Abstract: A connection assembly for offsetting tilting caused by weight difference between two objects includes a first male connector, a second male connector linearly misaligned with the first male connector, a first female connector and a second female connector linearly misaligned with the first female connector. Both the first and second male connectors are formed on a first object and both the first and second female connectors are formed on a second object. Due to the misaligned relationship, weight of the combination between the first object and the second object is redistributed to avoid tilting.

Abstract: An electronic device with a plug guard that can be connected to an external power source and other digital source respectively by a power plug and a digital data plug and has an electronic device and a plug guard. The electronic device has an outer surface and an integrated external interface socket. The integrated external interface socket is formed in the outer surface and has a power segment and at least one digital data segment formed in-line and communicating with each other. The plug guard is mounted securely on the outer surface of the electronic device adjacent to the digital data segments to keep the power plug from being plugged into the digital data segment.

Abstract: Trace configurations for carrying high-speed digital differential signals provide for reduced conduction loss and improved signal integrity. In one embodiment, a circuit board has a first set of conductive traces disposed on non-conductive material, and a second set of conductive traces parallel to the first set and disposed within the conductive material. The second set is separated from the first set by non-conductive material. Corresponding traces of the first and second sets may be in a stacked configuration. In other embodiments, conductive material may be provided between corresponding traces of the first and second sets resulting in an “I-shaped” or “U-shaped” cross-section. In yet other embodiments, the trace configurations have “T-shaped” and “L-shaped” cross-sections.

Abstract: A shell for an electrical appliance includes a base, a cover, and a plug-receiving assembly. The plug-receiving assembly includes a recess attached to the cover for receiving a plug of the electrical appliance. The recess has a bottom and two opposing sides. The bottom supports the plug, and the opposing sides have protrusions for retaining the plug in the recess. The plug-receiving assembly further includes a slanted guide formed on the bottom of the recess for guiding the plug in the recess. A user may remove the plug from the recess by the pulling an electrical wire attached to the plug to move the plug along the slanted guide and out from the recess. Additionally, the plug-receiving assembly may include a mounting grove adjacent to the slanted guide for retaining the electrical wire.

Abstract: An auxiliary device for a connector has a body, a wire unit and plug. The wire unit is mounted securely in the body and extends out of the body from a first end of the body. The plug is formed on a second end of the body and is perpendicular to the wire unit. Therefore, the position of the wire unit is fixed when the plug is inserted into a socket.

Abstract: A heat-dissipating module including a board-type heat-pipe and a heat-conductive construction connected therewith. The heat-conductive construction has a connecting end in contact with the board-type heat-pipe. Via the connecting end, the heat-conductive construction is connected to a predetermined section of the board-type heat-pipe. The other section of the heat-conductive construction forms an open end. The board-type heat-pipe is composed of multiple independent heat-pipe units not communicating with each other. The heat generated by a heat-generating element can be quickly and uniformly transferred through the heat-pipe units to the heat-conductive construction for dissipating the heat at high efficiency.

Abstract: A voltage regulating circuit has a first switch, a transformer and a second switch. The first switch has an input node, a first node and a second node. The transformer is connected to the switches has a first coil and a second coil. The first coil and the second coil respectively have an end, and the second coil is connected to the first coil in series at a node. The node between the first and second coils is connected to the second node of the first switch. The second switch is connected to the transformer and has a first node, a second node and an output node. The first node is connected to the end of the first coil. The second node is connected to the first node of the first switch. The transformer will not heat up when the transformer needs not to be used.

Abstract: An inter-network packet modifier coupled between a first network and a second network for generating an outgoing transport packet forwarded to the second network according to an incoming transport packet received from the first network is disclosed. The inter-network packet modifier includes: a storage device for storing an updated identification information; and a pattern detector for detecting a specific pattern of the incoming transport packet and for exchanging an original identification information of the incoming transport packet with the updated identification information according to the specific pattern to generate the outgoing transport packet; wherein the pattern detector is a dedicated hardware for identification information exchanging.

Abstract: A complex printed circuit board structure including a flexible printed wiring board and a heat-dissipating substrate bonded with the flexible printed wiring board. Parts of surface material of the flexible printed wiring board is removed to form depressions or through holes for laying electronic elements therein. The surfaces of the electronic elements can at least partially get closer to or directly contact the heat-dissipating substrate through the depressions or through holes of the flexible printed wiring board. Therefore, the heat generated by the electronic elements can be more quickly and directly conducted to the heat-dissipating substrate and dissipated at high efficiency.

Abstract: A printed circuit board structure including a carrier face on which a conductive layer is for connecting with electronic elements and a heat pipe texture arranged inside and along the printed circuit board structure. The printed circuit board is made of a material with good thermal conductivity, whereby the heat generated by the electronic elements can be quickly conducted to the heat pipe texture and quickly dissipated.

Abstract: A DC/AC adapter assembly has a DC/AC adapter and a cable. The cable transmits a power-overloading signal to the DC/AC adapter indicating whether power-overloading is occurring in the cable. The DC/AC adapter includes a controller circuit for controlling and adjusting an output alternating current of the DC/AC adapter based on the power-overloading signal to reduce power-overloading occurring in the cable.

Abstract: A circuit package may include an upper surface of first conductive elements and second conductive elements. The first conductive elements may receive input/output signals from respective conductive elements of an integrated circuit die, and the second conductive elements may receive a first plurality of the input/output signals from respective ones of the first conductive elements. A lower surface of the package may include third conductive elements, the third conductive elements to receive a second plurality of the input/output signals from respective other ones of the first conductive elements.

Abstract: Arrangements are used for minimizing signal path discontinuities.

Abstract: A power shunt for use within a semiconductor device of a type having a motherboard and an integrated circuit package electrically coupled to the motherboard and of a type having a spaced portion located between the motherboard and the package. The power shunt comprises a capacitor within the spaced portion between the motherboard and the package of the semiconductor device. The capacitor includes a conductive layer of a first type, a conductive layer of a second type, and a dielectric layer that electrically isolates the first type conductive layer from the second type conductive layer, wherein said first type conductive layer and second type conductive layer form a conductive bridge between the motherboard and the package. The arrangement of the capacitor fulfills the dual function of providing decoupling capacitance with the capability of supplying an additional path of current between the motherboard and package to the die load 16.

Abstract: An auxiliary device for a connector has a body, a wire unit and plug. The wire unit is mounted securely in the body and extends out of the body from a first end of the body. The plug is formed on a second end of the body and is perpendicular to the wire unit. Therefore, the position of the wire unit is fixed when the plug is inserted into a socket.

Abstract: A personal video recorder (PVR) system includes a processing unit, a system memory coupled to the processing unit by a system memory bus, and an insertion module being coupled to the processing unit for inserting a packet into a PVR bit stream according to packet information. During a packet insertion operation, the processing unit is for reading data from the system memory, processing the data to generate the packet insertion information, and directly transferring the packet insertion information to the insertion module. By directly transferring the packet insertion information generated by the processing unit to the insertion module, memory bandwidth requirements of the system memory are reduced, and data access of the system memory is improved.

Abstract: A circuit package may include an upper surface of first conductive elements and second conductive elements. The first conductive elements may receive input/output signals from respective conductive elements of an integrated circuit die, and the second conductive elements may receive a first plurality of the input/output signals from respective ones of the first conductive elements. A lower surface of the package may include third conductive elements, the third conductive elements to receive a second plurality of the input/output signals from respective other ones of the first conductive elements.

Abstract: In an integrated circuit design, flex tape is used to provide signal ingress/egress to/from the integrated circuit design. Various architectures for the signal ingress/egress via flex tape is provided. In one embodiment, coaxial design is provided. In another embodiment, a coplanar waveguide design is provided.

Abstract: A power shunt for use within a semiconductor device of a type having a motherboard and an integrated circuit package electrically coupled to the motherboard and of a type having a spaced portion located between the motherboard and the package. The power shunt comprises a capacitor within the spaced portion between the motherboard and the package of the semiconductor device. The capacitor includes a conductive layer of a first type, a conductive layer of a second type, and a dielectric layer that electrically isolates the first type conductive layer from the second type conductive layer, wherein said first type conductive layer and second type conductive layer form a conductive bridge between the motherboard and the package. The arrangement of the capacitor fulfills the dual function of providing decoupling capacitance with the capability of supplying an additional path of current between the motherboard and package to the die load 16.

Abstract: A power plane including a supply power pin receptacle, a first connector power pin receptacle, and a second power pin receptacle, where a first electrical resistance between the supply power pin receptacle and the first connector power pin receptacle is substantially equal to a second electrical resistance between the supply power pin receptacle and the second connector power pin receptacle.