Abstract: An anti-twist structure of voice coil motor includes a base, a lens housing, an elastic sheet, a magnet, and a yoke member. The lens housing has a margin wall, and the margin wall has a first protrusion and a contact portion. The elastic sheet has a hollowed slot, and the first protrusion pass through the hollowed slot, so that the elastic sheet is disposed on a portion of the margin wall and on the contact portion. The yoke member has an upper wall and a side wall. The side wall is disposed at one side of the upper wall and the side wall extends outward in a direction not parallel to the upper wall. The yoke member surrounds the lens housing, the elastic sheet, and the magnet. The lens housing has a deflectable angle relative to a horizontal reference line.

Abstract: A protecting method for preventing solder crack failure in an electronic product is provided. Firstly, a step (a) is performed to confirm that a crack incidence rate of a metallic solder material in a printed circuit board is high. In a step (b), a protecting mechanism of controlling the electronic product to enter an idle mode and leave the idle mode is activated. Consequently, an operating temperature of the electronic product decreases at a first average drop rate.

Abstract: An electronic device which is capable of being bent in a first direction and includes a plurality of light-emitting units and a plurality of conductive patterns overlapping with at least a portion of the plurality of light-emitting units and extending in a second direction. The first direction and the second direction have an angle ? of not greater than 30 degrees.

Abstract: An optical system is provided. The optical system includes a first movable portion, a fixed portion, a first driving assembly, and a first sensing assembly. The first movable portion is used for connecting to an optical assembly having a main axis. The first movable portion is movable relative to the fixed portion. The first driving assembly is used for driving the first movable portion to move relative to the fixed portion. The first sensing assembly is used for sensing the movement of the first movable portion relative to the fixed portion.

Abstract: Disclosed is an earphone system. The earphone system includes a charging box and an earphone, which is detachably assembled in the charging box. The charging box includes a processing module provided with a first identification time period, a power outputting module and a first switch module. During the first identification time period when the earphone is connected to the charging box, the earphone system is in a test mode, and the first switch module is switched for the charging box to transmit power to the earphone through the power outputting module and the first switch module. After the earphone is connected to the charging box for more than the first identification time period, the earphone system is in a communication mode, and the first switch module is switched for the charging box to transmit a data signal to the earphone through the processing module and the first switch module.

Abstract: An illumination system provides an illumination beam and includes a red light source, a green light source, a blue light source, a first supplementary light source, a first X-shaped light-splitting assembly, a first light-splitting element, and a light-uniforming element. The red light source provides a red beam. The green light source provides a green beam. The blue light source provides a blue beam. The first supplementary light source provides a first supplementary beam. The first X-shaped light-splitting assembly guides the first supplementary beam and the blue beam to the first light-splitting element. The first light-splitting element guides the red beam, the green beam, the blue beam, and the first supplementary beam to the light-uniforming element. The first supplementary beam is a red supplementary beam or a blue supplementary beam, and the illumination system includes at least five light-emitting elements. A projection apparatus including the above illumination system is also provided.

Abstract: A write assist circuit can include a control circuit and a voltage generator. The control circuit can be configured to receive memory address information associated with a memory write operation for memory cells. The voltage generator can be configured to provide a reference voltage to one or more bitlines coupled to the memory cells. The voltage generator can include two capacitive elements, where during the memory write operation, (i) one of the capacitive elements can be configured to couple the reference voltage to a first negative voltage, and (ii) based on the memory address information, both capacitive elements can be configured to cumulatively couple the reference voltage to a second negative voltage that is lower than the first negative voltage.

Abstract: A driving circuit includes a first transistor, a capacitor, a second transistor, and a driving transistor. The first transistor is configured to provide a data signal according to a first scan signal. The capacitor is coupled to the first transistor, and the capacitor includes a first terminal and a second terminal. The second transistor is coupled to the first transistor, and the second transistor is configured to provide a start signal according to the data signal. The driving transistor is coupled to the second transistor, and the driving transistor is configured to output a driving signal according to the start signal.

Abstract: Methods and systems are provided for accurately filling holes, regions, and/or portions of high-resolution images using guided upsampling during image inpainting. For instance, an image inpainting system can apply guided upsampling to an inpainted image result to enable generation of a high-resolution inpainting result from a lower-resolution image that has undergone inpainting. To allow for guided upsampling during image inpainting, one or more neural networks can be used. For instance, a low-resolution result neural network (e.g., comprised of an encoder and a decoder) and a high-resolution input neural network (e.g., comprised of an encoder and a decoder). The image inpainting system can use such networks to generate a high-resolution inpainting image result that fills the hole, region, and/or portion of the image.

Abstract: A method of manufacturing a semiconductor structure is provided. A conductive layer is formed on a precursor memory structure. A target layer is formed on the conductive layer. A first photoresist with a first opening is formed on the target layer. A spacer is formed on sidewalls of the first opening. A second photoresist with a second opening is formed on the target layer and the spacer. The target layer is patterned by the second photoresist and the spacer to form a first patterned target layer. A third photoresist with a third opening is formed on the first patterned target layer. The first patterned target layer is patterned by the third photoresist to form a second patterned target layer. The conductive layer is patterned by the second patterned target layer to form a patterned conductive layer including a ring structure aligned with a source/drain region.

Abstract: A foldable display device is provided by the present disclosure. The foldable display device includes a foldable display panel and a foldable cover. The foldable cover is adhered to the foldable display panel. The foldable cover includes an inner substrate, an outer substrate and a first adhesive. The first adhesive is disposed between the inner substrate and the outer substrate. A thickness of the first adhesive is ranged from 1 micrometer to 40 micrometers, and a ratio of the sum of the thickness of the first adhesive and a thickness of the inner substrate to a thickness of the foldable cover is greater than or equal to 0.5 and less than 1. In addition, the foldable display device further includes a second adhesive disposed between the foldable display panel and the foldable cover.

Abstract: Disclosed is an earphone system. The earphone system includes a charging box and an earphone, which is detachably assembled in the charging box. The charging box includes a processing module provided with a first identification time period, a power outputting module and a first switch module. During the first identification time period when the earphone is connected to the charging box, the earphone system is in a test mode, and the first switch module is switched for the charging box to transmit power to the earphone through the power outputting module and the first switch module. After the earphone is connected to the charging box for more than the first identification time period, the earphone system is in a communication mode, and the first switch module is switched for the charging box to transmit a data signal to the earphone through the processing module and the first switch module.

Abstract: Techniques are disclosed for systems and methods associated with a powertrain for a micro-mobility fleet vehicle. The fleet vehicle may include at least one drive wheel to provide tractive contact between the flee vehicle and a road surface, an electric motor mechanically coupled to the drive wheel and configured to provide motive force for the fleet vehicle, a brake resistor configured to provide dynamic braking of the motor, and a motor controller electronically coupling the brake resistor to the motor. The motor controller may be configured to control the motive force provided by the motor using the brake resistor. The motor controller may be configured to limit a speed, power, and/or acceleration of the motor using the brake resistor based on an operational environment of, and/or on a directive received by, the fleet vehicle. The brake resistor may provide a relatively wide range of traction control for the fleet vehicle.

Abstract: A method for fabricating a semiconductor device includes the steps of: forming a first inter-metal dielectric (IMD) layer on a substrate; forming a first metal interconnection and a second metal interconnection in the first IMD layer; forming a channel layer on the first metal interconnection and the second metal interconnection; forming a magnetic tunneling junction (MTJ) stack on the channel layer; and removing the MTJ stack to form a MTJ.

Abstract: A magnetic tunnel junction (MTJ) device includes two magnetic tunnel junction elements and a magnetic shielding layer. The two magnetic tunnel junction elements are arranged side by side. The magnetic shielding layer is disposed between the magnetic tunnel junction elements. A method of forming said magnetic tunnel junction (MTJ) device includes the following steps. An interlayer including a magnetic shielding layer is formed. The interlayer is etched to form recesses in the interlayer. The magnetic tunnel junction elements fill in the recesses. Or, a method of forming said magnetic tunnel junction (MTJ) device includes the following steps. A magnetic tunnel junction layer is formed. The magnetic tunnel junction layer is patterned to form magnetic tunnel junction elements. An interlayer including a magnetic shielding layer is formed between the magnetic tunnel junction elements.

Abstract: A method for fabricating semiconductor device includes the steps of: providing a substrate having a first region and a second region; forming a first fin-shaped structure on the first region and a second fin-shaped structure on the second region; forming a patterned mask on the second region; and performing a process to enlarge the first fin-shaped structure so that the top surfaces of the first fin-shaped structure and the second fin-shaped structure are different.

Abstract: An electronic device includes a device body and an antenna module disposed in the device body and including a conductive structure and a coaxial cable including a core wire, a shielding layer wrapping the core wire, and an outer jacket wrapping the shielding layer. The conductive structure includes a structure body and a slot formed on the structure body and penetrating the structure body in a thickness direction of the structure body. A section of the shielding layer extends from the outer jacket and is connected to the structure body. A physical portion of the structure body and the section of the shielding layer are respectively located on two opposite sides of the slot in a width direction of the slot. A section of the core wire extends from the section of the shielding layer and overlaps the slot and the physical portion in the thickness direction.

Abstract: A method for forming a semiconductor structure is provided. The method for forming the semiconductor structure includes forming a fin structure over a substrate in a first direction, forming a first gate stack, a second gate stack and a third gate stack across the fin structure, removing the first gate stack to form a trench, depositing a cutting structure in the trench, and forming a first contact plug between the cutting structure and the second gate stack and a second contact plug between the second gate stack and the third gate stack. The fin structure is cut into two segments by the trench. A first dimension of the first contact plug in the first direction is greater than a second dimension of the second contact plug in the first direction.

Abstract: Disclosed are a dual-motor multi-gear hybrid transmission system and a vehicle. The dual-motor multi-gear hybrid transmission system includes an engine, a first motor, a second motor, a first clutch, a second clutch, a first planet row, a second planet row, a first input shaft, a second input shaft, a third input shaft and a brake assembly. The first input shaft is connected to the engine through the first clutch. The second input shaft is connected to the engine through the second clutch, and the second input shaft is sleeved outside the first input shaft. The first motor is connected to the engine. The second motor is connected to the first planet row through the third input shaft. The brake assembly is configured to brake the first planet row and/or the second planet row.