Patents by Inventor Yuan Chi

Yuan Chi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20180032587
    Abstract: Methods and apparatus are provided for incremental frequent subgraph mining on dynamic graphs are provided. An exemplary subgraph mining method comprises maintaining a set of embeddings comprising matching embeddings of a given subgraph in an input graph; maintaining a first fringe set of subgraphs comprising subgraphs substantially on a fringe of frequent subgraphs in the input graph that satisfy a predefined support threshold; maintaining a second fringe set of subgraphs comprising subgraphs substantially on a fringe of infrequent subgraphs in the input graph that do not satisfy the predefined support threshold; for an edge addition, checking a support of the subgraphs in the second fringe set based on the set of the embeddings and searching for new embeddings created by the edge addition; and for an edge deletion, removing obsolete embeddings that comprise the deleted edge from the first fringe set based on the set of embeddings.
    Type: Application
    Filed: July 29, 2016
    Publication date: February 1, 2018
    Inventors: Ehab Abdelhamid Mohammed Abdelhamid, Bishwaranjan Bhattacharjee, Mustafa Canim, Yuan Chi Chang, Mohammad Sadoghi Hamedani
  • Patent number: 9842758
    Abstract: A method for fabricating a package structure is provided, including the steps of: disposing on a carrier a semiconductor chip having an active surface facing the carrier; forming a patterned resist layer on the carrier; forming on the carrier an encapsulant exposing an inactive surface of the semiconductor chip and a surface of the patterned resist layer; and removing the carrier to obtain a package structure. Thereafter, redistribution layers can be formed on the opposite sides of the package structure, and a plurality of through holes can be formed in the patterned resist layer by drilling, thus allowing a plurality of conductive through holes to be formed in the through holes for electrically connecting the redistribution layers on the opposite sides of the package structure. Therefore, the invention overcomes the conventional drawback of surface roughness of the through holes caused by direct drilling the encapsulant having filler particles.
    Type: Grant
    Filed: August 26, 2015
    Date of Patent: December 12, 2017
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Yan-Heng Chen, Chun-Tang Lin, Chieh-Yuan Chi
  • Patent number: 9792341
    Abstract: Organizing data within a database is provided. In response to determining that a group of coarsified data records within a database table is not an aligned group of data records, a virtually replicated subgroup of coarsified data records that corresponds to the group of coarsified data records is generated from different groups of coarsified data records within the database table. The virtually replicated subgroup of coarsified data records is aligned with the corresponding group of coarsified data records.
    Type: Grant
    Filed: June 2, 2014
    Date of Patent: October 17, 2017
    Assignee: International Business Machines Corporation
    Inventors: Yuan-Chi Chang, Mohammad S. Hamedani, Oktie Hassanzadeh, Timothy R. Malkemus
  • Patent number: 9768140
    Abstract: A method for fabricating a package structure is provided, which includes the steps of: providing an encapsulant encapsulating at least an electronic element; forming a shaping layer on a surface of the encapsulant, wherein the shaping layer has at least an opening exposing a portion of the surface of the encapsulant; forming at least a through hole corresponding in position to the opening and penetrating the encapsulant; and forming a conductor in the through hole. The shaping layer facilitates to prevent deformation of the through hole.
    Type: Grant
    Filed: October 16, 2014
    Date of Patent: September 19, 2017
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Yan-Heng Chen, Mu-Hsuan Chan, Chieh-Yuan Chi
  • Publication number: 20170261150
    Abstract: A lifting device for holding a display is provided. The lifting device has a slim appearance, wherein a width of a frame of the lifting device is 5-30 mm. The lifting device holds the display on a working surface through a plurality of constant force springs.
    Type: Application
    Filed: March 6, 2017
    Publication date: September 14, 2017
    Inventors: Yuan-Chi LEE, Ko-Hsien LEE
  • Patent number: 9734166
    Abstract: A first set of contextual dimensions is generated from one or more textual descriptions associated with a given event, which includes one or more examples. A second set of contextual dimensions is generated from one or more visual features associated with the given event, which includes one or more visual example recordings. A similarity structure is constructed from the first set of contextual dimensions and the second set of contextual dimensions. One or more of the textual descriptions is matched with one or more of the visual features based on the similarity structure.
    Type: Grant
    Filed: August 26, 2013
    Date of Patent: August 15, 2017
    Assignee: International Business Machines Corporation
    Inventors: Liangliang Cao, Yuan-Chi Chang, Quoc-Bao Nguyen
  • Patent number: 9671951
    Abstract: A method for zooming screen, an electronic apparatus and a computer readable medium using the same are provided. The method is adapted to an electronic apparatus having a touch screen. Firstly, a zooming gesture is detected by utilizing the touch screen. Next, a screen object acted by the zooming gesture on the touch screen is searched. Afterwards, a specific part of the screen object and a screen edge of the touch screen are used as a reference to zoom all of objects displayed in a screen of the touch screen, such that a height of the specific part of the screen object is constantly maintained during zooming the screen.
    Type: Grant
    Filed: October 9, 2013
    Date of Patent: June 6, 2017
    Assignee: HTC Corporation
    Inventors: Wen-Yuan Chi, Chuan-Feng Yeh, Sheng-Hsin Huang
  • Patent number: 9652168
    Abstract: A method includes the following steps. Runtime statistics related to data transaction processing in a concurrent system are collected. A given request to access shared data in the concurrent system is receive. Based on the collected runtime statistics, the number of reattempts the given request can make to access the shared data prior to access control being switched from a hardware transactional memory to a locking mechanism is adaptively determined.
    Type: Grant
    Filed: April 10, 2015
    Date of Patent: May 16, 2017
    Assignee: International Business Machines Corporation
    Inventors: Bishwaranjan Bhattacharjee, Mustafa Canim, Yuan-Chi Chang, Mohammad Sadoghi Hamedani, Bassem Makni, Kenneth Andrew Ross
  • Patent number: 9652169
    Abstract: A method includes the following steps. Runtime statistics related to data transaction processing in a concurrent system are collected. A given request to access shared data in the concurrent system is receive. Based on the collected runtime statistics, the number of reattempts the given request can make to access the shared data prior to access control being switched from a hardware transactional memory to a locking mechanism is adaptively determined.
    Type: Grant
    Filed: July 9, 2015
    Date of Patent: May 16, 2017
    Assignee: International Business Machines Corporation
    Inventors: Bishwaranjan Bhattacharjee, Mustafa Canim, Yuan-Chi Chang, Mohammad Sadoghi Hamedani, Bassem Makni, Kenneth Andrew Ross
  • Publication number: 20170110315
    Abstract: An apparatus of processing a semiconductor substrate include a chuck, a holder, a liquid supplying system and a positive pressure unit. The chuck has a principal surface and at least a hole formed thereon. The holder is capable of holding a semiconductor substrate at a position above the principal surface. The liquid supplying system is configured to provide a liquid film onto the principal surface through the hole. The positive pressure unit is configured for providing a gas flow to a space over the chuck. A method of processing a semiconductor substrate is disclosed herein as well.
    Type: Application
    Filed: October 20, 2015
    Publication date: April 20, 2017
    Inventors: Wei-Chih HSU, Kai-Lin CHUANG, Yuan-Chi CHIEN, Jeng-Huei YANG, Jun-Xiu LIU
  • Patent number: 9607941
    Abstract: A method for fabricating a conductive via structure is provided, which includes the steps of: forming in an encapsulant a plurality of openings penetrating therethrough; forming a dielectric layer on the encapsulant and in the openings of the encapsulant; forming a plurality of vias in the dielectric layer in the openings of the encapsulant; and forming a conductive material in the vias to thereby form conductive vias. Therefore, by filling the openings having rough wall surfaces with the dielectric layer so as to form the vias having even wall surfaces, the present invention improves the quality of the conductive vias.
    Type: Grant
    Filed: March 26, 2015
    Date of Patent: March 28, 2017
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Yan-Heng Chen, Chun-Tang Lin, Chieh-Yuan Chi, Mu-Hsuan Chan
  • Publication number: 20170046367
    Abstract: Conventionally, in addition to indexing, a synopsis of a base table of a database is used to skip and compress data. However, scanning of the entire synopsis for all queries is required, which takes a long time when the synopsis gets significantly big in a large data warehouse. A method for efficient data skipping and compression through vertical partitioning of data is provided to eliminate the cost of synopsis storage overhead while enabling the synopsis search functionality.
    Type: Application
    Filed: August 10, 2015
    Publication date: February 16, 2017
    Inventors: Yuan-Chi Chang, Timothy R. Malkemus, Mohammad Sadoghi Hamedani
  • Patent number: 9548219
    Abstract: A carrier structure is provided, which includes: a metal oxide plate having opposite first and second surfaces and a plurality of through holes penetrating the first and second surfaces; a plurality of conductive portions formed in the through holes, respectively; and a plurality of conductive pads formed on the first surface of the metal oxide plate, wherein each of the conductive pads is correspondingly positioned on and in contact with a plurality of the conductive portions so as to be electrically connected to the plurality of the conductive portions. By replacing a conventional silicon interposer with the metal oxide plate, the present invention eliminates the need to form through silicon vias as required in the prior art and therefore simplifies the fabrication process.
    Type: Grant
    Filed: December 29, 2014
    Date of Patent: January 17, 2017
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Yan-Heng Chen, Chung-Tang Lin, Chieh-Yuan Chi
  • Patent number: 9542740
    Abstract: Provided is a method of detecting a defect of a pattern using vectorization to increase accuracy and efficiency in OPC modeling and OPC verification. The method includes acquiring a target layout image associated with a target pattern, acquiring a pattern image associated with a pattern formed on a substrate, extracting an edge image from the pattern image, producing a first vector form based on the target layout image, producing a second vector form based on the edge image, and comparing the first vector form with the second vector form.
    Type: Grant
    Filed: July 15, 2014
    Date of Patent: January 10, 2017
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Ki-Hyun Kim, Kai-Yuan Chi, Dmitry Vengertsev, Seung-Hune Yang
  • Publication number: 20160364424
    Abstract: A method for processing a dataset in a partitioned distributed storage system having data stored in a base table and an index stored in an index table, may include receiving base and index table metadata from the partitioned distributed storage system, where the base and index table metadata includes respective table partition information. The method may further include partitioning the dataset into a set of base-delta files according to the base table metadata, and generating a set of index-delta files corresponding with the base-delta files according to the index table metadata. The method may additionally include updating the partitioned distributed storage system with the set of base-delta and the set of index-delta files, where a first update of the base table is synchronous with a second update of the index table.
    Type: Application
    Filed: June 12, 2015
    Publication date: December 15, 2016
    Inventors: Yuan-Chi Chang, Liana L. Fong, Wei Tan
  • Patent number: 9515040
    Abstract: A method for fabricating a package structure is provided, including the steps of: sequentially forming a metal layer and a dielectric layer on a first carrier, wherein the dielectric layer has a plurality of openings exposing portions of the metal layer; disposing an electronic element on the dielectric layer via an active surface thereof and mounting a plurality of conductive elements of metal balls on the exposed portions of the metal layer; forming an encapsulant on the dielectric layer for encapsulating the electronic element and the conductive elements; removing the first carrier; and patterning the metal layer into first circuits and forming second circuits on the dielectric layer, wherein the second circuits are electrically connected to the electronic element and the first circuits. The invention dispenses with the conventional laser ablation process so as to simplify the fabrication process, save the fabrication cost and increase the product reliability.
    Type: Grant
    Filed: June 11, 2015
    Date of Patent: December 6, 2016
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Yan-Heng Chen, Mu-Hsuan Chan, Chieh-Yuan Chi, Chun-Tang Lin
  • Patent number: 9494873
    Abstract: An asymmetry compensation method used in a lithography overlay process and including steps of: providing a first substrate, wherein a circuit layout is disposed on the first substrate, a first mask layer and a second mask layer together having an x-axis allowable deviation range and an y-axis allowable deviation range relative to the circuit layout are stacked sequentially on the circuit layout, wherein the x-axis allowable deviation range is unequal to the y-axis allowable deviation range; and calculating an x-axis final compensation parameter and an y-axis final compensation parameter base on the unequal x-axis allowable deviation range and the y-axis allowable deviation range.
    Type: Grant
    Filed: August 28, 2014
    Date of Patent: November 15, 2016
    Assignee: UNITED MICROELECTRONICS CORPORATION
    Inventors: En-Chiuan Liou, Teng-Chin Kuo, Yuan-Chi Pai, Chun-Chi Yu
  • Publication number: 20160299798
    Abstract: A method includes the following steps. Runtime statistics related to data transaction processing in a concurrent system are collected. A given request to access shared data in the concurrent system is receive. Based on the collected runtime statistics, the number of reattempts the given request can make to access the shared data prior to access control being switched from a hardware transactional memory to a locking mechanism is adaptively determined.
    Type: Application
    Filed: July 9, 2015
    Publication date: October 13, 2016
    Inventors: Bishwaranjan Bhattacharjee, Mustafa Canim, Yuan-Chi Chang, Mohammad Sadoghi Hamedani, Bassem Makni, Kenneth Andrew Ross
  • Publication number: 20160299718
    Abstract: A method includes the following steps. Runtime statistics related to data transaction processing in a concurrent system are collected. A given request to access shared data in the concurrent system is receive. Based on the collected runtime statistics, the number of reattempts the given request can make to access the shared data prior to access control being switched from a hardware transactional memory to a locking mechanism is adaptively determined.
    Type: Application
    Filed: April 10, 2015
    Publication date: October 13, 2016
    Inventors: Bishwaranjan Bhattacharjee, Mustafa Canim, Yuan-Chi Chang, Mohammad Sadoghi Hamedani, Bassem Makni, Kenneth Andrew Ross
  • Patent number: 9460147
    Abstract: A method for processing a dataset in a partitioned distributed storage system having data stored in a base table and an index stored in an index table, may include receiving base and index table metadata from the partitioned distributed storage system, where the base and index table metadata includes respective table partition information. The method may further include partitioning the dataset into a set of base-delta files according to the base table metadata, and generating a set of index-delta files corresponding with the base-delta files according to the index table metadata. The method may additionally include updating the partitioned distributed storage system with the set of base-delta and the set of index-delta files, where a first update of the base table is synchronous with a second update of the index table.
    Type: Grant
    Filed: January 12, 2016
    Date of Patent: October 4, 2016
    Assignee: International Business Machines Corporation
    Inventors: Yuan-Chi Chang, Liana L. Fong, Wei Tan