Patents by Inventor Yu-Te Hsieh
Yu-Te Hsieh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12237351Abstract: Implementations of semiconductor packages may include: a substrate having a first side and a second side and a die having an active area on a second side of the die. A first side of the die may be coupled to the second side of the substrate. The semiconductor package may also include a glass lid having a first side and a second side. The glass lid may be coupled over a second side of the die. The semiconductor package may include a first and a second molding compound and one or more cushions positioned between a first side of the glass lid and a portion of the first molding compound. The second molding compound may be coupled to the substrate and the around the die and the glass lid.Type: GrantFiled: June 10, 2021Date of Patent: February 25, 2025Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventor: Yu-Te Hsieh
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Publication number: 20250022898Abstract: According to an aspect, an image sensor package includes a substrate, an image sensor die coupled to the substrate, a light transmitting member, and a plurality of pillar members disposed between and contacting the image sensor die and the light transmitting member. A height of the plurality of pillar members defines a gap height between an active region of the image sensor die and the light transmitting member. The image sensor package including a bonding material that couples the light transmitting member to the image sensor. The bonding material contacts a side of a pillar member, of the plurality of pillar members, that extends between a first end contacting the light transmitting member and a second end contacting the image sensor die.Type: ApplicationFiled: September 30, 2024Publication date: January 16, 2025Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventor: Yu-Te HSIEH
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Publication number: 20240405043Abstract: According to an aspect, an image sensor package includes a substrate, an image sensor die coupled to the substrate, and a transparent member including a first surface and a second surface, where the second surface of the transparent member is coupled to the image sensor die via one or more dam members such that an empty space exists between an active area of the image sensor die and the second surface of the transparent member. The image sensor package includes a light blocking member coupled to or defined by the transparent member.Type: ApplicationFiled: August 9, 2024Publication date: December 5, 2024Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: Yu-Te HSIEH, I-Lin CHU
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Patent number: 12107105Abstract: According to an aspect, an image sensor package includes a substrate, an image sensor die coupled to the substrate, a light transmitting member, and a plurality of pillar members disposed between and contacting the image sensor die and the light transmitting member. A height of the plurality of pillar members defines a gap height between an active region of the image sensor die and the light transmitting member. The image sensor package including a bonding material that couples the light transmitting member to the image sensor. The bonding material contacts a side of a pillar member, of the plurality of pillar members, that extends between a first end contacting the light transmitting member and a second end contacting the image sensor die.Type: GrantFiled: October 16, 2023Date of Patent: October 1, 2024Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventor: Yu-Te Hsieh
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Publication number: 20240304639Abstract: An optical sensor module includes a transparent lid spaced apart from the optical sensor die by a protective dam. The dam can be formed by photosensitive epoxy materials that can be patterned using a photolithography process. The epoxy materials can change between liquid and solid phases during assembly, and then can be fully hardened by curing. The protective dam can be formed as a single layer, or as a multi-layer stack of epoxy materials, in which the layers may have different properties. In some implementations, the epoxy dam acts as a spacer that provides a substantially uniform gap to minimize a tilt angle of the transparent lid with respect to the optical sensor.Type: ApplicationFiled: March 7, 2023Publication date: September 12, 2024Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventor: Yu-Te HSIEH
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Patent number: 12068345Abstract: According to an aspect, an image sensor package includes a substrate, an image sensor die coupled to the substrate, and a transparent member including a first surface and a second surface, where the second surface of the transparent member is coupled to the image sensor die via one or more dam members such that an empty space exists between an active area of the image sensor die and the second surface of the transparent member. The image sensor package includes a light blocking member coupled to or defined by the transparent member.Type: GrantFiled: August 2, 2022Date of Patent: August 20, 2024Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: Yu-Te Hsieh, I-Lin Chu
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Publication number: 20240234456Abstract: In a general aspect, a package includes a semiconductor die including an optical device having an optically active area on a first side of the semiconductor die. The package also includes a glass cover having an antireflective coating disposed on a central portion of a first side of the glass cover. A perimeter portion of the first side of the glass cover excludes the antireflective coating. The package further includes an adhesive resin coupling the perimeter portion of the first side of the glass cover with the first side of the semiconductor die, such that the glass cover is disposed above and spaced from the optically active area.Type: ApplicationFiled: January 11, 2023Publication date: July 11, 2024Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: Yu-Te HSIEH, Yusheng LIN
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Publication number: 20240038805Abstract: According to an aspect, an image sensor package includes a substrate, an image sensor die coupled to the substrate, a light transmitting member, and a plurality of pillar members disposed between and contacting the image sensor die and the light transmitting member. A height of the plurality of pillar members defines a gap height between an active region of the image sensor die and the light transmitting member. The image sensor package including a bonding material that couples the light transmitting member to the image sensor. The bonding material contacts a side of a pillar member, of the plurality of pillar members, that extends between a first end contacting the light transmitting member and a second end contacting the image sensor die.Type: ApplicationFiled: October 16, 2023Publication date: February 1, 2024Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventor: Yu-Te HSIEH
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Patent number: 11869912Abstract: According to an aspect, a method for fabricating an image sensor package to define a gap height includes coupling an image sensor die to a substrate, forming a plurality of pillar members on the image sensor die, dispensing a bonding material on the image sensor die, contacting a transparent member with the bonding material such that a height of the pillar members defines a gap height between an active region of the image sensor die and the transparent member, and curing the bonding material to couple the transparent member to the image sensor die.Type: GrantFiled: October 1, 2020Date of Patent: January 9, 2024Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventor: Yu-Te Hsieh
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Publication number: 20230378209Abstract: Implementations of an image sensor package may include an image sensor die including at least one bond pad thereon; a bond wire wirebonded to the at least one bond pad; and an optically transmissive lid coupled to the image sensor die with an optically opaque film adhesive over the at least one bond pad. The bond wire may extend through the optically opaque film adhesive to the at least one bond pad.Type: ApplicationFiled: May 19, 2022Publication date: November 23, 2023Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: Chee Peng NEO, Yu-Te HSIEH
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Publication number: 20230343806Abstract: A method includes disposing a first die on a first die-receiving surface in a first cavity at a first vertical height in a substrate and disposing a second die on a second die-receiving surface in a second cavity at a second vertical height in the substrate. The second cavity has an open top, and the second vertical height is greater than the first vertical height in the substrate.Type: ApplicationFiled: April 20, 2022Publication date: October 26, 2023Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventor: Yu-Te HSIEH
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Publication number: 20230025520Abstract: According to an aspect, an image sensor package includes a substrate, an image sensor die coupled to the substrate, and a transparent member including a first surface and a second surface, where the second surface of the transparent member is coupled to the image sensor die via one or more dam members such that an empty space exists between an active area of the image sensor die and the second surface of the transparent member. The image sensor package includes a light blocking member coupled to or defined by the transparent member.Type: ApplicationFiled: August 2, 2022Publication date: January 26, 2023Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: Yu-Te HSIEH, I-Lin CHU
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Patent number: 11508776Abstract: An image sensor semiconductor package (package) includes a printed circuit board (PCB) having a first surface and a second surface opposite the first surface. A complementary metal-oxide semiconductor (CMOS) image sensor (CIS) die has a first surface with a photosensitive region and a second surface opposite the first surface of the CIS die. The second surface of the CIS die is coupled with the first surface of the PCB. A transparent cover is coupled over the photosensitive region of the CIS die. An image signal processor (ISP) is embedded within the PCB. One or more electrical couplers electrically couple the CIS die with the PCB. A plurality of electrical contacts on the second surface of the PCB are electrically coupled with the CIS die and with the ISP. The ISP is located between the plurality of electrical contacts of the second surface of the PCB and the CIS die.Type: GrantFiled: April 3, 2019Date of Patent: November 22, 2022Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: Larry Kinsman, Yusheng Lin, Yu-Te Hsieh, Oswald Skeete, Weng-Jin Wu, Chi-Yao Kuo
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Patent number: 11476292Abstract: According to an aspect, a multi-chip packaging structure includes a first substrate having a first surface and a second surface, where the first substrate has a conductive layer portion. The multi-chip packaging structure includes an image sensor device coupled to the first surface of the first substrate, a first device coupled to the second surface of the first substrate, and a second substrate disposed apart from the first substrate, where the second substrate has a conductive layer portion. The conductive layer portion of the first substrate is communicatively connected to the conductive layer portion of the second substrate. The first device is disposed between the first substrate and the second substrate. The multi-chip packaging structure includes a second device coupled to the second substrate, and a third device coupled to the first substrate or the second substrate.Type: GrantFiled: July 6, 2020Date of Patent: October 18, 2022Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventor: Yu-Te Hsieh
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Patent number: 11444111Abstract: According to an aspect, an image sensor package includes a substrate, an image sensor die coupled to the substrate, and a transparent member including a first surface and a second surface, where the second surface of the transparent member is coupled to the image sensor die via one or more dam members such that an empty space exists between an active area of the image sensor die and the second surface of the transparent member. The image sensor package includes a light blocking member coupled to or defined by the transparent member.Type: GrantFiled: July 9, 2019Date of Patent: September 13, 2022Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: Yu-Te Hsieh, I-Lin Chu
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Publication number: 20220223641Abstract: According to an aspect, an image sensor package includes a substrate, an image sensor die coupled to the substrate, at least one conductor connected to the image sensor die and the substrate, and a light-transmitting member including a substrate member, a first leg member extending from a first edge portion of the substrate member, and a second leg member extending from a second edge portion of the substrate member, the first leg member being coupled to the substrate, the second leg member being coupled to the substrate.Type: ApplicationFiled: January 14, 2021Publication date: July 14, 2022Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: Larry Duane KINSMAN, Yu-Te HSIEH
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Publication number: 20220216255Abstract: According to an aspect, an image sensor package includes a substrate, an image sensor die coupled to the substrate, a light-transmitting member, an inner joint member disposed between the light-transmitting member and the image sensor die, and an outer joint member disposed between the light-transmitting member and the substrate.Type: ApplicationFiled: January 7, 2021Publication date: July 7, 2022Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventor: Yu-Te HSIEH
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Publication number: 20220020800Abstract: According to an aspect, a method for fabricating an image sensor package to define a gap height includes coupling an image sensor die to a substrate, forming a plurality of pillar members on the image sensor die, dispensing a bonding material on the image sensor die, contacting a transparent member with the bonding material such that a height of the pillar members defines a gap height between an active region of the image sensor die and the transparent member, and curing the bonding material to couple the transparent member to the image sensor die.Type: ApplicationFiled: October 1, 2020Publication date: January 20, 2022Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventor: Yu-Te HSIEH
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Publication number: 20210305301Abstract: Implementations of semiconductor packages may include: a substrate having a first side and a second side and a die having an active area on a second side of the die. A first side of the die may be coupled to the second side of the substrate. The semiconductor package may also include a glass lid having a first side and a second side. The glass lid may be coupled over a second side of the die. The semiconductor package may include a first and a second molding compound and one or more cushions positioned between a first side of the glass lid and a portion of the first molding compound. The second molding compound may be coupled to the substrate and the around the die and the glass lid.Type: ApplicationFiled: June 10, 2021Publication date: September 30, 2021Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventor: Yu-Te HSIEH
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Patent number: 11037970Abstract: Implementations of semiconductor packages may include: a substrate having a first side and a second side and a die having an active area on a second side of the die. A first side of the die may be coupled to the second side of the substrate. The semiconductor package may also include a glass lid having a first side and a second side. The glass lid may be coupled over a second side of the die. The semiconductor package may include a first and a second molding compound and one or more cushions positioned between a first side of the glass lid and a portion of the first molding compound. The second molding compound may be coupled to the substrate and the around the die and the glass lid.Type: GrantFiled: November 1, 2018Date of Patent: June 15, 2021Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventor: Yu-Te Hsieh