Patents by Inventor Yuan Chi

Yuan Chi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD OF CORRECTING OVERLAY ERROR
    Publication number: 20150362905
    Abstract: A method of correcting an overlay error includes the following steps. First, an overlay mark disposed on a substrate is captured so as to generate overlay mark information. The overlay mark includes at least a pair of first mark patterns and at least a second mark pattern above the first mark patterns. Then, the overlay mark information is calculated to generate an offset value between two first mark patterns and to generate a shift value between the second mark pattern and one of the first mark patterns. Finally, the offset value is used to compensate the shift value so as to generate an amended shift value.
    Type: Application
    Filed: August 12, 2014
    Publication date: December 17, 2015
    Inventors: En-Chiuan Liou, Chia-Chang Hsu, Teng-Chin Kuo, Chia-Hung Wang, Tuan-Yen Yu, Yuan-Chi Pai, Chun-Chi Yu
  • Database Query Processing Using Horizontal Data Record Alignment of Multi-Column Range Summaries
    Publication number: 20150347549
    Abstract: Organizing data within a database is provided. In response to determining that a group of coarsified data records within a database table is not an aligned group of data records, a virtually replicated subgroup of coarsified data records that corresponds to the group of coarsified data records is generated from different groups of coarsified data records within the database table. The virtually replicated subgroup of coarsified data records is aligned with the corresponding group of coarsified data records.
    Type: Application
    Filed: June 2, 2014
    Publication date: December 3, 2015
    Applicant: International Business Machines Corporation
    Inventors: Yuan-Chi Chang, Mohammad S. Hamedani, Oktie Hassanzadeh, Timothy R. Malkemus
  • SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF AND CARRIER STRUCTURE
    Publication number: 20150325508
    Abstract: A carrier structure is provided, which includes: a metal oxide plate having opposite first and second surfaces and a plurality of through holes penetrating the first and second surfaces; a plurality of conductive portions formed in the through holes, respectively; and a plurality of conductive pads formed on the first surface of the metal oxide plate, wherein each of the conductive pads is correspondingly positioned on and in contact with a plurality of the conductive portions so as to be electrically connected to the plurality of the conductive portions. By replacing a conventional silicon interposer with the metal oxide plate, the present invention eliminates the need to form through silicon vias as required in the prior art and therefore simplifies the fabrication process.
    Type: Application
    Filed: December 29, 2014
    Publication date: November 12, 2015
    Inventors: Yan-Heng Chen, Chung-Tang Lin, Chieh-Yuan Chi
  • Semiconductor package having embedded semiconductor elements
    Patent number: 9177859
    Abstract: A semiconductor package is disclosed, which includes: a carrier having at least an opening; a plurality of conductive traces formed on the carrier and in the opening; a first semiconductor element disposed in the opening and electrically connected to the conductive traces; a second semiconductor element disposed on the first semiconductor element in the opening; and a redistribution layer structure formed on the carrier and the second semiconductor element for electrically connecting the conductive traces and the second semiconductor element. Since the semiconductor elements are embedded and therefore positioned in the opening of the carrier, the present invention eliminates the need to perform a molding process before forming the redistribution layer structure and prevents the semiconductor elements from displacement.
    Type: Grant
    Filed: August 29, 2013
    Date of Patent: November 3, 2015
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Yan-Heng Chen, Chun-Tang Lin, Yan-Yi Liao, Hung-Wen Liu, Chieh-Yuan Chi, Hsi-Chang Hsu
  • CONDUCTIVE VIA STRUCTURE AND FABRICATION METHOD THEREOF
    Publication number: 20150294938
    Abstract: A method for fabricating a conductive via structure is provided, which includes the steps of: forming in an encapsulant a plurality of openings penetrating therethrough; forming a dielectric layer on the encapsulant and in the openings of the encapsulant; forming a plurality of vias in the dielectric layer in the openings of the encapsulant; and forming a conductive material in the vias to thereby form conductive vias. Therefore, by filling the openings having rough wall surfaces with the dielectric layer so as to form the vias having even wall surfaces, the present invention improves the quality of the conductive vias.
    Type: Application
    Filed: March 26, 2015
    Publication date: October 15, 2015
    Inventors: Yan-Heng Chen, Chun-Tang Lin, Chieh-Yuan Chi, Mu-Hsuan Chan
  • METHOD AND SYSTEM FOR MANAGING COMPUTER SYSTEMS
    Publication number: 20150278698
    Abstract: A management system for a computer system is disclosed. The computer system operates or includes various products (e.g., software products) that can be managed in a management system or collectively by a group of management systems. Typically, the management system operates on a computer separate from the computer system being managed. The management system can make use of a knowledge base of causing symptoms for previously observed problems at other sites or computer systems. In other words, the knowledge base can built from and shared by different users across different products to leverage knowledge that is otherwise disparate. The knowledge base typically grows over time. The management system can use its ability to request information from the computer system being managed together with the knowledge base to infer a problem root cause in the computer system being managed.
    Type: Application
    Filed: April 27, 2015
    Publication date: October 1, 2015
    Inventors: Saumitra Das, Stepan Sokolov, Bill "Yuan-chi" Chiu
  • METHOD FOR CONTROLLING POWER OF LASER EMITTING UNIT AND ASSOCIATED APPARATUS
    Publication number: 20150255105
    Abstract: A method for controlling a power of a laser emitting unit includes: receiving a reflected light from an object, where the object reflects light emitted from the laser emitting unit; determining a power of the reflected light; and determining a control signal by referring to a level of the power of the reflected light to control the power of the laser emitting unit.
    Type: Application
    Filed: November 11, 2014
    Publication date: September 10, 2015
    Inventors: Hsiao-Yuan Chi, Sheng-Chih Chang
  • INDEX MAINTENANCE BASED ON A COMPARISON OF REBUILD VS. UPDATE
    Publication number: 20150186441
    Abstract: A method, system and computer program product for index maintenance in a computer system comprising a plurality of nodes, a database, and an index to the database. In one embodiment, the method comprises, for a defined period of time, building a snapshot of selected change requests received by the nodes to change the database. After this defined period of time, a selection is made, based on specified criteria, whether to rebuild a new index to the database, or to add entries to a current index. When the selection is to rebuild a new index, the new index is rebuilt based on data in the database and in the change requests in the snapshot. When the selection is to add entries to a current index, entries are added to the current index based on data in the database and in the change requests in the snapshot.
    Type: Application
    Filed: December 31, 2013
    Publication date: July 2, 2015
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Yuan-chi Chang, Jason Crawford, Liana L. Fong, Wei Tan
  • METHOD FOR DETECTING DEFECT IN PATTERN
    Publication number: 20150131891
    Abstract: Provided is a method of detecting a defect of a pattern using vectorization to increase accuracy and efficiency in OPC modeling and OPC verification. The method includes acquiring a target layout image associated with a target pattern, acquiring a pattern image associated with a pattern formed on a substrate, extracting an edge image from the pattern image, producing a first vector form based on the target layout image, producing a second vector form based on the edge image, and comparing the first vector form with the second vector form.
    Type: Application
    Filed: July 15, 2014
    Publication date: May 14, 2015
    Inventors: Ki-Hyun KIM, Kai-Yuan CHI, Dmitry VENGERTSEV, Seung-Hune YANG
  • Enabling interoperability between participants in a network
    Patent number: 9021007
    Abstract: Interoperability is enabled between participants in a network by determining values associated with a value metric defined for at least a portion of the network. Information flow is directed between two or more of the participants based at least in part on semantic models corresponding to the participants and on the values associated with the value metric. The semantic models may define interactions between the participants and define at least a portion of information produced or consumed by the participants. The determination of the values and the direction of the information flow may be performed multiple times in order to modify the one or more value metrics. The direction of information flow may allow participants to be deleted from the network, may allow participants to be added to the network, or may allow behavior of the participants to be modified.
    Type: Grant
    Filed: July 24, 2008
    Date of Patent: April 28, 2015
    Assignee: International Business Machines Corporation
    Inventors: Charu C. Aggarwal, Murray Scott Campbell, Yuan-Chi Chang, Matthew Leon Hill, Chung-Sheng Li, Milind R. Naphade, Sriram K. Padmanabhan, John R. Smith, Min Wang, Kun-Lung Wu, Philip Shilung Yu
  • Method and system for managing computer systems
    Patent number: 9020877
    Abstract: A management system for a computer system is disclosed. The computer system operates or includes various products (e.g., software products) that can be managed in a management system or collectively by a group of management systems. Typically, the management system operates on a computer separate from the computer system being managed. The management system can make use of a knowledge base of causing symptoms for previously observed problems at other sites or computer systems. In other words, the knowledge base can built from and shared by different users across different products to leverage knowledge that is otherwise disparate. The knowledge base typically grows over time. The management system can use its ability to request information from the computer system being managed together with the knowledge base to infer a problem root cause in the computer system being managed.
    Type: Grant
    Filed: October 29, 2012
    Date of Patent: April 28, 2015
    Assignee: IpVenture, Inc.
    Inventors: Saumitra Das, Stepan Sokolov, Bill “Yuan-Chi” Chiu
  • Composite optical film and backlight module using the same
    Patent number: 9010979
    Abstract: The present disclosure provides a composite optical film including a brightness enhancement film, a high refractive-index layer, and an intermediate layer. The brightness enhancement film has a plurality of brightness enhancement structures parallel to each other, and a top surface and a bottom surface opposite to each other. The brightness structures are disposed on the top surface. The high refractive-index layer is disposed on the bottom surface, and includes a film and a plurality of inorganic nano-particles disposed within the film. The intermediate layer is disposed between the brightness enhancement film and the high refractive-index layer.
    Type: Grant
    Filed: September 13, 2012
    Date of Patent: April 21, 2015
    Assignee: AU Optronics Corp.
    Inventors: Yi-Wen Lin, Jen-Yuan Chi
  • METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
    Publication number: 20150064861
    Abstract: A method for manufacturing a semiconductor device is provided. A substrate having a first gate and a second gate respectively formed in a first region and a second region is provided. An underlayer is formed on the substrate to cover the first gate in the first region and the second gate in the second region. A patterned mask with a predetermined thickness is formed on the underlayer in the first region. The underlayer corresponding to the second gate in the second region is removed by the patterned mask to expose the second gate, wherein the underlayer corresponding to the first gate in the first region is partially consumed to expose part of the first gate.
    Type: Application
    Filed: September 3, 2013
    Publication date: March 5, 2015
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Shin-Chi Chen, Chih-Yueh Li, Shui-Yen Lu, Yuan-Chi Pai, Fong-Lung Chuang
  • ASSOCIATION OF VISUAL LABELS AND EVENT CONTEXT IN IMAGE DATA
    Publication number: 20150058348
    Abstract: A first set of contextual dimensions is generated from one or more textual descriptions associated with a given event, which includes one or more examples. A second set of contextual dimensions is generated from one or more visual features associated with the given event, which includes one or more visual example recordings. A similarity structure is constructed from the first set of contextual dimensions and the second set of contextual dimensions. One or more of the textual descriptions is matched with one or more of the visual features based on the similarity structure.
    Type: Application
    Filed: August 26, 2013
    Publication date: February 26, 2015
    Inventors: Liangliang Cao, Yuan-Chi Chang, Quoc-Bao Nguyen
  • VOLTAGE-STACKED SYSTEM FOR MANAGING STACKED VOLTAGE SOURCES BY USING MULTIPLE MONITORING CIRCUITS
    Publication number: 20140368040
    Abstract: A voltage-stacked system includes a first voltage source, at least one second voltage source, a master monitoring circuit and at least one slave monitoring circuit. The first voltage source and the at least one second voltage source are coupled in series. The master monitoring circuit is coupled to the first voltage source, and arranged for monitoring and controlling the first voltage source and transmitting a monitoring signal. The at least one slave monitoring circuit is respectively coupled to the at least one second voltage source and the master monitoring circuit for monitoring and controlling the at least one second voltage source, and accordingly sending a response signal to the master monitoring circuit.
    Type: Application
    Filed: October 18, 2013
    Publication date: December 18, 2014
    Applicant: POWERFLASH TECHNOLOGY CORPORATION
    Inventors: Chun-Ming Chen, Chang-Fu Hsia, Sheng-An Yang, Yuan-Chi Ho
  • NAIL MAGAZINE FOR A POWER NAIL-DRIVING TOOL
    Publication number: 20140361066
    Abstract: A nail magazine for a power nail-driving tool includes an elongated magazine unit and a leaf spring unit which includes an elongated body and first and second guiding members. The elongated body has a rearward end fixed to the elongated magazine, and a forward end which is movable between a blocking position and a yielded position. The first guiding member has a barrier shoulder configured to block loading movement of a nail strip when the nail strip is loaded in a wrong orientation. The second guiding member has a ramp-up region configured to permit the nail strip to depress the forward end to the yielded position when the nail strip is loaded in a correct orientation.
    Type: Application
    Filed: June 3, 2014
    Publication date: December 11, 2014
    Applicant: BASSO INDUSTRY CORP.
    Inventors: An-Gi Liu, Yuan-Chi Chiang
  • DISTRIBUTED K-CORE VIEW MATERIALIZATION AND MAINTENANCE FOR GRAPHS
    Publication number: 20140354649
    Abstract: Large graph data in many application domains dynamically changes with vertices and edges inserted and deleted over time. The problem of identifying and maintaining densely connected regions in the graph thus becomes a challenge. Embodiments of the invention describe a method using a k-core measure as a metric of dense connectivity over large, partitioned graph data stored in multiple computing servers in a cluster. The method describes steps to identify a k-core subgraph in parallel and to maintain a k-core subgraph when a new edge is inserted or an existing edge is deleted. The embodiments thus enable practitioners to identify and monitor large scale graph data, such as exemplified by multiple topical communities in a social network, in a scalable and efficient manner.
    Type: Application
    Filed: May 29, 2013
    Publication date: December 4, 2014
    Applicant: International Business Machines Corporation
    Inventors: Hidayet Aksu, Mustafa Canim, Yuan-Chi Chang
  • FABRICATION METHOD OF SEMICONDUCTOR PACKAGE
    Publication number: 20140342505
    Abstract: A fabrication method of a semiconductor package is disclosed, which includes the steps of: providing a carrier; disposing at least a semiconductor element on the carrier; forming an encapsulant on the carrier and the semiconductor element for encapsulating the semiconductor element; removing the carrier; disposing a pressure member on the encapsulant; and forming an RDL structure on the semiconductor element and the encapsulant, thereby suppressing internal stresses through the pressure member so as to mitigate warpage on edges of the encapsulant.
    Type: Application
    Filed: January 9, 2014
    Publication date: November 20, 2014
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD
    Inventors: Yan-Heng Chen, Chun-Tang Lin, Mu-Hsuan Chan, Chieh-Yuan Chi, Yan-Yi Liao
  • METHOD FOR FABRICATING SEMICONDUCTOR PACKAGE
    Publication number: 20140342506
    Abstract: Disclosed is a method for fabricating a semiconductor package, including providing a package unit having an insulating layer and at least a semiconductor element embedded into the insulating layer, wherein the semiconductor element is exposed from the insulting layer and a plurality of recessed portions formed in the insulating layer; and electrically connecting a redistribution structure to the semiconductor element. The formation of the recessed portions release the stress of the insulating layer and prevent warpage of the insulating layer from taking place.
    Type: Application
    Filed: January 2, 2014
    Publication date: November 20, 2014
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD
    Inventors: Yan-Heng Chen, Chun-Tang Lin, Chieh-Yuan Chi, Hung-Wen Liu
  • SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
    Publication number: 20140332976
    Abstract: A semiconductor package is disclosed, which includes: a carrier having at least an opening; a plurality of conductive traces formed on the carrier and in the opening; a first semiconductor element disposed in the opening and electrically connected to the conductive traces; a second semiconductor element disposed on the first semiconductor element in the opening; and a redistribution layer structure formed on the carrier and the second semiconductor element for electrically connecting the conductive traces and the second semiconductor element. Since the semiconductor elements are embedded and therefore positioned in the opening of the carrier, the present invention eliminates the need to perform a molding process before forming the redistribution layer structure and prevents the semiconductor elements from displacement.
    Type: Application
    Filed: August 29, 2013
    Publication date: November 13, 2014
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Yan-Heng Chen, Chun-Tang Lin, Yan-Yi Liao, Hung-Wen Liu, Chieh-Yuan Chi, Hsi-Chang Hsu