Patents by Inventor Yu Wei Huang

Yu Wei Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230187372
    Abstract: An electronic device includes a via-array substrate, an outer layer, and an alignment substrate. The via-array substrate has a plurality of first vias. The outer layer has a plurality of second vias and is disposed on a side of the via-array substrate. The first vias are greater in distribution density or quantity than the second vias. A part of the first vias is electrically connected to the second vias, and another part of the first vias is electrically floating. The alignment substrate includes a core layer disposed on the outer layer, a plurality of conductive traces, a plurality of interconnecting pads, and a plurality of alignment mark pads. The conductive traces are disposed in the core layer. The interconnecting pads and the alignment mark pads are disposed on a surface of the core layer located away from the outer layer. A part of the conductive traces electrically connects a part of the interconnecting pads and a part of the first vias.
    Type: Application
    Filed: August 11, 2022
    Publication date: June 15, 2023
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Tsung-Yi HUNG, Yu-Wei HUANG
  • Publication number: 20230170288
    Abstract: This disclosure provides a conductive circuit carrier module including a carrier and a conductive circuit film layer. The conductive circuit film layer is disposed on the carrier. The conductive circuit film layer has at least one conductive circuit structure including a vertical wire part and at least four horizontal wire parts. The vertical wire part extends along a thickness direction of the conductive circuit film layer. The at least four horizontal wire parts are connected to one another via the vertical wire part and extend along a direction substantially perpendicular to the vertical wire part. The at least four horizontal wire parts are symmetrically arranged or asymmetrically arranged with respect to the vertical wire part.
    Type: Application
    Filed: March 14, 2022
    Publication date: June 1, 2023
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yu-Wei HUANG, Shau-Fei CHENG
  • Publication number: 20230135103
    Abstract: A leading wire of pull cord of release wheel in a window blind is disclosed. In the beginning that the release wheel reels the pull cord, the winding angle of the pull cord can be defined that the wound reel can be neatly ordered. In a location of winding hub of the release wheel close to an inner spoke side, at least a piercing hole is transfixed along an inscribed tangent. In addition, a winding definer is further disposed in the direction at which the pull cord is spinning out, allowing the direction of an initial reeling coil to be defined in advance, so that the reel can be wound orderly.
    Type: Application
    Filed: December 20, 2021
    Publication date: May 4, 2023
    Inventors: Hsien-Te HUANG, Yu-Wei HUANG
  • Patent number: 11486196
    Abstract: A curtain hanging assembly that consists of a curtain assembly able to effect horizontal opening and closing of curtains, and includes two elastic motor units provided with elastic feedback. Interactive dynamics between the two elastic motor units, through linear linkage, respectively cause torque forces produced to be in mutual opposition, enabling the let down area of the curtains to be naturally fixed at any height position.
    Type: Grant
    Filed: February 8, 2021
    Date of Patent: November 1, 2022
    Inventors: Hsien-Te Huang, Yu-Wei Huang
  • Patent number: 11239141
    Abstract: A lead frame package including first conductive layer, first electronic component, lead frames, second conductive layer and package body. First conductive layer has conductive carriers. First electronic component has first pins. Lead frames and first pins are respectively electrically connected to conductive carriers. Second conductive layer has conductive joints respectively electrically connected to lead frames so as to be electrically connected to at least a part of conductive carriers via lead frames. Package body encapsulates first conductive layer, first electronic component, and lead frames. First conductive layer and second conductive layer are located on two opposite sides of first electronic component, respectively.
    Type: Grant
    Filed: September 24, 2020
    Date of Patent: February 1, 2022
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Ren-Shin Cheng, Shih-Hsien Wu, Yu-Wei Huang, Chih Ming Shen, Yi-Chieh Tsai
  • Publication number: 20220005754
    Abstract: A lead frame package including first conductive layer, first electronic component, lead frames, second conductive layer and package body. First conductive layer has conductive carriers. First electronic component has first pins. Lead frames and first pins are respectively electrically connected to conductive carriers. Second conductive layer has conductive joints respectively electrically connected to lead frames so as to be electrically connected to at least a part of conductive carriers via lead frames. Package body encapsulates first conductive layer, first electronic component, and lead frames. First conductive layer and second conductive layer are located on two opposite sides of first electronic component, respectively.
    Type: Application
    Filed: September 24, 2020
    Publication date: January 6, 2022
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Ren-Shin CHENG, Shih-Hsien WU, Yu-Wei HUANG, Chih Ming SHEN, Yi-Chieh TSAI
  • Publication number: 20210363821
    Abstract: A curtain hanging assembly that consists of a curtain assembly able to effect horizontal opening and closing of curtains, and includes two elastic motor units provided with elastic feedback. Interactive dynamics between the two elastic motor units, through linear linkage, respectively cause torque forces produced to be in mutual opposition, enabling the let down area of the curtains to be naturally fixed at any height position.
    Type: Application
    Filed: February 8, 2021
    Publication date: November 25, 2021
    Inventors: Hsien-Te HUANG, Yu-Wei HUANG
  • Publication number: 20210257279
    Abstract: An electronic device having a substrate includes a substrate and at least one outer layer. The substrate has a plurality of first vias. The outer layer has a plurality of second vias. The outer layer is disposed on a side of the substrate. The first vias have a larger distribution density or quantity than the second vias so that a portion of the first vias are electrically connected to the second vias, and a portion of the first vias are electrically floating.
    Type: Application
    Filed: January 4, 2021
    Publication date: August 19, 2021
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Sheng-Che HUNG, Shih-Hsien WU, Yu-Wei HUANG
  • Patent number: 10593644
    Abstract: An apparatus for assembling devices, comprising a plurality of actuated devices disposed on a substrate, each of the actuated devices comprising a first electrode disposed on and electrically connect to the substrate, a connecting pad disposed on the substrate, an electro-active polymer layer comprising a first surface disposed on the connecting pad and a second surface, and a second electrode disposed on the second surface of the electro-active polymer layer and electrically connected to the substrate.
    Type: Grant
    Filed: July 29, 2016
    Date of Patent: March 17, 2020
    Assignee: Industrial Technology Research Institute
    Inventors: Chin-Hung Wang, Yu-Wei Huang
  • Patent number: 10276908
    Abstract: An electromagnetic wave transmission board comprises a substrate. The substrate comprises a first dielectric layer and a second dielectric layer, and the first dielectric layer is stacked on the second dielectric layer. The first dielectric layer and the second dielectric layer together form a wave guiding space. The wave guiding space is configured for transmitting electromagnetic wave.
    Type: Grant
    Filed: March 24, 2017
    Date of Patent: April 30, 2019
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yu-Wei Huang, Shih-Hsien Wu, Wei-Chung Lo
  • Publication number: 20190106936
    Abstract: A rebound device used in running a pull cord provides for a retractable unit of a window blind to switch reversely a winding angle of the pull cord, upon rolling up the pull cord onto an inner radial side of a reel. The rebound device with an elastic action is disposed in the retractable unit opposite to an access opening of the reel, and includes an elastic tensile element or a gate-front shear set with an elastic function. In rolling up the pull cord, the pull cord is wound onto a coil on the wheel surface of the reel and after the pull cord is wound onto a coil on the inner radial side, the rebound action of the rebound device switches the pull cord reversely, allowing a new layer of winding coil to be wound reversely and orderly, so that the coil can be wound orderly in layers.
    Type: Application
    Filed: January 17, 2018
    Publication date: April 11, 2019
    Inventors: Ta-Peng Huang, Yu-Wei Huang
  • Patent number: 10037980
    Abstract: A fabricating method of a semiconductor light emitting device includes disposing a plurality of non-conductive walls on a substrate. An alignment position is formed between every two adjacent non-conductive walls. A plurality of semiconductor light emitting units on a first carrier board are respectively aligned to the alignment positions. The semiconductor light emitting units are divided into a plurality of groups. The semiconductor light emitting units in one of the groups are dissociated from the first carrier board. Thus, the semiconductor light emitting units in the group fall into the corresponding alignment positions due to gravity. Each of the semiconductor light emitting units is electrically connected with the substrate through a first electrode. A conductive layer is formed on the semiconductor light emitting units. Accordingly, the semiconductor light emitting units are electrically connected together to the conductive layer through second electrodes.
    Type: Grant
    Filed: June 26, 2017
    Date of Patent: July 31, 2018
    Assignee: Industrial Technology Research Institute
    Inventors: Yu-Wei Huang, Tao-Chih Chang, Chih-Ming Shen
  • Publication number: 20180183127
    Abstract: An electromagnetic wave transmission board comprises a substrate. The substrate comprises a first dielectric layer and a second dielectric layer, and the first dielectric layer is stacked on the second dielectric layer. The first dielectric layer and the second dielectric layer together form a wave guiding space. The wave guiding space is configured for transmitting electromagnetic wave.
    Type: Application
    Filed: March 24, 2017
    Publication date: June 28, 2018
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yu-Wei HUANG, Shih-Hsien WU, Wei-Chung LO
  • Patent number: 10000967
    Abstract: A curtain blinds spring motor elasticity maintaining structure, which provides a spring motor structure that prevents unproductive deformation and loss of elastic stress in a sheet band of a coil spring. The structure primarily consists of a kidney shaped wheel face provided on the outer circumferential surface of a drive drum. A first wound layer, a second wound layer, and a third wound layer of the sheet band are pulled and wound onto the drive drum to form a pressure accumulating coil, thereby arranging an anticipated configuration of curved tight windings of each of the wound layers along the kidney shaped wheel face, which prevents changes in the cross-sectional curvature of the sheet band and loss in elastic stress thereof, and thus maintaining an appropriate elastic force.
    Type: Grant
    Filed: June 27, 2016
    Date of Patent: June 19, 2018
    Inventors: Hsien-Te Huang, Yu-Wei Huang
  • Patent number: 9996932
    Abstract: The disclosure provides a method and a system for multi-lens module alignment, adapted to perform alignment on a multi-lens module having at least a first lens and a second lens during its manufacturing stage, where the method includes the following steps. A calibration object is first captured by using the first lens and the second lens to accordingly generate intrinsic parameters and external parameters of the first lens and the second lens, where the external parameters of the first lens and the second lens are associated with a common reference coordinate system. A target object is next captured by using the first lens and the second lens, and captured images of the target object are processed by using the intrinsic parameters and the external parameters to generate rectified images. The first lens and the second lens are adjusted and aligned according to the rectified images.
    Type: Grant
    Filed: September 6, 2016
    Date of Patent: June 12, 2018
    Assignee: Altek Semiconductor Corp.
    Inventors: Yu-Chih Wang, Shou-Te Wei, Yu-Wei Huang, Fu-Kui Yang, Chi-Ying Huang
  • Publication number: 20180145236
    Abstract: A package structure for a light emitting device including a carrier, a plurality of package units, an interconnection structure is provided. The carrier has a carrying surface, the package units stack on the carrying surface, each of the package units has a first surface and a second surface opposite the first surface and a plurality of light emitting devices arranged in an array and embedded in the package unit. Each of the light emitting devices includes a top portion facing the carrier, a bottom portion opposite to the top portion and a first electrode on the top portion, the bottom portion of each of the plurality of light emitting devices is coplanar with the first surface of the package unit. The interconnection structure is located in the package units and includes a plurality of conductive vias passing through the corresponding package units and electrically connected between the corresponding first electrodes.
    Type: Application
    Filed: December 29, 2017
    Publication date: May 24, 2018
    Applicant: Industrial Technology Research Institute
    Inventors: Yu-Wei Huang, Tao-Chih Chang, Chih-Ming Shen
  • Publication number: 20180035550
    Abstract: An apparatus for assembling devices, comprising a plurality of actuated devices disposed on a substrate, each of the actuated devices comprising a first electrode disposed on and electrically connect to the substrate, a connecting pad disposed on the substrate, an electro-active polymer layer comprising a first surface disposed on the connecting pad and a second surface, and a second electrode disposed on the second surface of the electro-active polymer layer and electrically connected to the substrate.
    Type: Application
    Filed: July 29, 2016
    Publication date: February 1, 2018
    Applicant: Industrial Technology Research Institute
    Inventors: Chin-Hung Wang, Yu-Wei Huang
  • Publication number: 20170371123
    Abstract: The disclosure provides a method and a system for multi-lens module alignment, adapted to perform alignment on a multi-lens module having at least a first lens and a second lens during its manufacturing stage, where the method includes the following steps. A calibration object is first captured by using the first lens and the second lens to accordingly generate intrinsic parameters and external parameters of the first lens and the second lens, where the external parameters of the first lens and the second lens are associated with a common reference coordinate system. A target object is next captured by using the first lens and the second lens, and captured images of the target object are processed by using the intrinsic parameters and the external parameters to generate rectified images. The first lens and the second lens are adjusted and aligned according to the rectified images.
    Type: Application
    Filed: September 6, 2016
    Publication date: December 28, 2017
    Applicant: Altek Semiconductor Corp.
    Inventors: Yu-Chih Wang, Shou-Te Wei, Yu-Wei Huang, Fu-Kui Yang, Chi-Ying Huang
  • Publication number: 20170294421
    Abstract: A fabricating method of a semiconductor light emitting device includes disposing a plurality of non-conductive walls on a substrate. An alignment position is formed between every two adjacent non-conductive walls. A plurality of semiconductor light emitting units on a first carrier board are respectively aligned to the alignment positions. The semiconductor light emitting units are divided into a plurality of groups. The semiconductor light emitting units in one of the groups are dissociated from the first carrier board. Thus, the semiconductor light emitting units in the group fall into the corresponding alignment positions due to gravity. Each of the semiconductor light emitting units is electrically connected with the substrate through a first electrode. A conductive layer is formed on the semiconductor light emitting units. Accordingly, the semiconductor light emitting units are electrically connected together to the conductive layer through second electrodes.
    Type: Application
    Filed: June 26, 2017
    Publication date: October 12, 2017
    Applicant: Industrial Technology Research Institute
    Inventors: Yu-Wei Huang, Tao-Chih Chang, Chih-Ming Shen
  • Patent number: 9728349
    Abstract: A button structure includes a circuit board, a switch module, a light source module, and a button body. The button body includes a substantially cylindrical shaped light guide member and a pressing member. The light guide member includes a periphery wall having at least one light guide surface. The pressing member is movably mounted in the light guide member and faces the switch module. When the pressing member is pressed, the pressing member activates the switch module and the switch module is activated to control the light source module to irradiate light, so that the light from the light source module enters the light guide member through the at least one light guide surface and is emitted out from a top portion of the periphery wall.
    Type: Grant
    Filed: November 30, 2015
    Date of Patent: August 8, 2017
    Assignee: Chiun Mai Communication Systems, Inc.
    Inventors: Yu-Wei Huang, Kao-Kuan Su, Min-Sheng Wang