Abstract: The present disclosure describes a cooling chassis for a cooling system of a computer system. The cooling chassis includes a housing configured to allow air to pass through in a housing air flow direction. A first radiator is within the housing. The first radiator is oriented at a first oblique angle relative to the housing air flow direction. A first fan is configured to direct air through the first radiator in a first fan air flow direction oblique to the housing air flow direction.

Abstract: An apparatus is provided. The apparatus includes a plurality of flow guiding structures spatially aligned in a first row, each of the plurality of flow guiding structures comprising a fin-shape to funnel airflow at a trailing edge of each of the plurality of flow guiding structures. The apparatus also includes a plurality of flow separating structures spatially aligned in a second row interleaved between each of the plurality of flow guiding structures, each of the plurality of flow separating structures comprising a fin-shape configured to split airflow received from the plurality of flow guiding structures.

Abstract: An anti-acoustics streamline apparatus is provided. The apparatus includes an air impedance wall having a front face, a rear face, and a plurality of openings extending from the front face to the rear face defining open areas; and a plurality of flow separating structures disposed adjacent to the front face, each of the plurality of flow separating structure extending vertically along the front face of the wall. The openings are configured to define first wall regions in the air impedance wall adjacent to each of the plurality of flow separating structures and second wall regions between the first wall regions. A first ratio of the open areas in the first wall regions to a total area in first wall regions is less than a second ratio of the open areas in the second wall regions to a total area in the second wall regions.

Abstract: A chassis having embedded air jets for cooling a computer device is disclosed. The chassis includes a pair of side walls defining a front end and a rear end. The chassis includes a bottom plate for mounting an electronic component. Ducts are supported by each of the side walls. The ducts include a front opening and a rear opening. Two static fans are coupled to the rear openings of the ducts. A nozzle frame is located at the front end of the chassis. The nozzle frame includes a lateral nozzle bar emitting an air jet generated from the front openings of the ducts.

Abstract: A cooling fan assembly is provided which includes a fan housing and an axial fan. The fan housing has a shroud panel with cutout portions along the airflow path of the axial fan. Fixed members separate the cutout portions. Flap members are attached to the fixed members so that the flap members can pivot between an open position and a closed position. The flap members are pushed by airflow from the axial fan into an open position when the fan is operational. When the fan is non-operational or when air begins to enter the fan in the reverse direction of the axial fan's airflow path, the flap members are configured to move to a closed position. In the closed position, air cannot flow through the reverse direction of the axial fan's airflow path.

Abstract: A heat transfer system between a heat source and a heat sink, wherein the heat transfer contact surfaces comprise a metal which forms numerous voids when placed adjacent one another. A thermal pad comprising a polymer filled with ceramic particles is placed between these heat transfer surfaces to intimately contact each of the metal surfaces without void formation, thereby increasing thermal conductivity. The heat source and heat sink are joined by relative sliding motion. This sliding motion might damage the thermal pad. Thus, a hot swap structure is provided for controlling the movement of the thermal pad into contact with the heat source as the sliding motion is completed.

Abstract: A chassis having embedded air jets for cooling a computer device is disclosed. The chassis includes a pair of side walls defining a front end and a rear end. The chassis includes a bottom plate for mounting an electronic component. Ducts are supported by each of the side walls. The ducts include a front opening and a rear opening. Two static fans are coupled to the rear openings of the ducts. A nozzle frame is located at the front end of the chassis. The nozzle frame includes a lateral nozzle bar emitting an air jet generated from the front openings of the ducts.

Abstract: A chassis is provided to improve the airflow over a plurality of disk drives. The chassis includes a housing with a front portion and a rear portion connected by a base portion. The base portion includes a plurality of hard drive slots oriented in a plurality of rows along a leading edge of the base portion. The chassis also includes a fan module configured to pass air from the front position of the housing to the rear position of the house. The plurality of hard drive slots is oriented such that a first portion of the hard drive slots is inclined relative to the leading edge of the base portion.

Abstract: This disclosure relates to connecting a metal hose between a radiator and a cold plate that cools a CPU, or similar electronic heat generating component, whereby the metal hose is connected to the radiator with silicon casings. Waterproof spray plates are also provided to direct any water spray away from the electronic components. A water tray beneath the waterproof spray plates collects any water and directs it to a location outside the chassis.

Abstract: A fan assembly is disclosed to prevent reverse air flow when the fan stops working. The assembly has a fan module including an intake end, a motor casing and a motor propelling a fan. A louver module has a plurality of slats having an open position to allow air flow and a closed position to block air flow. The louver module is coupled to the motor casing to provide a seal between the louver module and the motor casing.

Abstract: A heat dissipating apparatus for cooling a transceiver is provided. The apparatus includes a cooling jacket configured to receive the transceiver. The transceiver is secured within the cooling jacket via a connecting structure. The apparatus also includes cooling devices secured to an exterior surface of the cooling jacket, the plurality of cooling devices comprising a highly thermal conductivity material. The apparatus also includes a heat dissipation device connected to a distal end of each of the plurality of cooling devices.

Abstract: An air duct that can be attached to existing grille of an electronic device to improve airflow and reduce overall system impedance/pressure drop without increasing the power to an air mover. The air duct has a wall configuration to smooth-out airflow while simultaneously delivering more airflow to selected portions of the interior of an electronic device, such as a server.

Abstract: A cooling system for providing streamlined airflow is provided. The system includes a fan assembly that includes an inlet side and an outlet side. The fan assembly also includes an inlet fan guard connector located at the inlet side of the fan assembly and an outlet fan guard connector located at the outlet side of the fan assembly. The fan assembly also includes a lever housings located between the inlet fan guard connector and the outlet fan guard connector and a slots oriented between the lever housings and the inlet fan guard connector and the outlet fan guard connector, the plurality of slots configured to secure an additional modular component.

Abstract: An apparatus is provided that includes a first distal end and a second distal end. The apparatus also includes a first connecting member located at the first distal end and a second connecting member located at the second distal end. The apparatus also includes at least one bracket secured within the apparatus at the first and second connecting members. The bracket includes a flow guiding depressions and micro pores. The apparatus also includes a plate configured to abut the bracket within the apparatus. The first and second connecting members are configured to connect the apparatus within a server device.

Abstract: A transceiver cage and heat sink assembly for an optical switch is disclosed. A transceiver cage has an open front end to receive an optical transceiver and an opposite rear end. A front heat sink is mounted over the transceiver cage that includes a thermal interface material to contact a contact surface of an optical transceiver. A printed circuit board has a connector electronic circuit to receive a connector on the optical transceiver. A rear heat sink has a beveled surface facing the rear end of the transceiver cage. A cam structure in the front heat sink forces the transceiver into contact with the front heat sink. A metal foil layer is coated on the thermal interface material.

Abstract: A streamlined air baffle for efficiently directing air flow from a fan unit to a heat sink is disclosed. The streamlined air baffle has a top cover plate and a pair of side walls. The side walls are connected to the top cover plate. The top cover plate and one end of the side walls define an inlet. A curved surface of the top cover plate defines the outlet with the opposite ends of the side walls. The cross section area of the outlet is smaller than the cross section area of the inlet.

Abstract: A coolant gas, multi-filter filtering unit, for use with servers and other electrical equipment that can be utilized as a retrofit device for existing servers or provided as OEM equipment with the server is described. A series of static centrifugal force filtering units are position upstream of a replaceable surface filter. The surface filter can be a HEPA filter, or alternatively include an absorbent layer or separate third filter of charcoal to remove VOCs.

Abstract: A cooling system for providing streamlined airflow is provided. The system includes a fan with a plurality of fan blades configured to rotate in a fan direction. The system also includes a shroud component abutting the fan upstream. The shroud component includes a plurality of blade farings, a spinner faring, and optionally a strut interconnecting each of the plurality of blade farings.

Abstract: A transceiver cage and heat sink assembly for an optical switch is disclosed. A transceiver cage has an open front end to receive an optical transceiver and an opposite rear end. A front heat sink is mounted over the transceiver cage that includes a thermal interface material to contact a contact surface of an optical transceiver. A printed circuit board has a connector electronic circuit to receive a connector on the optical transceiver. A rear heat sink has a beveled surface facing the rear end of the transceiver cage. A cam structure in the front heat sink forces the transceiver into contact with the front heat sink. A metal foil layer is coated on the thermal interface material.

Abstract: A faceplate of an apparatus is provided. The faceplate includes a top panel and a front panel. The top panel includes a portion angled towards a front side of the faceplate. The angled portion includes an obtuse angle. The front panel disposed on the front side of the faceplate includes a first face and a second face angled towards the front side of the faceplate. The first face and the second face both include a plurality of holes. The angled portion of the top panel, the angled first face, and the angled second face facilitate an intake/outlet area for air flow across the front side of the front side of the face plate into the plurality of holes.