Abstract: A testing system for semiconductor package components includes a testing circuit board, a test socket, at least one probe pin and a thermal barrier layer element. The testing circuit board has at least one electrical contact. The test socket is used to receive a DUT. The probe pin is located on the test socket for contacting with the DUT. The thermal barrier layer element is located between the testing circuit board and the test socket, electrically connected to the probe pin and the electrical contact, and thermally isolated the electrical contact from the probe pin.

Abstract: A drying apparatus includes an oven body, a magnetic field generating device, a chamber pressure controlling device and a baking device. The oven body is provided with a chamber which is air-hermetic for receiving a semiconductor package element. The chamber pressure controlling device reduces a chamber pressure of the chamber. The magnetic field generating device polarizes liquid on the semiconductor package element in the chamber. The baking device evaporates the liquid on the semiconductor package in the chamber.

Abstract: A carrying device includes a main body, a grasping portion, a heat-exchanging module and a gas chamber device. The grasping portion is connected to the main body for grasping a semiconductor element. The heat-exchanging module is disposed on the main body. The gas chamber device includes a case body and a gas. The case body is disposed between the grasping portion and the heat-exchanging module, and has a closed chamber therein. The gas fills the closed chamber for transferring heat from the semiconductor element to the heat exchanging module, in which a specific heat capacity of the gas is about between 5000 J/(kg·K)-15000 J/(kg·K).

Abstract: A drying apparatus includes an oven body, a magnetic field generating device, a chamber pressure controlling device and a baking device. The oven body is provided with a chamber which is air-hermetic for receiving a semiconductor package element. The chamber pressure controlling device reduces a chamber pressure of the chamber. The magnetic field generating device polarizes liquid on the semiconductor package element in the chamber. The baking device evaporates the liquid on the semiconductor package in the chamber.

Abstract: A probe loader device includes a carrier board, a three-dimensional stepped structure and a probe module having a plurality of probe pin layers separately stacked together in three-dimensional stepped structure. The three-dimensional stepped structure is connected to the carrier board. Each of the probe pin layers includes a plurality of cantilever probes. The cantilever probes respectively extend outwards from different steps of the three-dimensional stepped structure, and physical touch a plurality of electrical contacts of a DUT. A portion of each of the cantilever probes extending outwards from the three-dimensional stepped structure has a moment length, and the moment lengths of the cantilever probes of the different probe pin layers are the same.

Abstract: A carrying device includes a main body, a grasping portion, a heat-exchanging module and a gas chamber device. The grasping portion is connected to the main body for grasping a semiconductor element. The heat-exchanging module is disposed on the main body. The gas chamber device includes a case body and a gas. The case body is disposed between the grasping portion and the heat-exchanging module, and has a closed chamber therein. The gas fills the closed chamber for transferring heat from the semiconductor element to the heat exchanging module, in which a specific heat capacity of the gas is about between 5000 J/(kg·K)-15000 J/(kg·K).

Abstract: A testing system for semiconductor package components includes a testing circuit board, a test socket, at least one probe pin and a thermal barrier layer element. The testing circuit board has at least one electrical contact. The test socket is used to receive a DUT. The probe pin is located on the test socket for contacting with the DUT. The thermal barrier layer element is located between the testing circuit board and the test socket, electrically connected to the probe pin and the electrical contact, and thermally isolated the electrical contact from the probe pin.

Abstract: An electronic device having active heat dissipation includes a wiring board, a semiconductor package unit, a surrounding unit, a fan module and a tube member. The semiconductor package unit is soldered to the wiring board through three-dimensional contacts. The surrounding unit is connected to the wiring board and the semiconductor package unit, and surrounds the three-dimensional contacts, such that a heat exchange space is collectively defined by the surrounding unit, the wiring board and the semiconductor package unit. The surrounding unit is provided with two openings which are in communication with the heat exchange space. The fan module is located outside the heat exchange space, and is connected to one of the openings.

Abstract: A probe connector includes a probe body, a flexible sleeve body, a slit and a conductive fluid. The flexible sleeve body is connected to the probe body. The conductive fluid is received in the flexible sleeve body and electrically connected to the slit and the probe body. The slit is formed on one end of the flexible sleeve body opposite to the probe body, so as to define petal portions which are configured to be tightly closed together. When the slit is pressed to separate the petal portions, a portion of the conductive fluid seeps up from the flexible sleeve body via the slit.

Abstract: A probe loader device includes a carrier board, a three-dimensional stepped structure and a probe module having a plurality of probe pin layers separately stacked together in three-dimensional stepped structure. The three-dimensional stepped structure is connected to the carrier board. Each of the probe pin layers includes a plurality of cantilever probes. The cantilever probes respectively extend outwards from different steps of the three-dimensional stepped structure, and physical touch a plurality of electrical contacts of a DUT. A portion of each of the cantilever probes extending outwards from the three-dimensional stepped structure has a moment length, and the moment lengths of the cantilever probes of the different probe pin layers are the same.

Abstract: A probe card device includes a testing circuitry board, a flexible probe needle, a first solder portion, a second solder portion and an interconnected holder electrically connected to the testing circuitry board and the flexible probe needle in which one end of the interconnected holder is coupled to the flexible probe needle with the first solder portion, and the other end of the interconnected holder is coupled to a conductive pad of the testing circuitry board with the second solder portion. A first desoldering melting point of the first solder portion is higher than a second desoldering melting point of the second solder portion.

Abstract: An embodiment of the present disclosure provides a damping component. The damping component includes a housing, at least one sliding piece, a fluid, and at least one damping elastomer. The housing may have at least one opening. The sliding piece slidably seals the opening, and partially protrudes outside the opening, to form an accommodation space within the housing. The fluid can fill up the accommodation space. The damping elastomer can be disposed inside the accommodation space.

Abstract: A damping component includes a housing, at least one sliding piece, a fluid, and at least one damping elastomer. The housing may have at least one opening. The sliding piece is slidably sealed the opening, and partially protruded outside the opening, to form an accommodation space within the housing. The fluid can fill up the accommodation space. The damping elastomer can be disposed inside the accommodation space.

Abstract: A probe connector includes a probe body, a flexible sleeve body, a slit and a conductive fluid. The flexible sleeve body is connected to the probe body. The conductive fluid is received in the flexible sleeve body and electrically connected to the slit and the probe body. The slit is formed on one end of the flexible sleeve body opposite to the probe body, so as to define petal portions which are configured to be tightly closed together. When the slit is pressed to separate the petal portions, a portion of the conductive fluid seeps up from the flexible sleeve body via the slit.

Abstract: A probe card device includes a testing circuitry board, a flexible probe needle, a first solder portion, a second solder portion and an interconnected holder electrically connected to the testing circuitry board and the flexible probe needle in which one end of the interconnected holder is coupled to the flexible probe needle with the first solder portion, and the other end of the interconnected holder is coupled to a conductive pad of the testing circuitry board with the second solder portion. A first desoldering melting point of the first solder portion is higher than a second desoldering melting point of the second solder portion.

Abstract: A probe card includes a circuit board, a plurality of probes, and at least one deviation-compensating member. An end of each of the probes is connected to the circuit board. The deviation-compensating member is fixed to the circuit board and connected to the probes. The probes have a first thermal expansion characteristic, the deviation-compensating member has a second thermal expansion characteristic, and the first thermal expansion characteristic and the second thermal expansion characteristic are different.

Abstract: A testing apparatus includes a substrate and a testing unit. The testing unit includes a testing pin, in which the testing pin is strip-shaped and has a connecting portion, a first end, and a second end. The first end and the second end of the testing pin are opposite to each other. The first end and the second end are connected to the substrate. The connecting portion is located between the first end and the second end, and the connecting portion protrudes from the substrate to become arc-shaped.

Abstract: A circuit probing system and a circuit probing device thereof are provided. The circuit probing device includes a probe card and a protective lid. The probe card is provided with a pin area, a bore hole and a first magnetic attraction member disposed in the bore hole. The protective lid is provided with a second magnetic attraction member. When the protective lid covers the probe pin area, and the second magnetic attraction member inserts into the bore hole, the protective lid is fixed on the probe card as the first magnetic attraction member and the second magnetic attraction member magnetically attract with each other.

Abstract: A probe card includes a circuit board, a plurality of probes, and at least one deviation-compensating member. An end of each of the probes is connected to the circuit board. The deviation-compensating member is fixed to the circuit board and connected to the probes. The probes have a first thermal expansion characteristic, the deviation-compensating member has a second thermal expansion characteristic, and the first thermal expansion characteristic and the second thermal expansion characteristic are different.

Abstract: A burn-in socket for carrying an electronic device to let the electronic device electrically connect to a circuit board via the burn-in socket is provided. The electronic device has a body and at least a lead. The burn-in socket comprises a frame and a carrier, the frame has an opening and a plurality of first aligning potions, wherein the opening fits onto the contour of the body, and the first aligning portions surrounds the opening. The carrier has a plurality of second aligning portions. The frame is assembled to the carrier with the conjunction of the first aligning portions and the second aligning portions. The body is capable of fitting into the opening to let the lead electrically connect to the circuit board via the carrier.