Patents by Inventor Yu-Wen Chen

Yu-Wen Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20040183440
    Abstract: The pla sma display panel has some pairs of non-transparent discharge electrodes. Herein, no transparent discharge electrode is desired. Herein, for each pair, the non-transparent discharge electrodes are separated but closed to effectively discharge. Besides, the area of the non-transparent discharge electrodes is clearly smaller than the area of the panel. Furthermore, the shape of each non-transparent discharge electrode is alike to a shape with some openings, such as ladder or chain.
    Type: Application
    Filed: March 5, 2004
    Publication date: September 23, 2004
    Inventors: Wen-Rung Huang, Ching-Chung Cheng, Yuan-Chi Lin, Yu-Wen Chen
  • Publication number: 20040124540
    Abstract: A flip chip package structure comprising a chip, a substrate, at least a first bump and a plurality of second bumps is provided. The chip has a first bump-positioning region and the substrate has a second bump-positioning region. The substrate has at least a first hole and multiple second holes. The first hole and the second holes are located within the second bump-positioning region. The first hole has a depth greater than that of the second hole. The first bump is set up between the first bump-positioning region of the chip and the second bump-positioning region of the substrate. The first bump is bonded to the substrate through the first holes. The second bumps are set up between the first bump-positioning region of the chip and the second bump-positioning region of the substrate. The second bumps are bonded to the substrate through the second holes. The first bump has a volume greater than the volume of the second bump.
    Type: Application
    Filed: December 24, 2003
    Publication date: July 1, 2004
    Inventors: YU-WEN CHEN, MING-LUN HO, SHIH-CHANG LEE, CHIH-HUANG CHANG
  • Publication number: 20040119171
    Abstract: A flip-chip substrate for bonding with a chip is provided. The chip has an active surface with a plurality of bonding pads and each bonding pad has a bump thereon. The flip-chip substrate has a plurality of contact pads that correspond in positions with the bonding pads on the chip such that the chip pads are aligned to their corresponding contact pads at the melting point of the bump material.
    Type: Application
    Filed: September 16, 2003
    Publication date: June 24, 2004
    Inventors: Yu-Wen Chen, Ming-Lun Ho, Chun-Yang Lee
  • Publication number: 20030087502
    Abstract: The present invention relates to a carrier for used in manufacturing semiconductor encapsulant packages. The carrier comprises at least one receiving part and a plurality of positioning pins; wherein the receiving part is used in receiving the semiconductor encapsulant package, and the positioning pins protrude upwards from an edge of the receiving part for used in positioning the semiconductor encapsulant package on the carrier; and each positioning pin is at an obtuse angle &thgr; to the receiving part. The present invention can prevent an encapsulant from contacting with the positioning pins and avoid leakage when applying the encapsulant. Additionally, the present invention also broadens available areas of substrates for packaging. Furthermore, the carrier in the present invention is integrally formed and has a advantage of being produced and controlled easily.
    Type: Application
    Filed: January 25, 2002
    Publication date: May 8, 2003
    Applicant: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Yu-Wen Chen, Wann-Lung Chien
  • Patent number: 6521481
    Abstract: A method for controlling the adhesive distribution in a flip-chip semiconductor product has steps: (a) providing a substrate with a flip-chip electrically mounted on the substrate via multiple bumps, (b) providing an dam along an edge of the flip-chip, and (c) depositing adhesive on the dam to flow into a space between the substrate and a bottom of the flip-chip by capillary effect. The shape of the dam is determined by the density of the multiple bumps to control the flowing speed of the adhesive to obtain a good adhesive distribution.
    Type: Grant
    Filed: January 7, 2002
    Date of Patent: February 18, 2003
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventors: Yu-Wen Chen, Hui-Lung Chou, Wann-Lung Chien
  • Patent number: 6060423
    Abstract: A catalyst suitable for partially hydrogenating aromatic olefins to cyclohexene is disclosed. The catalyst is composed on a metallic active component deposited on a bi-oxide of gallium oxide-zinc oxide, and the metallic active component is selected from group VIII of the period table. The characteristic of the catalyst comprises a higher selectivity and yield in preparing cyclohexene.
    Type: Grant
    Filed: April 23, 1999
    Date of Patent: May 9, 2000
    Assignee: Chinese Petroleum Corporation
    Inventors: Yu-Wen Chen, Sung-Cheng Hu
  • Patent number: 5585458
    Abstract: A method for preparing polyether glycol is disclosed. An ester end-capped polyalkylene ether and an alcohol are subjected to alcoholysis at a temperature of 35.degree.-150.degree. C. and a pressure of 1-10 atm in the presence of a mixed metal oxide as a catalyst. The mixed metal oxide includes an alkaline earth metal oxide and at least one component selected from alumina, silica, and zinc oxide.
    Type: Grant
    Filed: June 27, 1995
    Date of Patent: December 17, 1996
    Assignee: Industrial Technology Research Institute
    Inventors: Wen-Fa Lin, Yu-Wen Chen, Jih-Chen Huang, Hsueh-Ying Chen
  • Patent number: 5421737
    Abstract: An ejector mechanism is provided for ejecting an IC card from a header connector which has a mating end, a terminating end and first and second opposite sides extending between the ends. A generally L-shaped ejector frame is adapted to be mounted about the header connector with a base leg of the L-shaped frame along the terminating end of the header connector and a side leg along one side of the header connector. The side leg has a channel therein. An ejector lever is pivotally mounted on at least one of the header connector or the ejector frame and has a first lever end and a second lever end. The second lever end is adapted to eject the IC card from the header connector. An elongated push-rod is reciprocally mounted in the channel and has a first rod end pivotally associated with the first lever end of the ejector lever and a second rod end for manual actuation to effect pivoting of the eject lever and ejection of the IC card.
    Type: Grant
    Filed: March 9, 1994
    Date of Patent: June 6, 1995
    Assignee: Molex Incorporated
    Inventors: Liu-Yuan Chen, Yu-Wen Chen, Nai K. Wong
  • Patent number: 5415573
    Abstract: An electrical connector is provided for surface mounting along an edge of a circuit board in an edge straddling configuration. The circuit board has a plurality of contact pads spaced along opposite faces of the board near the edge thereof. The connector includes a dielectric housing and a plurality of terminals mounted on the housing with solder tails projecting from the housing generally in two rows to define an elongate board-receiving mouth for receiving the edge of the circuit board. The contact pads are adapted to receive soft solder paste thereon prior to insertion of the board into the mouth between the two rows of solder tails.
    Type: Grant
    Filed: July 8, 1993
    Date of Patent: May 16, 1995
    Assignee: Molex Incorporated
    Inventors: Yu-Wen Chen, Nai K. Wong
  • Patent number: 5292265
    Abstract: An electrical connector is provided for surface mounting along an edge of a circuit board in an edge straddling configuration. The circuit board has a plurality of contact pads spaced along opposite faces of the board near the edge thereof. The connector includes a dielectric housing and a plurality of terminals mounted on the housing with solder tails projecting from the housing generally in two rows to define an elongate board-receiving mouth for receiving the edge of the circuit board. The contact pads are adapted to receive soft solder paste thereon prior to insertion of the board into the mouth between the two rows of solder tails.
    Type: Grant
    Filed: March 2, 1993
    Date of Patent: March 8, 1994
    Assignee: Molex Incorporated
    Inventors: Yu-Wen Chen, Nai K. Wong