Ni, Chia-Min Lin, Yu-Min Liang, Jiun-Yi Wu
  • Patent number: 11527504
    Abstract: External electrical connectors and methods of forming such external electrical connectors are discussed. A method includes forming an external electrical connector structure on a substrate. The forming the external electrical connector structure includes plating a pillar on the substrate at a first agitation level affected at the substrate in a first solution. The method further includes plating solder on the external electrical connector structure at a second agitation level affected at the substrate in a second solution. The second agitation level affected at the substrate is greater than the first agitation level affected at the substrate. The plating the solder further forms a shell on a sidewall of the external electrical connector structure.
    Type: Grant
    Filed: August 10, 2020
    Date of Patent: December 13, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Meng-Fu Shih, Chun-Yen Lo, Cheng-Lin Huang, Wen-Ming Chen, Chien-Ming Huang, Yuan-Fu Liu, Yung-Chiuan Cheng, Wei-Chih Huang, Chen-Hsun Liu, Chien-Pin Chan, Yu-Nu Hsu, Chi-Hung Lin, Te-Hsun Pang, Chin-Yu Ku
  • Publication number: 20220389092
    Abstract: The current disclosure provides polypeptide, nucleic acid, compositions, and methods for treating or preventing CRS in patients in need thereof, particularly for those receiving an immunotherapy, such as a cancer immunotherapy, that may provoke a CRS response. Accordingly, aspects of the disclosure relate to a chimeric binding polypeptides comprising a heavy chain variable region comprising CDR1, CDR2, and CDR3 attached by a heterologous linker to a light chain variable region comprising CDR4, CDR5, and CDR6.
    Type: Application
    Filed: April 2, 2020
    Publication date: December 8, 2022
    Applicant: The Regents of the University of California
    Inventors: Meng-Yin LIN, Yvonne Yu-Hsuan CHEN
  • Publication number: 20220387999
    Abstract: The present invention is directed to systems and devices that allow for separation of cells based on size and electric properties and for high-throughput cell sorting. The system may comprise a microfluidic platform having a main microfluidic channel and cavity acoustic transducers (CATs). The microfluidic platform may be coupled to an external acoustic source. The system may further comprise a fluid disposed through the main microfluidic channel comprising cells having different sizes and electric properties. The fluid may intersect the CATs to form one or more interfaces. The system may further comprise electrodes underneath the microfluidic platform. The CATs may oscillate the interfaces to produce one or more microstreaming vortices, such that each microstreaming vortex is capable of selectively trapping cells based on size. The set of electrodes may apply an AC to cause the cells to move relative to the set of electrodes based on electric properties.
    Type: Application
    Filed: August 19, 2022
    Publication date: December 8, 2022
    Inventors: Abraham P. Lee, Gisela Lin, Ruoyu Jiang, Mohammad Aghaamoo, Yu-Hsi Chen, Braulio Cárdenas Benítez
  • Publication number: 20220375508
    Abstract: A memory device for CIM has a memory array including a plurality of memory cells arranged in an array of rows and columns. The memory cells have a first group of memory cells and a second group of memory cells. Each row of the array has a corresponding word line, with each memory cell of a row of the array coupled to the corresponding word line. Each column of the array has a corresponding bit line, with each memory cell of a column of the array coupled to the corresponding bit line. A control circuit is configured to select the first group of memory cells or the second group of memory cells in response to a group enable signal.
    Type: Application
    Filed: December 23, 2021
    Publication date: November 24, 2022
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yen-An Chang, Yu-Lin Chen, Chia-Fu Lee
  • Patent number: 11507221
    Abstract: An analog front-end circuit for a touch controller and an operating method thereof are provided. The analog front-end circuit includes an analog front-end, a first switch and a second switch. The analog front-end includes an input terminal and an output terminal. The first switch includes a first terminal and a second terminal. The first terminal of the first switch is coupled to the input terminal of the analog front-end, and the second terminal of the first switch is coupled to a panel routing. The second switch includes a first terminal and a second terminal. The first terminal of the second switch is coupled to the second terminal of the first switch, and the second terminal of the second switch is coupled to a reference voltage.
    Type: Grant
    Filed: March 25, 2021
    Date of Patent: November 22, 2022
    Assignee: Novatek Microelectronics Corp.
    Inventors: Hung-Kai Chen, Yu-Huang Chen, Feng-Lin Chan
  • Patent number: 11508640
    Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes a first semiconductor die, a second semiconductor die, a molding compound, a heat dissipation module and an adhesive material. The first and second semiconductor dies are different types of dies and are disposed side by side. The molding compound encloses the first and second semiconductor dies. The heat dissipation module is located directly on and in contact with the back sides of the first and second semiconductor dies. The adhesive material is filled and contacted between the heat dissipation module and the molding compound. The semiconductor package has a central region and a peripheral region surrounding the central region. The first and second semiconductor dies are located within the central region. A sidewall of the heat dissipation module, a sidewall of the adhesive material and a sidewall of the molding compound are substantially coplanar.
    Type: Grant
    Filed: May 14, 2020
    Date of Patent: November 22, 2022
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chi-Yang Yu, Chin-Liang Chen, Kuan-Lin Ho, Yu-Min Liang, Wen-Lin Chen
  • Publication number: 20220367315
    Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes a first semiconductor die, a second semiconductor die, a molding compound, a heat dissipation module and an adhesive material. The first and second semiconductor dies are different types of dies and are disposed side by side. The molding compound encloses the first and second semiconductor dies. The heat dissipation module is located directly on and in contact with the back sides of the first and second semiconductor dies. The adhesive material is filled and contacted between the heat dissipation module and the molding compound. The semiconductor package has a central region and a peripheral region surrounding the central region. The first and second semiconductor dies are located within the central region. A sidewall of the heat dissipation module, a sidewall of the adhesive material and a sidewall of the molding compound are substantially coplanar.
    Type: Application
    Filed: July 29, 2022
    Publication date: November 17, 2022
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chi-Yang Yu, Chin-Liang Chen, Kuan-Lin Ho, Yu-Min Liang, Wen-Lin Chen
  • Publication number: 20220362039
    Abstract: The invention discloses a bionic wrist joint based on an asymmetric 3-RRR parallel mechanism, including: an asymmetric 3-RRR parallel mechanism and a drive unit. The asymmetric 3-RRR parallel mechanism includes: a moving platform, a first static platform, and three asymmetrically distributed parallel branch chains, wherein each branch chain includes a passive rod and an active rod. An end of the active rod is connected to the first static platform via the revolute pair, and another end thereof is connected to the passive rod via the revolute pair. The axes of the revolute pairs at two ends of the active rod form an axis included angle. Three axis included angles are different, the passive rod and the moving platform are connected by the revolute pair, and three axis included angles corresponding to the passive rods are different. The drive unit is configured to drive the asymmetric 3-RRR parallel mechanism to move.
    Type: Application
    Filed: September 29, 2021
    Publication date: November 17, 2022
    Applicant: HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY
    Inventors: Wen-Bin Chen, Hao Fu, Yu-Lin Zhang, Xiang Fan, Zhi-Jie Zhou, Cai-Hua Xiong