Patents by Inventor Yu-Nien Huang

Yu-Nien Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20050274497
    Abstract: A dissipation module has a dissipation fin module and a centrifugal fan. The centrifugal fan outputs airflow towards the dissipation fin module to remove the heat from it. The centrifugal fan includes a centrifugal impeller mounted on a motor. An outer housing houses the motor and the centrifugal impeller. Convex members or concave portions are formed on an inner wall of the housing outlet so as to reduce noise. The dissipation fin module includes a fin set closely attached to a heat source, as well as an airflow channel housing. Convex members or concave portions are also formed on an inner wall of the airflow channel for reducing noise.
    Type: Application
    Filed: February 11, 2005
    Publication date: December 15, 2005
    Inventors: Yu-Nien Huang, Tsan-Nan Chien, Cheng-Yu Wang, Shun-Ta Yu
  • Publication number: 20050263268
    Abstract: A dissipation device has a dissipation fin set and a centrifugal fan. The centrifugal fan outputs airflow toward the dissipation fin set to remove the heat from it. The centrifugal fan includes a centrifugal impeller mounted on a motor. An outer housing houses the motor and the centrifugal impeller. An inner wall of the housing's outlet has hair structure to reduce noise. The dissipation fin set includes a fin structure closely attached to a heat source, as well as an airflow channel housing. The airflow channel also includes a hair structure for reducing noise.
    Type: Application
    Filed: January 14, 2005
    Publication date: December 1, 2005
    Inventors: Ping-Sheng Kao, Yu-Nien Huang, Tsan-Nan Chien, Yu Liu
  • Publication number: 20050259398
    Abstract: An extended fin array has a main heat-dissipation module and an extended heat-dissipation module. The main heat-dissipation module and the extended heat-dissipation module are stacked to increase the effective convective area to increase the heat-dissipation effect. The extended heat-dissipation module is in the main heat-dissipation module when the heat amount generated by an electronic device is normal. The extended heat-dissipation module extends out from the main heat-dissipation module to increase the heat convection area when the heat amount generated by the electronic device is large.
    Type: Application
    Filed: January 31, 2005
    Publication date: November 24, 2005
    Inventors: Dennis Liu, Tsan-Nan Chien, Yu-Nien Huang, Shun-Ta Yu, Cheng-Yu Wang
  • Publication number: 20050214114
    Abstract: A centrifugal fan is described. The centrifugal fan is suitable for a portable electrical apparatus. A tongue shape is formed from a volute sidewall of a casing of the centrifugal fan and non-parallel to a rotational axis of blades. Therefore, when the blades rotate to generate a wake flow to blow on a surface of the volute sidewall at the tongue shape, noise generated by the centrifugal fan can be decreased.
    Type: Application
    Filed: January 28, 2005
    Publication date: September 29, 2005
    Inventors: Yu-Nien Huang, Cheng-Yu Wang, Shun-Ta Yu
  • Publication number: 20050190538
    Abstract: A heat-dissipating structure. The heat-dissipating structure comprises a plurality of first and second conductive plates. Each first conductive plate has a first base surface, a first reference surface and a first disturbing portion disposed on the first base surface and the first reference surface, and each second conductive plate has a second base surface, a second reference surface and a second disturbing portion disposed on the second base surface and the second reference surface. A middle passage, formed between two adjacent first and second conductive plates by facing the second base surface of the second conductive plate to the first reference surface of the first conductive plate, provides airflow passing therethrough with uniform flow resistance.
    Type: Application
    Filed: December 10, 2004
    Publication date: September 1, 2005
    Inventor: Yu-Nien Huang
  • Publication number: 20050147498
    Abstract: A heat-dissipating module, a fan structure and an impeller. The heat-dissipating module comprises a fan structure providing the impeller to expel heat from a heat source. The impeller comprises a main body and a plurality of blade units. The main body has abase surface, and the blade units extending from the base surface of the main body. Each blade unit comprises a blade surface and a plurality of guiding portions disposed on the blade surface. The pattern of the guiding portions can be linear, curved, parallel or symmetrical, indented on or protruded from the blade units.
    Type: Application
    Filed: September 1, 2004
    Publication date: July 7, 2005
    Inventors: Tsan-Nan Chien, Yu Liu, Yu-Nien Huang
  • Publication number: 20050067152
    Abstract: A heat dissipation device is described. The heat dissipation device is suitable for electrical equipment, and particularly for a notebook computer. The heat dissipation device has a cooling fan and a plurality of heat dissipation fins. The heat dissipation fins are disposed at an outlet of the cooling fan to exhaust heat on the heat dissipation fins with airflow generated by the cooling fan. Each of spaces between the adjacent heat dissipation fins is determined so as to make the airflow velocity uniform. A preferred predetermined space is about C1×1/(V2?1), where V is an original airflow velocity at the adjacent heat dissipation fins and C1 is a coefficient.
    Type: Application
    Filed: September 10, 2004
    Publication date: March 31, 2005
    Inventors: Yu-Nien Huang, Yu Liu
  • Publication number: 20050039889
    Abstract: A phase transformation heat dissipation apparatus is described. The apparatus has a heat exchange device, a gaseous fluid transmission tube, a heat exchange chamber, a storage container and a liquid fluid transmission tube. The heat exchange device couples to a heat source to dissipate heat generated by the heat source with a fluid during a phase transformation thereof. A gaseous fluid is transferred to the heat exchange chamber by way of the gaseous fluid transmission tube and is condensed back into liquid fluid. The liquid fluid drops into the storage container and is utilized to remove the heat generated by the heat source again. The apparatus further has a capillary structure to provide the liquid fluid for the heat exchange device and furthermore has flexible tubes to connect the heat exchange chamber disposed in a liquid crystal display to the heat exchange device disposed in a notebook computer base.
    Type: Application
    Filed: July 15, 2004
    Publication date: February 24, 2005
    Inventor: Yu-Nien Huang