Patents by Inventor Yu Xiang

Yu Xiang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7557302
    Abstract: A printed circuit board for preventing electrostatic discharge damage includes several electronic components thereon. The printed circuit board defines a number of through holes therein. The printed circuit board includes a signal layer. The signal layer defines a first copper foil and second copper foil thereon. The first copper foils are disposed around the corresponding through holes and connect with the through holes. The second copper foils are disposed around the first copper foils and extend to two adjacent edges of the printed circuit board. The first copper foil and the second copper foil have a number of saw teeth. A gap between the first copper foil and the second foil is in the range from 0.1-0.125 mm.
    Type: Grant
    Filed: December 6, 2005
    Date of Patent: July 7, 2009
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hong Hai Precision Industry Co., Ltd.
    Inventor: Yu-Xiang Wang
  • Publication number: 20090111734
    Abstract: Compositions that include nanoscale structured materials or precursors thereof (e.g., self-assembling peptides) are described. The compositions can include other substances (e.g., a vasoconstrictor). Also described are methods for using the compositions to promote hemostasis, to protect the skin or wounds from contamination, to decontaiminate a site upon removal of previously applied compositions that provided a protective coating, and to inhibit the movement of bodily substances other than blood. The compositions are also useful in isolating tissue, removing tissue, preserving tissue (for, e.g., subsequent transplantation or reattachment), and as bulking, stabilizing or hydrating agents. Medical devices that include the compositions (e.g., a stent or catheter), bandages or other wound dressings, sutures, and kits that include the compositions are also described.
    Type: Application
    Filed: August 27, 2008
    Publication date: April 30, 2009
    Applicants: Massachusetts Institute of Technology, Versitech Limited
    Inventors: Rutledge Ellis-Behnke, Shuguang Zhang, Gerald Schneider, Kwok-Fai So, David Tay, Yu-Xiang Liang
  • Publication number: 20080091233
    Abstract: Compositions which self-assemble under physiological conditions are formulated for application to wounds. The formulations include a pharmaceutically acceptable carrier or are provided as part of a medical device or coating. The formulations may also include other therapeutic, prophylactic or diagnostic agents. The formulation can be administered as appropriate for treatment of one or more disorders or conditions. For example, the formulation may be applied to repair an injury or during surgery of the lung, eye or dura, or following an epidural or spinal tap, to stop leakage of blood, interstitial fluid, or cerebrospinal fluid. The formulation may be administered to a burn or ulcer. The formulation may be dispersed in a suture or adhesive for administration at the time of or as released following suturing or gluing of a wound, thereby limiting bleeding, loss of tissue fluids, or other fluids such as those produced by parenchymal tissues such as the liver, pancreas, and gastrointestinal tract.
    Type: Application
    Filed: April 25, 2007
    Publication date: April 17, 2008
    Applicant: Massachusetts Institute of Technology
    Inventors: Rutledge Ellis-Behnke, Yu-Xiang Liang, Gerald Schneider, Kwok-Fai So, David Tay
  • Publication number: 20070203062
    Abstract: Compositions that include nanoscale structured materials or precursors thereof (e.g., self-assembling peptides) are described. The compositions can include other substances (e.g., a vasoconstrictor). Also described are methods for using the compositions to promote hemostasis, to protect the skin or wounds from contamination, to decontaminate a site upon removal of previously applied compositions that provided a protective coating, and to inhibit the movement of bodily substances other than blood. The compositions are also useful in isolating tissue, removing tissue, preserving tissue (for, e.g., subsequent transplantation or reattachment), and as bulking, stabilizing or hydrating agents. Medical devices that include the compositions (e.g., a stent or catheter), bandages or other wound dressings, sutures, and kits that include the compositions are also described.
    Type: Application
    Filed: April 25, 2006
    Publication date: August 30, 2007
    Inventors: Rutledge Ellis-Behnke, Shuguang Zhang, Gerald Schneider, Kwok-Fai So, David Tay, Yu-Xiang Liang
  • Publication number: 20060139894
    Abstract: A printed circuit board for preventing electrostatic discharge damage includes several electronic components thereon. The printed circuit board defines a number of through holes therein. The printed circuit board includes a signal layer. The signal layer defines a first copper foil and second copper foil thereon. The first copper foils are disposed around the corresponding through holes and connect with the through holes. The second copper foils are disposed around the first copper foils and extend to two adjacent edges of the printed circuit board. The first copper foil and the second copper foil have a number of saw teeth. A gap between the first copper foil and the second foil is in the range from 0.1-0.125 mm.
    Type: Application
    Filed: December 6, 2005
    Publication date: June 29, 2006
    Applicant: HON HAI Precision Industry CO., LTD.
    Inventor: Yu-Xiang Wang
  • Publication number: 20060124348
    Abstract: A printed circuit board for preventing electrostatic discharge damage includes several electronic components thereon. The printed circuit board defines several through holes therein, and includes a signal layer and a ground layer. The signal layer includes a central area and an edge area. The edge area encircles the central area and is separate from the central area. The electronic components are installed on the central area. An insulated area is formed between the central area and the edge area. In a typical application of the printed circuit board, screws are inserted into the through holes and engaged with a panel of a computer enclosure, thereby mounting the printed circuit board to the panel. Thus the edge area is absolutely grounded via the through holes. The electronic components are relatively grounded by connection to the ground layer.
    Type: Application
    Filed: December 6, 2005
    Publication date: June 15, 2006
    Applicant: HON HAI Precision Industry CO., LTD.
    Inventors: Yu-Xiang Wang, Hui-Zhang Wang
  • Publication number: 20050276027
    Abstract: A electronic device for shielding electromagnetic interference (EMI) including a metal shield, a printed circuit board (PCB) having a ground layer, and a number of ground pads arranged at edges of the PCB and in electrical conductivity with the ground layer. The ground pads lies close to edges of the metal shield. During solder reflowing process, solder is laid on the ground pads, and a height of the solder is adjusted to meet spaces or gaps of the shield. When the PCB is placed into the shield, the solder on the ground pads is in electrical conductivity with the metal shield to eliminate spaces or gaps thereof. So the EMI coupling which causes EMI signals interfering with sensitive components is avoided.
    Type: Application
    Filed: June 1, 2005
    Publication date: December 15, 2005
    Applicant: HON HAI Precision Industry CO., LTD.
    Inventors: Ling-Ling Shen, Yu-Xiang Wang, Hui Chen
  • Patent number: 5396965
    Abstract: Improvements in down-hole mud actuated hammers are disclosed. According to its broadest aspect the invention is a down-hole mud actuated hammer for use in a drill string, which includes a housing with an upper end having means for connecting to the drill string. A throat is located within the housing which throat includes a main flow passage to allow high pressure drilling mud to pass therethrough. A piston is provided which is adapted to move axially within the housing means to thereby reciprocate between an up position and a down position. The piston is moved between the up and down position by a minor portion of the high pressure mud which portion passes from the main flow passage into at least one piston actuating chamber. This minor portion of mud is exhausted from the piston actuating chamber to a low pressure region out of the housing without being returned to the main flow passage.
    Type: Grant
    Filed: January 23, 1989
    Date of Patent: March 14, 1995
    Assignee: Novatek
    Inventors: David R. Hall, David S. Pixton, Yu Xiang-Guang
  • Patent number: D565984
    Type: Grant
    Filed: August 7, 2007
    Date of Patent: April 8, 2008
    Inventors: Ni Lidong, Yu Xiang
  • Patent number: D569743
    Type: Grant
    Filed: March 12, 2007
    Date of Patent: May 27, 2008
    Inventors: Ni Lidong, Yu Xiang