Abstract: A flip-chip substrate for bonding with a chip is provided. The chip has an active surface with a plurality of bonding pads and each bonding pad has a bump thereon. The flip-chip substrate has a plurality of contact pads that correspond in positions with the bonding pads on the chip such that the chip pads are aligned to their corresponding contact pads at the melting point of the bump material.

Abstract: The present invention relates to a carrier for used in manufacturing semiconductor encapsulant packages. The carrier comprises at least one receiving part and a plurality of positioning pins; wherein the receiving part is used in receiving the semiconductor encapsulant package, and the positioning pins protrude upwards from an edge of the receiving part for used in positioning the semiconductor encapsulant package on the carrier; and each positioning pin is at an obtuse angle &thgr; to the receiving part. The present invention can prevent an encapsulant from contacting with the positioning pins and avoid leakage when applying the encapsulant. Additionally, the present invention also broadens available areas of substrates for packaging. Furthermore, the carrier in the present invention is integrally formed and has a advantage of being produced and controlled easily.

Abstract: A method for controlling the adhesive distribution in a flip-chip semiconductor product has steps: (a) providing a substrate with a flip-chip electrically mounted on the substrate via multiple bumps, (b) providing an dam along an edge of the flip-chip, and (c) depositing adhesive on the dam to flow into a space between the substrate and a bottom of the flip-chip by capillary effect. The shape of the dam is determined by the density of the multiple bumps to control the flowing speed of the adhesive to obtain a good adhesive distribution.

Abstract: A catalyst suitable for partially hydrogenating aromatic olefins to cyclohexene is disclosed. The catalyst is composed on a metallic active component deposited on a bi-oxide of gallium oxide-zinc oxide, and the metallic active component is selected from group VIII of the period table. The characteristic of the catalyst comprises a higher selectivity and yield in preparing cyclohexene.

Abstract: A method for preparing polyether glycol is disclosed. An ester end-capped polyalkylene ether and an alcohol are subjected to alcoholysis at a temperature of 35.degree.-150.degree. C. and a pressure of 1-10 atm in the presence of a mixed metal oxide as a catalyst. The mixed metal oxide includes an alkaline earth metal oxide and at least one component selected from alumina, silica, and zinc oxide.

Abstract: An ejector mechanism is provided for ejecting an IC card from a header connector which has a mating end, a terminating end and first and second opposite sides extending between the ends. A generally L-shaped ejector frame is adapted to be mounted about the header connector with a base leg of the L-shaped frame along the terminating end of the header connector and a side leg along one side of the header connector. The side leg has a channel therein. An ejector lever is pivotally mounted on at least one of the header connector or the ejector frame and has a first lever end and a second lever end. The second lever end is adapted to eject the IC card from the header connector. An elongated push-rod is reciprocally mounted in the channel and has a first rod end pivotally associated with the first lever end of the ejector lever and a second rod end for manual actuation to effect pivoting of the eject lever and ejection of the IC card.

Abstract: An electrical connector is provided for surface mounting along an edge of a circuit board in an edge straddling configuration. The circuit board has a plurality of contact pads spaced along opposite faces of the board near the edge thereof. The connector includes a dielectric housing and a plurality of terminals mounted on the housing with solder tails projecting from the housing generally in two rows to define an elongate board-receiving mouth for receiving the edge of the circuit board. The contact pads are adapted to receive soft solder paste thereon prior to insertion of the board into the mouth between the two rows of solder tails.

Abstract: An electrical connector is provided for surface mounting along an edge of a circuit board in an edge straddling configuration. The circuit board has a plurality of contact pads spaced along opposite faces of the board near the edge thereof. The connector includes a dielectric housing and a plurality of terminals mounted on the housing with solder tails projecting from the housing generally in two rows to define an elongate board-receiving mouth for receiving the edge of the circuit board. The contact pads are adapted to receive soft solder paste thereon prior to insertion of the board into the mouth between the two rows of solder tails.