Abstract: A streamlined air baffle for efficiently directing air flow from a fan unit to a heat sink is disclosed. The streamlined air baffle has a top cover plate and a pair of side walls. The side walls are connected to the top cover plate. The top cover plate and one end of the side walls define an inlet. A curved surface of the top cover plate defines the outlet with the opposite ends of the side walls. The cross section area of the outlet is smaller than the cross section area of the inlet.

Abstract: A fan arrangement to generate increased airflow in a chassis is disclosed. The chassis includes one area having electronic components. A first row of fan modules is located in the chassis relative to the electronic components to generate airflow in a direction of the length of the chassis through the electronic components. The first row of fan modules includes at least one gap between the fan modules. A second row of fan modules is located a predetermined distance from the first row. The second row of fan modules includes at least one gap between the fan modules. Each of the fan modules in the second row is staggered from one of the fan modules of the first row. A first panel connects one of fan modules in the first row with one of the fan modules of the second row to create a channel.

Abstract: A cold plate assembly for cooling heat-generating electrical component on a circuit board is disclosed. The cold plate assembly includes a cold plate with a bottom contact surface to thermally contact the heat-generating electrical component. The cold plate has an inlet coupler on an opposite top surface to receive coolant; an internal conduit to circulate the received coolant; and an outlet coupler on the opposite top surface to return the coolant. A flexible metal inlet tube is fluidly connected to the inlet coupler to supply coolant. A flexible metal outlet tube is fluidly connected to the outlet coupler to return coolant.

Abstract: An equipment assembly for cooling heat-generating electrical components is disclosed. The assembly includes a housing for containing a heat-generating electrical component. The housing includes an open end having a planar area. A closed-loop liquid cooling system includes a liquid coolant conduit in proximity to the heat-generating electrical component. The conduit allows circulation of a liquid coolant to extract heat from the heat-generating electrical component. A heat exchanger is fluidly coupled to the liquid coolant conduit to extract heat from circulated liquid coolant within the heat exchanger. The heat exchanger includes a shaped front facing the open end of the housing. The surface area of the shaped front is greater than the planar area of the open end. An air flow system propels ambient air through the shaped front of the heat exchanger.

Abstract: A cooling unit having two single piece cold plate pipe components is disclosed. The cooling unit has a first pipe operable to transport coolant. A first cold plate has a top surface with a lateral groove to accept a section of the first pipe. The groove includes a first inlet coupled to a first hole in the section of the first pipe. The groove has a first outlet coupled to a second hole in the section of the first pipe. Coolant is circulated from the first inlet through the cold plate to the first outlet. The section of the first pipe is connected to the first cold plate. A second pipe is operable to transport coolant. A second cold plate is located next to the first cold plate. The second cold plate has a groove to accept a section of the second pipe. The groove includes an inlet coupled to a first hole in the section of the second pipe. The groove includes an outlet coupled to a second hole in the section of the second pipe.

Abstract: A cold plate assembly for cooling heat-generating electrical component on a circuit board is disclosed. The cold plate assembly includes a cold plate with a bottom contact surface to thermally contact the heat-generating electrical component. The cold plate has an inlet coupler on an opposite top surface to receive coolant; an internal conduit to circulate the received coolant; and an outlet coupler on the opposite top surface to return the coolant. A flexible metal inlet tube is fluidly connected to the inlet coupler to supply coolant. A flexible metal outlet tube is fluidly connected to the outlet coupler to return coolant.

Abstract: An immersion liquid cooling tank rack for heat-generating components includes immersion liquid cooling tanks for containing a coolant liquid. Horizontal extendable slide rails are mounted on opposing side faces of each tank and on opposing side walls of the rack. The horizontal extendable slide rails are movable between a closed position and an extended open position to allow the tanks to slide horizontally in and out of the rack. Support structures are mounted to the base of each of the immersion liquid cooling tanks. Each support structure includes a wheel assembly disposed at the base of the support structure. The support structures extend from the base of the tank to a floor surface supporting the rack. The horizontal extendable slide rails and the support structures substantially support an operational immersion liquid cooling tank during a horizontal translation of the tank between the closed position and the extended open position.

Abstract: A cold plate base is provided. The cold plate includes a fluid intake region located at a distal end of the cold plate, and a fluid outtake region located at a proximal end of the cold plate that is opposite the distal end. The cold plate also includes a fin region positioned between the fluid intake region and the fluid outtake region. The fin region extends from a base surface of the cold plate base. The cold plate also includes a plurality of protrusions at the fluid intake region. Each of the plurality of protrusions radiates from the fluid intake region to create flow paths across the fin region.

Abstract: A server includes an inner housing disposed within an outer housing such that a channel is defined between them. The inner housing includes a low-power electronic component and a high-power electronic component, and is sealed to protect the components. A first heat sink extends through the inner housing. Heat generated by the low-power electronic component is transferred through an inner portion of the first heat sink to an outer portion of the first heat sink. A second heat sink disposed in the channel is coupled to the high-power electronic component via heat pipes that extend through the inner housing. Heat generated by the high-power electronic component is transferred through the heat pipes to the second heat sink. A fan positioned in the channel causes air to enter the channel through a first vent, flow through the channel, and exit the channel via a second vent to remove the generated heat.

Abstract: A heat sink having a flexible heat sink base is disclosed in order to flex the heat sink into contact with concave heat sources. Flexibility is achieved by providing a series of concentric grooves on the heat sink base on a surface opposite the surface contacting the heat source. A central cylinder is provided at the center of the concentric grooves. A biasing device, such as a spring, exerts a force on the central cylinder to flex the heat sink base.

Abstract: The present disclosure describes an intake system for a fan module within a computer system. The intake system includes a cowling positioned in line with an intake path of the fan module. The cowling is configured to direct air into the fan module. The system further includes a remote intake that has a remote inlet, a remote outlet, and a remote conduit. The remote inlet is configured to intake air from around an element that is within the computer system and outside of the intake path of the fan module. The remote outlet is configured to discharge the air from the remote inlet into the intake path of the fan module. The remote conduit is configured to transport the air from the remote inlet to the remote outlet.

Abstract: An apparatus for cooling an electronic component is provided. The apparatus includes a heat-absorbing base configured to contact the electronic component within a server device and a heat-dissipating body connected to the heat-absorbing base. The heat-dissipating body includes a heat-dissipating static feature and at least one heat-dissipating dynamic feature. The at least one heat-dissipating dynamic feature is configured to be repositioned about the heat-dissipating static feature to increase a surface area of the heat-dissipating body. Using hinge device and flexible metal conduit connect and transfer heat to them (dynamic and static feature). This apparatus will follow currently assembly process and also not impact the other device assembly method. The more space we have inside the product the more heat we can solve.

Abstract: A dynamic air impedance mechanism is provided which has particular utility in changing the impedance of air flow within servers. The mechanism comprises an air duct having a plurality of vent holes, a control plate defining a plurality of openings, and relative movement between the openings in the control plate and the corresponding vent holes in the air duct to change the impedance of air flow through the server.

Abstract: A cold plate base is provided. The cold plate includes a fluid intake region located at a distal end of the cold plate, and a fluid outtake region located at a proximal end of the cold plate that is opposite the distal end. The cold plate also includes a fin region positioned between the fluid intake region and the fluid outtake region. The fin region extends from a base surface of the cold plate base. The cold plate also includes a plurality of protrusions at the fluid intake region. Each of the plurality of protrusions radiates from the fluid intake region to create flow paths across the fin region.

Abstract: This disclosure relates to connecting a metal hose between a radiator and a cold plate that cools a CPU, or similar electronic heat generating component, whereby the metal hose is connected to the radiator with silicon casings. Waterproof spray plates are also provided to direct any water spray away from the electronic components. A water tray beneath the waterproof spray plates collects any water and directs it to a location outside the chassis.

Abstract: A coolant gas, multi-filter filtering unit, for use with servers and other electrical equipment that can be utilized as a retrofit device for existing servers or provided as OEM equipment with the server is described. A series of static centrifugal force filtering units are position upstream of a replaceable surface filter. The surface filter can be a HEPA filter, or alternatively include an absorbent layer or separate third filter of charcoal to remove VOCs.

Abstract: A cooling system for providing streamlined airflow is provided. The system includes a fan assembly that includes an inlet side and an outlet side. The fan assembly also includes an inlet fan guard connector located at the inlet side of the fan assembly and an outlet fan guard connector located at the outlet side of the fan assembly. The fan assembly also includes a lever housings located between the inlet fan guard connector and the outlet fan guard connector and a slots oriented between the lever housings and the inlet fan guard connector and the outlet fan guard connector, the plurality of slots configured to secure an additional modular component.

Abstract: A heat transfer system between a heat source and a heat sink, wherein the heat transfer contact surfaces comprise a metal which forms numerous voids when placed adjacent one another. A thermal pad comprising a polymer filled with ceramic particles is placed between these heat transfer surfaces to intimately contact each of the metal surfaces without void formation, thereby increasing thermal conductivity. The heat source and heat sink are joined by relative sliding motion. This sliding motion might damage the thermal pad. Thus, a hot swap structure is provided for controlling the movement of the thermal pad into contact with the heat source as the sliding motion is completed.

Abstract: A method of maintaining a server rack within a predetermined temperature range, including the removal of heat from the server rack by both conductive and convective heat transfer. Thermal contact structure is placed between the server rack and a heat sink. The heat sink may be in the form of a housing containing a radiator in one wall, and a bank of fans in an opposite wall to draw a coolant gas through the radiator. The coolant gas contacts the heat sink and a portion of the coolant gas is directed towards the server rack. Cooling liquid is supplied to the radiator by a chiller, which can be adjacent to the heat sink or located remotely from the heat sink.

Abstract: A server includes an inner housing disposed within an outer housing such that a channel is defined between them. The inner housing includes a low-power electronic component and a high-power electronic component, and is sealed to protect the components. A first heat sink extends through the inner housing. Heat generated by the low-power electronic component is transferred through an inner portion of the first heat sink to an outer portion of the first heat sink. A second heat sink disposed in the channel is coupled to the high-power electronic component via heat pipes that extend through the inner housing. Heat generated by the high-power electronic component is transferred through the heat pipes to the second heat sink. A fan positioned in the channel causes air to enter the channel through a first vent, flow through the channel, and exit the channel via a second vent to remove the generated heat.