Abstract: A wireless controlling PDLC smart window is provided. The smart window comprises a composite layer, a control device, a wireless receiver unit and a wireless emitter unit. The control device is connected electrically with the composite layer. The wireless receiver unit is connected electrically with the control device. The wireless emitter unit is coupled to the wireless receiver unit. The wireless emitter unit may emit a message of control operation to the wireless receiver unit. The message is transmitted from the wireless receiver unit to the control device. The control device may drive the composite layer to display information or pattern after the massage is processed.

Abstract: The invention provides a smart window. The smart window comprises at least one composite layer comprising: a first soft resin sheet, a first transparent conductive layer, a second soft resin sheet, a second transparent conductive layer and a first PDLC layer. The first and second transparent conductive layers are etched to form circuit regions with different patterns, and first leads and second leads on the circuit regions are electrically connected with an external electrically driving device. The first PDLC layer is driven to present different patterns by an electric field controlled by a signal instruction of the external electrically driving device.

Abstract: The invention provides an optical composite layer structure with a built-in touch sensitive polymer dispersed liquid crystal (PDLC) structure. The optical composite layer structure comprises an upper transparent substrate, a lower transparent substrate, an upper transparent conductive layer, a lower transparent conductive layer and a PDLC layer. A PDLC circuit and a touch sensitive circuit are provided on the upper and lower transparent conductive layers. A cable region that is electrically connected to external soft circuit cables is provided at an end of the upper transparent conductive layer and the lower transparent conductive layer to electrically connect to an external control unit. With a touch sensitive operation of a touch sensitive circuit of the optical composite layer structure, a signal instruction is provided to the control unit. The corresponding PDLC circuit may drive the corresponding regions of PDLC layer to conduct the change of light transmission of local region.

Abstract: The invention provides an optical composite layer structure. The optical composite layer structure comprises a polymer dispersed liquid crystal (PDLC) composite layer, a first optical adhesive layer and a touch sensitive composite layer, wherein the touch sensitive composite layer is attached to the PDLC composite layer by the first optical adhesive layer. The optical composite layer structure may be attached with a fixed light transmission substrate at a side surface or two side surfaces thereof. Each the PDLC composite layer and the touch sensitive composite layer may be connected electrically with external control units by soft cables. A touch sensitive operation of the touch sensitive composite layer is used to provide a signal instruction to the control unit. Accordingly, the corresponding PDLC circuit may drive the corresponding regions of the PDLC composite layer to conduct the change of light transmission of local region.

Abstract: A laser etching method for a transparent conductive plate includes the steps as follows: providing a transparent conductive plate having a transparent conductive layer; continuingly emitting a plurality of laser beams to the transparent conductive layer, and controlling the center points of the laser beams to move in a front path and a rear path partially overlapping a beginning portion of the front path for forming an end connection groove connecting the beginning and the end thereof, or controlling the center points of the laser beams to move in a transverse path and a longitudinal path without overlapping the transverse path for forming a T-shaped groove, or controlling the center points of the laser beams to sequentially move in a first path, a curve path, and a second path substantially perpendicular to the first path for forming a curve groove.

Abstract: A laser etching method for a transparent conductive plate includes the steps as follows: providing a transparent conductive plate having a transparent conductive layer; continuingly emitting a plurality of laser beams to the transparent conductive layer, and controlling the center points of the laser beams to move in a front path and a rear path partially overlapping a beginning portion of the front path for forming an end connection groove connecting the beginning and the end thereof, or controlling the center points of the laser beams to move in a transverse path and a longitudinal path without overlapping the transverse path for forming a T-shaped groove, or controlling the center points of the laser beams to sequentially move in a first path, a curve path, and a second path substantially perpendicular to the first path for forming a curve groove.

Abstract: A baking method for metallic paste on transparent substrate first prepares a thin transparent substrate coated with metallic paste and the thin transparent substrate is arranged in roll-to-roll or in batch to a baking area of a baking device. A near-infrared light source with a predetermined distance with the baking area is provided, and the near-infrared light source irradiates a near-infrared light with predetermined wavelength to the thin transparent substrate for baking process. In baking operation, the thin transparent substrate is placed on the baking area for static baking or dynamic baking. The thin transparent substrate is then sent to a cooling stabilization area for normal cooling.

Abstract: An environmental sensitive electronic device package including a first substrate, a second substrate, an environmental sensitive electronic device, gas barrier structures, micro-structures, and a filler layer is provided. The second substrate is located above the first substrate. The environmental sensitive electronic device is located on the first substrate. The gas barrier structures may be located between the first substrate and the second substrate and surround the environmental sensitive electronic device. The gas barrier structures have a first height. The micro-structures may be located between the first substrate and the second substrate and have a second height. A ratio of the second height to the first height ranges from 1/250 to 1/100. The filler layer may be located between the first substrate and the second substrate and covers the gas barrier structures and the environmental sensitive electronic device.

Abstract: A gas barrier substrate including a first gas barrier layer, a substrate, and a second gas barrier layer is provided. The first gas barrier layer has a central bonding surface bonded with the substrate and a peripheral boding surface surrounding the central bonding surface. The second gas barrier layer entirely covers the substrate and the first gas barrier layer. The second gas barrier layer is bonded with the substrate and the peripheral boding surface of the first gas barrier layer, wherein a minimum distance from an edge of the substrate to an edge of the first gas barrier layer is greater than a thickness of the first gas barrier layer.

Abstract: The invention provides a method for patterning a flexible substrate. The method for patterning a flexible substrate includes providing a carrier substrate. A release layer is formed on the carrier substrate. A flexible substrate film is formed on the release layer. A plurality of UV blocking mask patterns is formed covering various portions of the flexible substrate film and the release layer. A UV lighting process is performed to expose the flexible substrate film and the release layer not covered by the UV blocking mask patterns, to a UV light. A debonding step is performed so that the various portions of the flexible substrate film directly above the various portions of the release layer, which were not exposed to the UV light, are separated from the carrier substrate.

Abstract: Method for isolating a flexible film from a support substrate and method for fabricating an electronic device are provided. The method for isolating a flexible film from a support substrate includes providing a substrate with a top surface. A surface treatment is subjected to the top surface of the substrate, forming a top surface with detachment characteristics. A flexible film is formed on the top surface with detachment characteristics. The flexible film within the top surface with detachment characteristics is cut and isolated.

Abstract: The invention provides a method for patterning a flexible substrate. The method for patterning a flexible substrate includes providing a carrier substrate. A release layer is formed on the carrier substrate. A flexible substrate film is formed on the release layer. A plurality of UV blocking mask patterns is formed covering various portions of the flexible substrate film and the release layer. A UV lighting process is performed to expose the flexible substrate film and the release layer not covered by the UV blocking mask patterns, to a UV light. A debonding step is performed so that the various portions of the flexible substrate film directly above the various portions of the release layer, which were not exposed to the UV light, are separated from the carrier substrate.

Abstract: The invention provides a method for patterning a flexible substrate. The method for patterning a flexible substrate includes providing a carrier substrate. A release layer is formed on the carrier substrate. A flexible substrate film is formed on the release layer. A plurality of UV blocking mask patterns is formed covering various portions of the flexible substrate film and the release layer. A UV lighting process is performed to expose the flexible substrate film and the release layer not covered by the UV blocking mask patterns, to a UV light. A debonding step is performed so that the various portions of the flexible substrate film directly above the various portions of the release layer, which were not exposed to the UV light, are separated from the carrier substrate.

Abstract: The invention provides a method for patterning a flexible substrate. The method for patterning a flexible substrate includes providing a carrier substrate. A release layer is formed on the carrier substrate. A flexible substrate film is formed on the release layer. A plurality of UV blocking mask patterns is formed covering various portions of the flexible substrate film and the release layer. A UV lighting process is performed to expose the flexible substrate film and the release layer not covered by the UV blocking mask patterns, to a UV light. A debonding step is performed so that the various portions of the flexible substrate film directly above the various portions of the release layer, which were not exposed to the UV light, are separated from the carrier substrate.

Abstract: A gas barrier substrate including a first gas barrier layer, a substrate, and a second gas barrier layer is provided. The first gas barrier layer has a central bonding surface bonded with the substrate and a peripheral boding surface surrounding the central bonding surface. The second gas barrier layer entirely covers the substrate and the first gas barrier layer. The second gas barrier layer is bonded with the substrate and the peripheral boding surface of the first gas barrier layer, wherein a minimum distance from an edge of the substrate to an edge of the first gas barrier layer is greater than a thickness of the first gas barrier layer.

Abstract: Method for isolating a flexible film from a support substrate and method for fabricating an electronic device are provided. The method for isolating a flexible film from a support substrate includes providing a substrate with a top surface. A surface treatment is subjected to the top surface of the substrate, forming a top surface with detachment characteristics. A flexible film is formed on the top surface with detachment characteristics. The flexible film within the top surface with detachment characteristics is cut and isolated.

Abstract: A gas barrier substrate including a first gas barrier layer, a substrate, and a second gas barrier layer is provided. The first gas barrier layer has a central bonding surface bonded with the substrate and a peripheral boding surface surrounding the central bonding surface. The second gas barrier layer entirely covers the substrate and the first gas barrier layer. The second gas barrier layer is bonded with the substrate and the peripheral boding surface of the first gas barrier layer, wherein a minimum distance from an edge of the substrate to an edge of the first gas barrier layer is greater than a thickness of the first gas barrier layer.

Abstract: The invention provides a method for patterning a flexible substrate. The method for patterning a flexible substrate includes providing a carrier substrate. A release layer is formed on the carrier substrate. A flexible substrate film is formed on the release layer. A plurality of UV blocking mask patterns is formed covering various portions of the flexible substrate film and the release layer. A UV lighting process is performed to expose the flexible substrate film and the release layer not covered by the UV blocking mask patterns, to a UV light. A debonding step is performed so that the various portions of the flexible substrate film directly above the various portions of the release layer, which were not exposed to the UV light, are separated from the carrier substrate.

Abstract: A touch panel comprises: a substrate, a transparent conductive layer and a conductive circuit layer. The transparent conductive layer is formed on a surface of the substrate, and the transparent conductive layer has a touch area and an un-touch area. The un-touch area has a plurality of barrier blocks arranged in a matrix, and the barrier blocks form a plurality of vertical and horizontal barrier slots. The conductive circuit layer is directly distributed on the barrier slots formed by the barrier blocks of the touch area, so as to increase the space to distributing circuits on the conductive circuit layer and save cost to manufacturing.

Abstract: A method for isolating a flexible substrate from a support substrate and method for fabricating a flexible electronic device are provided. The method for isolating a flexible substrate from a support substrate includes providing a flexible substrate with a bottom surface. A surface treatment is subjected to the bottom surface of the flexible substrate, forming a bottom surface with detachment characteristics. The flexible substrate is fixed on the support substrate by means of an adhesive layer, wherein the bottom surface with detachment characteristics faces the support substrate. The flexible substrate is cut and isolated from the support substrate.