Abstract: An integrated circuit (IC) package structure includes a chip, a redistribution layer (RDL) structure, a molding compound structure and an electromagnetic interference (EMI) shielding structure. The RDL structure is formed on the chip and electrically connected thereto. The molding compound layer is provided on outer surfaces of the chip and the RDL structure. The EMI shielding structure is provided on outer surfaces of the molding compound structure. The molding compound structure layer provided on outer surfaces of the chip and the RDL structure provide protection and reinforcement to multiple faces of the IC package structure; and the EMI shielding structure provided on outer surfaces of the molding compound structure provides EMI protection to multiple faces of the chip and the RDL structure.

Abstract: A pluggable optical channel monitor is adapted to be plugged into a control system, and includes an outer casing, an optical signal transmission device, an optical signal monitoring device, and a push-pull device. The optical signal transmission device is disposed in the outer casing and is adapted for receiving an optical signal. The optical signal monitoring device is disposed in the outer casing and is connected to the optical signal transmission device for monitoring the optical signal. The push-pull device is mounted to the outer casing, protrudes outwardly of the outer casing, is operable to push the outer casing such that the pluggable optical channel monitor is plugged into the control system, and is operable to pull the outer casing such that the pluggable optical channel monitor is unplugged from the control system.

Abstract: An electronic device includes a casing, an antenna, and a connector. The casing includes a metal layer and a first slot and a second slot located on the metal layer. The metal layer includes a metal connecting segment, a first region, and a second region. The metal connecting segment is located between the first slot and the second slot, and the first region and the second region are separated by the first slot, the second slot, and the metal connecting segment. The antenna is connected to the first region, and the antenna is adapted to resonate at a frequency band. The connector is connected to the second region.

Abstract: A method of building an abnormality quantifier comprising: generating at least one selected first dataset comprising measurements of a normal population or sample and at least one second selected dataset comprising measurements of an abnormal population or sample; generating an image or map by imagizing the datasets; identifying a normality zone within the image or map using the first dataset; identifying an abnormality zone within the image or map using the second dataset; determining a definition of abnormality based on a comparison of the normality zone and the abnormality zone; receiving or accessing at least one third dataset comprising measurements of a both known normal and abnormal population or sample; testing the performance of the initially defined abnormality against one or more preset performance criteria; and outputting an abnormality quantifier when optimal performance has been reached.

Abstract: A system and method for classifying a structure or material in an image of a subject. The system comprises: a segmenter configured to segment an image into one or more segmentations that correspond to respective structures or materials in the image, and to generate from the segmentations one or more segmentation maps of the image (each of the segmentation maps representing the image) including categorizations of pixels or voxels of the segmentation maps assigned from one or more respective predefined sets of categories; a classifier that implements a classification machine learning model configured to generate, based on the segmentations maps, one or more classifications and to assign to the classifications respective scores indicative of a likelihood that the structure or material, or the subject, falls into the respective classifications; and an output for outputting a result indicative of the classifications and scores.

Abstract: A method includes following steps. First transistors are formed over a substrate. An interconnect structure is formed over the plurality of first transistors. A dielectric layer is formed over the interconnect structure. 2D semiconductor seeds are formed over the dielectric layer. The 2D semiconductor seeds are annealed. An epitaxy process is performed to laterally grow a plurality of 2D semiconductor films respectively from the plurality of 2D semiconductor seeds. Second transistors are formed on the plurality of 2D semiconductor films.

Abstract: The present invention discloses a double-crosslinked thermal phase transition gel temporary plugging agent and an application thereof, and relates to the technical field of oil and gas field development. The gel temporary plugging agent comprises the following components in percentage by weight: 5.8-18.3% of acrylic acid, 2.8-6.5% of 2-acrylamide-2-methylpropanesulfonic acid, 2.8-7.0% of hydroxyethyl acrylate, 0.2-1.0% of a degradable crosslinking agent, 0.4-1.2% of borax or boric acid, 0.2-0.8% of a high-temperature initiator, 2.6-4.5% of palygorskite attapulgite, 1.5-3.1% of a urea-formaldehyde resin, and the balance of water, wherein the gel temporary plugging agent is formed by underground gelation. The gel temporary plugging agent is applied to oil and gas reservoirs with a temperature of 100-150° C., can automatically be subjected to gelation and degradation, and has a low filtration loss before gelation.

Abstract: An electronic package module including a circuit substrate, an electronic component disposed on the circuit substrate and a molding compound is provided. The molding compound encapsulates the circuit substrate and the electronic component. The circuit substrate includes a first circuit layer and a first insulation layer covering on the first circuit layer. The first insulation layer has a boundary surface where a second circuit layer is disposed. A second insulation layer covers a part of the second circuit layer while the insulation layer bares a region surrounding the perimeter of the boundary surface. The molding compound directly contacts the region and the second insulation layer.

Abstract: A circuit board structure includes a carrier, a thin film redistribution layer disposed on the carrier, solder balls electrically connected to the thin film redistribution layer and the carrier, and a surface treatment layer. The thin film redistribution layer includes a first dielectric layer, pads, a first metal layer, a second dielectric layer, a second metal layer, and a third dielectric layer. A top surface of the first dielectric layer is higher than an upper surface of each pad. The first metal layer is disposed on a first surface of the first dielectric layer. The second dielectric layer has second openings exposing part of the first metal layer. The second metal layer extends into the second openings and is electrically connected to the first metal layer. The third dielectric layer has third openings exposing part of the second metal layer. The surface treatment layer is disposed on the upper surfaces.

Abstract: A method includes following steps. A dielectric layer is formed over a substrate. A transition metal-containing layer is deposited on the dielectric layer. The transition metal-containing layer is patterned into a plurality of transition metal-containing pieces. The transition metal-containing pieces are sulfurized or selenized to form a plurality of semiconductor seeds. Semiconductor films are grown from semiconductor seeds. Transistors are formed on the semiconductor films.

Abstract: Apparatuses and methods for pipelining memory operations with error correction coding are disclosed. A method for pipelining consecutive write mask operations is disclosed wherein a second read operation of a second write mask operation occurs during error correction code calculation of a first write mask operation. The method may further including writing data from the first write mask operation during the error correction code calculation of the second write mask operation. A method for pipelining consecutive operations is disclosed where a first read operation may be cancelled if the first operation is not a write mask operation. An apparatus including a memory having separate global read and write input-output lines is disclosed.

Abstract: This invention describes a packaging structure for roll-type (wound-type) aluminum conductive polymer capacitor element. Two protective substrates are applied to sandwich a roll-type capacitor element in between with an insulating material surrounding the capacitor element also in between the protective substrates. The protective substrates comprise electrically separated anodic conductive pad and cathodic conductive pad on their surfaces. The capacitor element is oriented with its axis perpendicular to the two substrates. The anodic and cathodic leads of the capacitor element pass through the through holes. An anodic external terminal is plated over the anodic conductive pad and a cathodic external terminal is plated over the cathodic conductive pad so that the anodic external terminal is electrically connected to the anodic lead and the cathodic external terminal is electrically connected to the cathodic lead.

Abstract: Disclosed is a power unit used for a swimming pool cleaning machine and the swimming pool cleaning machine. The power unit includes an impeller and a water outlet channel communicated with the impeller. The water outlet channel includes a spiral portion, a linear flowing portion and a water outlet. The inlet of the impeller is communicated with a water, and the outlet of the impeller is communicated with the spiral portion. The linear flowing portion deflects to the outer side of the spiral direction of the spiral portion. A steering stressed portion is formed at the junction of the linear flowing portion and the spiral portion. The steering stressed portion and the spiral portion are respectively located on either sides of the center line of the water outlet. The water outlet direction of the water outlet is opposite to the traveling direction of the swimming pool cleaning machine.

Abstract: A numerical control process design and optimization method based on machining knowledge includes: constructing a machining knowledge data model by taking a machining feature as a carrier, performing ordered integration on various stages of programming, post-processing, cutting simulation, machining process monitoring and inspection, and machining result measurement, determining various storage data types, and storing data in each stage. By means of the numerical control process design and optimization method, data stream during the whole flow of product machining are connected; effective accumulation of knowledge in a full cycle of product machining is realized; a numerical control process basic data model is constructed by means of establishing an association relationship between machining knowledge and a feature of a part.

Abstract: A swimming pool cleaner is provided, which includes a housing, a travelling device and a filter screen, two groups of power components with opposite driving directions are provided inside the water outlet chamber, the power component includes an impeller and a water outlet channel, wherein the water outlet channel includes a spiral portion and a linear flowing portion which are sequentially communicated, the linear flowing portion is connected with the water outlet, and the linear flowing portion deflects to the outer side in the spiral direction of the spiral portion, a steering stressed portion is formed at the junction of the linear flowing portion and the spiral portion, and the water outlet is in communication with an outside of the housing and faces towards a direction that is opposite to the travelling direction of the travelling device.

Abstract: An intelligent detection system includes an image module, a target detection module, and a physical model processing module. The target detection module runs a scanning mode on the target object and controls the image module to capture target images of the target object with different physical properties under the scanning mode. The scanning mode is allowed to be based on luminescence or thermal radiation emitted by variation of time, voltage, current, or illumination. The physical model processing module receives the target images and carries out an image stacking process with each target image based on different physical properties, generating a detection result image through physical formula of electronic circuit in cooperation with a chromaticity coordinate diagram.

Abstract: An image segmentation method system, the system comprising: a training subsystem configured to train a segmentation machine learning model using annotated training data comprising images associated with respective segmentation annotations, so as to generate a trained segmentation machine learning model; a model evaluator; and a segmentation subsystem configured to perform segmentation of a structure or material in an image using the trained segmentation machine learning model. The model evaluator is configured to evaluate the segmentation machine learning model by (i) controlling the segmentation subsystem to segment at least one evaluation image associated with an existing segmentation annotation using the segmentation machine learning model and thereby generate a segmentation of the annotated evaluation image, and (ii) forming a comparison of the segmentation of the annotated evaluation image and the existing segmentation annotation.

Abstract: A sensing device and a manufacturing method thereof are provided. The sensing device includes a substrate, a first electrode layer, a first sensing layer, a first dielectric layer, a second electrode layer, a second sensing layer, a second dielectric layer, and a capping layer. The first electrode layer is disposed on the substrate. The first sensing layer is disposed on the first electrode layer and has a plurality of holes. The first dielectric layer is disposed on the first sensing layer. The second electrode layer is disposed on the first dielectric layer. The second sensing layer is disposed on the second electrode layer. A material of the second sensing layer is different from a material of the first sensing layer. The second dielectric layer is disposed on the second sensing layer. The capping layer is disposed on the substrate.