Abstract: A cable-gland system provides a sealing function to openings in an electronic chassis that receive cables. The cable-gland system comprises a plurality of individual cable glands. Each of the plurality of individual cable glands includes an exterior end to be positioned adjacent an exterior of the chassis, and an interior end for positioning within the chassis. Each of the plurality of individual cable glands includes a through-hole extending between the exterior and interior ends for receiving one of the cables, and an outer surface between the exterior and interior ends. Each of the plurality of individual cable glands has a male projection on one side of the outer surface and a female recess on an opposing side of the outer surface. The cable glands are connectable to form the cable-gland system by mating the male projection on one cable gland with the female recess of an adjacent cable gland.

Abstract: The invention provides a semiconductor manufacturing process, which comprises the following steps: using a computer system to define plurality of shots on a wafer range, distributing a plurality of observation points in each shot, finding out parts of incomplete shots from all of the shots, calculating the number of observation points in each incomplete shot, eliminating the incomplete shots with the number less than 3 observation points, counting all observation points in the remaining incomplete shots, and deleting a part of observation points until the total number of observation points meets a preset total number, and uniformly distributing all observation points, and performing an overlay measurement step on the remaining observation points to generate an offset vector map.

Abstract: A method of detecting leakage within a chassis includes mounting the chassis on a plate disposed in a sealed chamber and fluidly connecting, by a pipe, an interior space of the sealed chamber to a water tank such that a bottom end of the pipe is under a surface of water in the water tank. The method further includes determining, such as observing, whether bubbles are formed at the bottom end of the pipe due to pressurized air flowing into the pipe. The method also includes determining presence of a leak in the chassis due to pressurized air flowing between the chassis and the sealed chamber, before flowing into the pipe.

Abstract: A method for aligning to a pattern on a wafer is disclosed. The method includes the steps of obtaining a first inline image from a first sample wafer, obtaining a first contour pattern of an alignment mark pattern from the first inline image, using the first contour pattern to generate a first synthetic image in black and white pixels of only two grayscale levels, using the first synthetic image as a reference to recognize the alignment mark pattern on a tested wafer, and aligning to a tested pattern on the tested wafer according to a position of the alignment mark pattern on the tested wafer and a coordinate information.

Abstract: A light source module includes a light guide plate and a light source. The light guide plate has a first surface, a second surface, a light incident surface, and two opposite side surfaces. The second surface is opposite to the first surface, and the light incident surface connects the first surface and the second surface. Each side surface connects the first surface and the second surface, and the light incident surface connects the two side surfaces. The light source is disposed beside the light incident surface for emitting an illumination beam toward the light incident surface. The light guide plate includes multiple optical microstructures disposed on each side surface and near the light incident surface. The optical microstructures include multiple curved convex surfaces arranged from one end near the light incident surface to the other end away from the light incident surface. An electrophoretic display device is also provided.

Abstract: A method of automatically tuning hyperparameters includes receiving a hyperparameter tuning strategy. Upon determining that one or more computing resources exceed their corresponding predetermined quota, the hyperparameter tuning strategy is rejected. Upon determining that the one or more computing resources do not exceed their corresponding predetermined quota, a machine learning model training is run with a hyperparameter point. Upon determining that one or more predetermined computing resource usage limits are exceeded for the hyperparameter point, the running of the machine learning model training is terminated for the hyperparameter point and the process returns to running the machine learning model training with a new hyperparameter point. Upon determining that training the machine learning model is complete, training results are collected and computing resource utilization metrics are determined.

Abstract: A light source module and a display device are provided. The light source module includes a light-emitting element, a light-guiding plate, and a filter. The light-emitting element includes a light-emitting surface. The light-guiding plate includes a light-incident surface, and the light guide plate is disposed such that the light-incident surface faces the light-emitting surface. The filter is disposed between the light-emitting surface and the light-incident surface, and a center wavelength of a reflection band of the filter falls in a range of 570 nm to 590 nm. The light-emitting element emits a first light having a first color temperature from the light-emitting surface. The first light is filtered into the second light having a second color temperature after it passes through the filter. The light-incident surface of the light-guiding plate receives the second light. The first color temperature is lower than the second color temperature.

Abstract: A method for aligning to a pattern on a wafer is disclosed. The method includes the steps of obtaining a first inline image from a first sample wafer, obtaining a first contour pattern of an alignment mark pattern from the first inline image, using the first contour pattern to generate a first synthetic image in black and white pixels, using the first synthetic image as a reference to recognize the alignment mark pattern on a tested wafer, and aligning to a tested pattern on the tested wafer according to a position of the alignment mark pattern on the tested wafer and a coordinate information.

Abstract: A cable-clamp system includes a clamp and a base structure located within an electronic chassis. The base structure includes an upper region, a first side region, and a second side region. The upper region includes a plurality of cable-receptor cavities for receiving the cables. The first side region includes an opening, and the second side region includes a slot. The clamp includes an engagement surface, a first end, and a second end. The first end includes a hook for insertion into the opening to allow pivoting movement of the clamp relative to the base structure. The second end includes a plunger for retention within the slot. When the clamp pivots downwardly to cause the engagement surface to engage the cables, the plunger is retained within the slot to maintain a clamping force on the cables between the base structure and the clamp.

Abstract: An electric nail gun includes a nail-striking subunit that is adapted to strike a nail, a lifting wheel that is movable to become engageable and not engageable with the nail-striking subunit, a driving member that is rotatable by a motor, and a transmission shaft that is movably connected between the driving member and the lifting wheel, and that is convertible between a first position, where the lifting wheel is engageable with the nail-striking subunit such that rotation of the driving member results in movement of the nail-striking subunit, and a second position, where the lifting wheel is not engageable with the nail-striking subunit such that rotation of the driving member does not result in movement of the nail-striking subunit.

Abstract: The invention provides a correction and compensation method in a semiconductor manufacturing process. The method includes the following steps: providing a machine, the machine is at least used for exposure manufacturing of a first product and a second product, performing period maintenance (PM) on the machine, recording an original offset map before and after the period maintenance of the machine is performed, the original offset map has an original exposure size, and adjusting the original exposure size of the original offset map to correspond to a first exposure size of the first product, and performing a first offset compensation correction on the first product. And adjusting the original exposure size of the original offset map to correspond to a second exposure size of the second product, and performing a second offset compensation correction on the second product.

Abstract: Embodiments for implementing enhanced ensemble model diversity and learning by a processor. One or more data sets may be created by combining one or more clusters of data points of a minority class with selected data points of a majority class. One or more ensemble models may be created from the one or more data sets using a supervised machine learning operation. An occurrence of an event may be predicted using the one or more ensemble models.

Abstract: A reticle thermal expansion calibration method includes exposing a group of wafers and generating a sub-recipe, performing data mining and data parsing to generate a plurality of overlay parameters, extracting a plurality of predetermined parameters from the plurality of overlay parameters, performing a linear regression on each of the predetermined parameters, and generating a coefficient of determination for each of the predetermined parameters.

Abstract: A manufacturing method of a contact structure includes the following steps. A substrate is provided, and the substrate includes a first region and a second region. A dielectric layer is formed on the substrate. A photoresist layer is formed on the dielectric layer. An exposure process is performed. The exposure process includes first exposure steps and second exposure steps. Each of the first exposure steps is performed to a part of the first region of the substrate. Each of the second exposure steps is performed to a part of the second region of the substrate. Each of the second exposure steps is performed with a first overlay shift by a first predetermined distance. A develop process is performed for forming openings in the photoresist layer.

Abstract: A light source module and a display device are provided. The light source module includes a light-emitting element, a light-guiding plate, and a filter. The light-emitting element includes a light-emitting surface. The light-guiding plate includes a light-incident surface, and the light guide plate is disposed such that the light-incident surface faces the light-emitting surface. The filter is disposed between the light-emitting surface and the light-incident surface, and a center wavelength of a reflection band of the filter falls in a range of 570 nm to 590 nm. The light-emitting element emits a first light having a first color temperature from the light-emitting surface. The first light is filtered into the second light having a second color temperature after it passes through the filter. The light-incident surface of the light-guiding plate receives the second light. The first color temperature is lower than the second color temperature.

Abstract: A method of detecting leakage within a chassis includes mounting the chassis on a plate disposed in a sealed chamber and fluidly connecting, by a pipe, an interior space of the sealed chamber to a water tank such that a bottom end of the pipe is under a surface of water in the water tank. The method further includes determining, such as observing, whether bubbles are formed at the bottom end of the pipe due to pressurized air flowing into the pipe. The method also includes determining presence of a leak in the chassis due to pressurized air flowing between the chassis and the sealed chamber, before flowing into the pipe.

Abstract: A method for aligning to a pattern on a wafer is disclosed. The method includes the steps of obtaining a first inline image from a first sample wafer, obtaining a first contour pattern of an alignment mark pattern from the first inline image, using the first contour pattern to generate a first synthetic image in black and white pixels, using the first synthetic image as a reference to recognize the alignment mark pattern on a tested wafer, and aligning to a tested pattern on the tested wafer according to a position of the alignment mark pattern on the tested wafer and a coordinate information.

Abstract: A mechanism is provided for implementing a model update mechanism to update new models in real time while avoiding data loss and system downtime. Responsive to receiving a request to update a scorer model currently being executed by an existing worker thread in the data processing system, the model update mechanism initializing a new worker thread. The model update mechanism loads an updated scorer model into the new worker thread and initializes a state transfer from the existing worker thread to the new worker thread. The model update mechanism executes the updated scorer model such that the updated scorer model scores the input data. The model update mechanism then outputs a prediction based on the updated scorer model processing of the input data.

Abstract: A method of using a computing device to train a neural network to recognize features in variate time series data that includes receiving, by a computing device, variate time series data. The computing device further receives results associated with the variate time series data. The computing device determines an anchor of the variate time series data. The computing device additionally determines one or more portions of the variate time series data which lead to a positive result. The computing device further determines one or more portions of the variate time series data which lead to a negative result. The computing device trains a neural network to interpret results of future variate time series data based upon the anchor, the one or more portions of the variate time series data which lead to the positive result, and the one or more portions of the variate time series data which lead to the negative result.

Abstract: A method of using a computing device to determine a window size in variate time series data that includes receiving, by a computing device, variate time series data associated with a machine learning model. The computing device sets a moving window size and a standard deviation for the variate time series data. The computing device further calculates a moving window average for the variate time series data. The computing device additionally calculates a standard deviation across all variate time series data. The computing device sorts the standard deviations calculated in descending order. The computing device further iterates indices for the standard deviations until the indices have been visited by at least one anchor. The computing device iteratively expands each anchor to cover neighbors' anchors which have been visited by previous anchors. The computing device determines a window size based upon the expanded anchors.