Abstract: An embodiment of the invention provides a material recognition system. The material recognition system may include a fetching device, at least one sensing device and a processing device. The fetching device may fetch a target object. Each sensing device may include an ultrasound transmitter and an ultrasound receiver. The ultrasound transmitter may transmit an ultrasound emitting signal on the surface of the target object. The ultrasound receiver may receive an ultrasound received signal on the surface of the target object. There is a fixed distance between the ultrasound transmitter and the ultrasound receiver. The processing device may recognize the material of the target object according to the ultrasound emitting signal, the ultrasound received signal, and the fixed distance. In addition, when the fetching device fetches the target object, the ultrasound transmitter and the ultrasound receiver touch the surface of the target object.

Abstract: According to one aspect, a method of classifying packets includes obtaining at least a first packet on a traffic management arrangement, the traffic management arrangement being implemented on a vehicle, the vehicle including a modem arrangement that includes at least a first modem, wherein obtaining the first packet includes obtaining the first packet from a system onboard the vehicle. The method also includes classifying the first packet using the traffic management arrangement to create a first classified packet, identifying a first quality of service (QoS) tier of a plurality of QoS tiers for the first classified packet, providing the first classified packet with information that identifies the first QoS tier, and providing the first classified packet to the modem arrangement for transmission to a network based on the first QoS tier.

Abstract: A method includes following steps. First transistors are formed over a substrate. An interconnect structure is formed over the plurality of first transistors. A dielectric layer is formed over the interconnect structure. 2D semiconductor seeds are formed over the dielectric layer. The 2D semiconductor seeds are annealed. An epitaxy process is performed to laterally grow a plurality of 2D semiconductor films respectively from the plurality of 2D semiconductor seeds. Second transistors are formed on the plurality of 2D semiconductor films.

Abstract: Presented are systems, methods, apparatuses, or computer-readable media for positioning wireless communication devices. A wireless communication device may receive, from a wireless communication node, a configuration of an association between a first positioning reference signal (PRS) at a first frequency hop in a first time and a second PRS at a second frequency hop in a second time. The wireless communication device may communicate, with the wireless communication node, a capability of the wireless communication device to support the association between the first frequency hop and the second frequency hop. A total bandwidth of the first frequency hop and second frequency hop may be larger than a capability of the wireless communication device to support communication at a time.

Abstract: A method includes bonding a first semiconductor die and a second semiconductor die to a substrate, where a gap is disposed between a first sidewall of the first semiconductor die and a second sidewall of the second semiconductor die, performing a plasma treatment to dope top surfaces and sidewalls of each of the first semiconductor die and the second semiconductor die with a first dopant, where a concentration of the first dopant in the first sidewall decreases in a vertical direction from a top surface of the first semiconductor die towards a bottom surface of the first semiconductor die, and a concentration of the first dopant in the second sidewall decreases in a vertical direction from a top surface of the second semiconductor die towards a bottom surface of the second semiconductor die, and filling the gap with a spin-on dielectric material.

Abstract: The present application relates to a monopolar electrode and a bipolar electrode that are used for electrosurgical instruments. The monopolar electrode and the bipolar electrode each include a conductive non-stick coating which is made by doping graphene and/or metal particles in a PTFE (polytetrafluoroethylene) base material. The present application also relates to a preparation method of a composite material forming the conductive non-stick coating. Since PTFE itself can prevent adhesion, the conductivity of PTFE can be improved by doping various conductive materials. After the composite material coating formed thereby covers a metal electrode, it is ensured that the working region and work energy of an electrotome are not reduced, the electrical conductivity of the electrode can be guaranteed, not only the blood coagulation effect of the electrotome is not affected but also the adhesion of the electrode on a tissue can be reduced. Furthermore, the structure is simple, and manufacturing is easy.

Abstract: The patent application discloses a degradable thermoset composite. The composite comprises a reaction product of an epoxy resin, a cross-linker, a catalyst. The epoxy resin mixture may comprise at least one cycloaliphatic epoxide. The reaction product may have a glass transition temperature greater than or equal to 140° C. as measured by DMA.

Abstract: Systems and methods for wireless communication systems are disclosed. In one aspect, the wireless communication method includes determining, by a first wireless communication device, a power and sending, by the first wireless communication device to a second wireless communication device in a sidelink communication, a reference signal with the power. The power is determined based on one or more sidelink parameters related to a priority level associated with the reference signal.

Abstract: The present disclosure provides an electrical connection assembly including a first electrical connector and a second electrical connector. The first electrical connector includes a first terminal. The first terminal includes a contact part. The second electrical connector is configured to pluggably connect with the first electrical connector, and includes a second terminal. The second terminal includes a recess. The recess is inwardly recessed from a surface of the second terminal and includes a connection section and a bottom. The connection section is in connection between the bottom and the surface of the second terminal, and includes a plurality of contact portions. The contact part of the first terminal is in connection with the recess of the second terminal, and the contact part of the first terminal is in contact with the bottom and the contact portions of the recess of the second terminal to form a multi-points contact.

Abstract: The present invention discloses a double-crosslinked thermal phase transition gel temporary plugging agent and an application thereof, and relates to the technical field of oil and gas field development. The gel temporary plugging agent comprises the following components in percentage by weight: 5.8-18.3% of acrylic acid, 2.8-6.5% of 2-acrylamide-2-methylpropanesulfonic acid, 2.8-7.0% of hydroxyethyl acrylate, 0.2-1.0% of a degradable crosslinking agent, 0.4-1.2% of borax or boric acid, 0.2-0.8% of a high-temperature initiator, 2.6-4.5% of palygorskite attapulgite, 1.5-3.1% of a urea-formaldehyde resin, and the balance of water, wherein the gel temporary plugging agent is formed by underground gelation. The gel temporary plugging agent is applied to oil and gas reservoirs with a temperature of 100-150° C., can automatically be subjected to gelation and degradation, and has a low filtration loss before gelation.

Abstract: An electronic package module including a circuit substrate, an electronic component disposed on the circuit substrate and a molding compound is provided. The molding compound encapsulates the circuit substrate and the electronic component. The circuit substrate includes a first circuit layer and a first insulation layer covering on the first circuit layer. The first insulation layer has a boundary surface where a second circuit layer is disposed. A second insulation layer covers a part of the second circuit layer while the insulation layer bares a region surrounding the perimeter of the boundary surface. The molding compound directly contacts the region and the second insulation layer.

Abstract: A circuit board structure includes a carrier, a thin film redistribution layer disposed on the carrier, solder balls electrically connected to the thin film redistribution layer and the carrier, and a surface treatment layer. The thin film redistribution layer includes a first dielectric layer, pads, a first metal layer, a second dielectric layer, a second metal layer, and a third dielectric layer. A top surface of the first dielectric layer is higher than an upper surface of each pad. The first metal layer is disposed on a first surface of the first dielectric layer. The second dielectric layer has second openings exposing part of the first metal layer. The second metal layer extends into the second openings and is electrically connected to the first metal layer. The third dielectric layer has third openings exposing part of the second metal layer. The surface treatment layer is disposed on the upper surfaces.

Abstract: A method includes following steps. A dielectric layer is formed over a substrate. A transition metal-containing layer is deposited on the dielectric layer. The transition metal-containing layer is patterned into a plurality of transition metal-containing pieces. The transition metal-containing pieces are sulfurized or selenized to form a plurality of semiconductor seeds. Semiconductor films are grown from semiconductor seeds. Transistors are formed on the semiconductor films.

Abstract: Apparatuses and methods for pipelining memory operations with error correction coding are disclosed. A method for pipelining consecutive write mask operations is disclosed wherein a second read operation of a second write mask operation occurs during error correction code calculation of a first write mask operation. The method may further including writing data from the first write mask operation during the error correction code calculation of the second write mask operation. A method for pipelining consecutive operations is disclosed where a first read operation may be cancelled if the first operation is not a write mask operation. An apparatus including a memory having separate global read and write input-output lines is disclosed.

Abstract: This invention describes a packaging structure for roll-type (wound-type) aluminum conductive polymer capacitor element. Two protective substrates are applied to sandwich a roll-type capacitor element in between with an insulating material surrounding the capacitor element also in between the protective substrates. The protective substrates comprise electrically separated anodic conductive pad and cathodic conductive pad on their surfaces. The capacitor element is oriented with its axis perpendicular to the two substrates. The anodic and cathodic leads of the capacitor element pass through the through holes. An anodic external terminal is plated over the anodic conductive pad and a cathodic external terminal is plated over the cathodic conductive pad so that the anodic external terminal is electrically connected to the anodic lead and the cathodic external terminal is electrically connected to the cathodic lead.

Abstract: Disclosed is a power unit used for a swimming pool cleaning machine and the swimming pool cleaning machine. The power unit includes an impeller and a water outlet channel communicated with the impeller. The water outlet channel includes a spiral portion, a linear flowing portion and a water outlet. The inlet of the impeller is communicated with a water, and the outlet of the impeller is communicated with the spiral portion. The linear flowing portion deflects to the outer side of the spiral direction of the spiral portion. A steering stressed portion is formed at the junction of the linear flowing portion and the spiral portion. The steering stressed portion and the spiral portion are respectively located on either sides of the center line of the water outlet. The water outlet direction of the water outlet is opposite to the traveling direction of the swimming pool cleaning machine.

Abstract: A numerical control process design and optimization method based on machining knowledge includes: constructing a machining knowledge data model by taking a machining feature as a carrier, performing ordered integration on various stages of programming, post-processing, cutting simulation, machining process monitoring and inspection, and machining result measurement, determining various storage data types, and storing data in each stage. By means of the numerical control process design and optimization method, data stream during the whole flow of product machining are connected; effective accumulation of knowledge in a full cycle of product machining is realized; a numerical control process basic data model is constructed by means of establishing an association relationship between machining knowledge and a feature of a part.

Abstract: A swimming pool cleaner is provided, which includes a housing, a travelling device and a filter screen, two groups of power components with opposite driving directions are provided inside the water outlet chamber, the power component includes an impeller and a water outlet channel, wherein the water outlet channel includes a spiral portion and a linear flowing portion which are sequentially communicated, the linear flowing portion is connected with the water outlet, and the linear flowing portion deflects to the outer side in the spiral direction of the spiral portion, a steering stressed portion is formed at the junction of the linear flowing portion and the spiral portion, and the water outlet is in communication with an outside of the housing and faces towards a direction that is opposite to the travelling direction of the travelling device.