Abstract: The present invention relates to a semiconductor structure and a method for forming the same. The semiconductor structure comprises a substrate, a channel layer, a barrier layer, a source electrode, a gate electrode, a drain electrode, and a cap layer. The channel layer is disposed on the substrate, the barrier layer is disposed on the channel layer, and the source electrode, the gate electrode, and the drain electrode are disposed on the barrier layer. Except the regions directly above the source electrode and the drain electrode, the cap layer covers the source electrode and the drain electrode.

Abstract: A method for automatically obtaining factors related to traffic accidents includes: in case that a traffic accident is identified in a traffic video, categorizing the traffic accident into one of a plurality of pre-determined categories; collecting, first factoring data and second factoring data contained in the traffic video within an accident-related time period, tagging the traffic video as a traffic accident video with the one of the pre-determined categories, and storing the traffic accident video, the first factoring data and the second factoring data in a data storage; compiling a factor group for the traffic accident video based on the first factoring data and the second factoring data, and aggregating a plurality of factor groups of traffic accident videos to create aggregated factor groups; and creating a spreadsheet that contains the aggregated factor groups and that can be sorted using geographical locations.

Abstract: A method for fabricating an integrated circuit is provided. The method includes depositing a dielectric layer over a conductive feature; etching an opening in the dielectric layer to expose the conductive feature, such that the dielectric layer has a tapered sidewall surrounding the opening; depositing a bottom electrode layer into the opening in the dielectric layer; depositing a resistance switch layer over the bottom electrode layer; patterning the resistance switch layer and the bottom electrode layer respectively into a resistance switch element and a bottom electrode, in which a sidewall of the bottom electrode is landing on the tapered sidewall of the dielectric layer.

Abstract: One aspect of the present disclosure pertains to a method of forming a semiconductor structure. The method includes forming an active region over a substrate, forming a dummy gate layer over the active region, forming a hard mask layer over the dummy gate layer, forming a patterned photoresist over the hard mask layer, and performing an etching process to the hard mask layer and the dummy gate layer using the patterned photoresist, thereby forming patterned hard mask structures and patterned dummy gate structures. The patterned hard mask structures are formed with an uneven profile having a protruding portion. The protruding portion of each of the patterned hard mask structures has a first width, wherein each of the patterned dummy gate structures has a second width, and the first width is greater than the second width.

Abstract: A thin film photovoltaic structure has a substrate, a first conductive layer, a photovoltaic layer, a second conductive layer, multiple serial connection conductive layers and multiple first insulating areas. By using the serial connection conductive layer, each width between each adjacent serially connected photovoltaic structures is reduced, and an effective area of the thin film photovoltaic structure for collecting optic energy is increased, thus enhancing a geometry fill factor of the thin film photovoltaic structure. Further, by using the serial connection conductive layer and the first insulating area to form contact overlap areas in an overlapping arrangement, it can effectively protect conductive areas in the first conductive layer when etching the second conductive layer during the manufacturing process, which prevents the conductive areas from being damaged to not act as electrodes, and efficiently increases a manufacture yielding rate of the thin film photovoltaic structure.

Abstract: A transparent conductive substrate structure used for a thermoforming process includes a transparent cover plate and a touch sensing layer structure. The transparent cover plate includes a toughening layer on one side thereof. The touch sensing layer structure arranged on one surface of the toughening layer, and includes a first transparent conductive layer, a dielectric layer, a barrier layer, a second transparent conductive layer, and a buffer protective layer. Each transparent conductive layer is directly applied to the transparent cover plate, so that the thickness between the transparent conductive layers is below 1 ?m. The thickness between layers may be reduced to increase the sensitivity of the touch sensing layer structure. To prevent each transparent conductive layer and an electrode wire layer from breaking during the thermoforming process, the transparent conductive substrate structure is combined with the buffer protective layer to strengthen the structure of each transparent conductive layer.

Abstract: A capacitive sensing identification tag includes a substrate and a touch sensing layer disposed on one side of the substrate. The touch sensing layer includes high-sensing regions and low-sensing regions with different shapes. Both the high-sensing regions and the low-sensing regions have different stacked conductive layers and dielectric layers. A difference between the high-sensing regions and the low-sensing regions is that each of the high-sensing regions contains a dielectric layer, while each of the low-sensing regions does not. The capacitive sensing identification tag achieves an effect of sampling and identification of a touch panel by a capacitive sensing quantity that is different from a capacitive touch panel. And the capacitive sensing identification tag will not cause a difference in color or light transmittance between the high-sensing regions and the low-sensing regions, so there is no visible difference between the high-sensing regions and the low-sensing regions.

Abstract: A transparent conductive substrate structure used for a thermoforming process includes a transparent cover plate and a touch sensing layer structure. The transparent cover plate includes a toughening layer on one side thereof. The touch sensing layer structure arranged on one surface of the toughening layer, and includes a first transparent conductive layer, a dielectric layer, a barrier layer, a second transparent conductive layer, and a buffer protective layer. Each transparent conductive layer is directly applied to the transparent cover plate, so that the thickness between the transparent conductive layers is below 1 ?m. The thickness between layers may be reduced to increase the sensitivity of the touch sensing layer structure. To prevent each transparent conductive layer and an electrode wire layer from breaking during the thermoforming process, the transparent conductive substrate structure is combined with the buffer protective layer to strengthen the structure of each transparent conductive layer.

Abstract: A packaging structure with groove includes a substrate, a lower conductive layer, an optical element, a sealing layer and a barrier layer. The lower conductive layer is arranged on one face of the substrate. The optical element is arranged on one face of the lower conductive layer. The upper conductive layer is arranged on one face of the optical element. The packaging structure further comprises a groove defined on an inactive area of the optical element. The sealing layer is arranged on one face of the optical element and on one face of the upper conductive layer. The barrier layer is arranged on one face of the sealing layer. Because the groove is formed on inactive area of the optical element to enhance lateral sealing tightness, extended interface is provided between sealing layer/barrier layer and the substrate, thus enhance the water-resistant and gas-resistant property for package.

Abstract: An EMI shielding film includes a flexible composite metal layer, a transparent insulating layer, and a conductive adhesive layer. The conductive adhesive layer is formed by removing a solvent from a conductive adhesive composition. The conductive adhesive composition includes an acrylate solution, a divalent acid ester solution, a plurality of conductive particles, and the solvent. The present disclosure further includes a method of manufacturing the EMI shielding film.

Abstract: A packaging structure with groove includes a substrate, a lower conductive layer, an optical element, a sealing layer and a barrier layer. The lower conductive layer is arranged on one face of the substrate. The optical element is arranged on one face of the lower conductive layer. The upper conductive layer is arranged on one face of the optical element. The packaging structure further comprises a groove defined on an inactive area of the optical element. The sealing layer is arranged on one face of the optical element and on one face of the upper conductive layer. The barrier layer is arranged on one face of the sealing layer. Because the groove is formed on inactive area of the optical element to enhance lateral sealing tightness, extended interface is provided between sealing layer/barrier layer and the substrate, thus enhance the water-resistant and gas-resistant property for package.

Abstract: A structure of photovoltaic cell is provided. The structure of photovoltaic cell includes a substrate, a lower conductive layer, a photovoltaic layer, and an upper conductive layer, the lower conductive layer is disposed at one side of the substrate, the photovoltaic layer is disposed at the other surface of the lower conductive layer, and the upper conductive layer is disposed on the other surface of the photovoltaic layer. An electron transporting layer, a hole transporting layer, and an active layer sandwiched between the electron transporting layer and the hole transporting layer collectively constitute the photovoltaic layer. The electron transporting layer convers a portion of the active layer and the hole transporting layer for blocking the upper conductive layer from electrically connecting to the active layer and the hole transporting layer.

Abstract: A structure of photovoltaic cell is provided. The structure of photovoltaic cell includes a substrate, a lower conductive layer, a photovoltaic layer, and an upper conductive layer, the lower conductive layer is disposed at one side of the substrate, the photovoltaic layer is disposed at the other surface of the lower conductive layer, and the upper conductive layer is disposed on the other surface of the photovoltaic layer. An electron transporting layer, a hole transporting layer, and an active layer sandwiched between the electron transporting layer and the hole transporting layer collectively constitute the photovoltaic layer. The electron transporting layer covers a portion of the active layer and the hole transporting layer for blocking the upper conductive layer from electrically connecting to the active layer and the hole transporting layer.

Abstract: A structure of photovoltaic cell is provided. The structure of photovoltaic cell includes a substrate, a lower conductive layer, a photovoltaic layer, and an upper conductive layer, the lower conductive layer is disposed at one side of the substrate, the photovoltaic layer is disposed at the other surface of the lower conductive layer, and the upper conductive layer is disposed on the other surface of the photovoltaic layer. An electron transporting layer, a hole transporting layer, and an active layer sandwiched between the electron transporting layer and the hole transporting layer collectively constitute the photovoltaic layer. The electron transporting layer convers a portion of the active layer and the hole transporting layer for blocking the upper conductive layer from electrically connecting to the active layer and the hole transporting layer.

Abstract: A structure of photovoltaic cell is provided. The structure of photovoltaic cell includes a substrate, a lower conductive layer, a photovoltaic layer, and an upper conductive layer, the lower conductive layer is disposed at one side of the substrate, the photovoltaic layer is disposed at the other surface of the lower conductive layer, and the upper conductive layer is disposed on the other surface of the photovoltaic layer. An electron transporting layer, a hole transporting layer, and an active layer sandwiched between the electron transporting layer and the hole transporting layer collectively constitute the photovoltaic layer. The electron transporting layer convers a portion of the active layer and the hole transporting layer for blocking the upper conductive layer from electrically connecting to the active layer and the hole transporting layer.

Abstract: The invention provides an optical composite layer structure with a built-in touch sensitive polymer dispersed liquid crystal (PDLC) structure. The optical composite layer structure comprises an upper transparent substrate, a lower transparent substrate, an upper transparent conductive layer, a lower transparent conductive layer and a PDLC layer. A PDLC circuit and a touch sensitive circuit are provided on the upper and lower transparent conductive layers. A cable region that is electrically connected to external soft circuit cables is provided at an end of the upper transparent conductive layer and the lower transparent conductive layer to electrically connect to an external control unit. With a touch sensitive operation of a touch sensitive circuit of the optical composite layer structure, a signal instruction is provided to the control unit. The corresponding PDLC circuit may drive the corresponding regions of PDLC layer to conduct the change of light transmission of local region.

Abstract: The invention provides a method for manufacturing a 3D polymer dispersed liquid crystal (PDLC) composite layer structure. A 3D PDLC composite layer is first provided and has an upper transparent resin substrate, a lower transparent resin substrate, a PDLC layer, an upper protective layer and a lower protective layer. The 3D PDLC composite layer is hot-press molded to form a 3D PDLC composite layer structure with a recess portion, where internal light transmission ratio before hot pressing and after hot pressing are in a range of 0.1%-10%. The upper protective layer and the lower protective layer are removed from the resulting structure.

Abstract: A photovoltaic cell of the present disclosure includes a substrate, a plurality of conductive sheets mutually intervening disposed on the substrate and forming a first matrix arrangement, and a plurality of photovoltaic units mutually intervening disposed on the conductive sheets and forming a second matrix arrangement different from the first matrix arrangement. Moreover, any two adjacent rows of the second matrix arrangement of the photovoltaic units are separated from each other. In each row of the photovoltaic units, an electrical connection of any two adjacent photovoltaic units is established by being connected to one of the conductive sheets. Accordingly, the structure of the photovoltaic cell of the present disclosure can be massively manufactured.

Abstract: The invention provides an optical composite layer structure with a built-in touch sensitive polymer dispersed liquid crystal (PDLC) structure. The optical composite layer structure comprises an upper transparent substrate, a lower transparent substrate, an upper transparent conductive layer, a lower transparent conductive layer and a PDLC layer. A PDLC circuit and a touch sensitive circuit are provided on the upper and lower transparent conductive layers. A cable region that is electrically connected to external soft circuit cables is provided at an end of the upper transparent conductive layer and the lower transparent conductive layer to electrically connect to an external control unit. With a touch sensitive operation of a touch sensitive circuit of the optical composite layer structure, a signal instruction is provided to the control unit. The corresponding PDLC circuit may drive the corresponding regions of PDLC layer to conduct the change of light transmission of local region.

Abstract: The invention provides an optical composite layer structure with a built-in touch sensitive polymer dispersed liquid crystal (PDLC) structure. The optical composite layer structure comprises an upper transparent substrate, a lower transparent substrate, an upper transparent conductive layer, a lower transparent conductive layer and a PDLC layer. A PDLC circuit and a touch sensitive circuit are provided on the upper and lower transparent conductive layers. A cable region that is electrically connected to external soft circuit cables is provided at an end of the upper transparent conductive layer and the lower transparent conductive layer to electrically connect to an external control unit. With a touch sensitive operation of a touch sensitive circuit of the optical composite layer structure, a signal instruction is provided to the control unit. The corresponding PDLC circuit may drive the corresponding regions of PDLC layer to conduct the change of light transmission of local region.