Abstract: A golf club head includes a striking plate, a golf club head body and a plurality of annular flexible portions. In assembling, the striking plate mechanically connects to a front side of the golf club head body. The golf club head body forms a crown portion, a sole portion, a toe portion, a heel portion and a side portion to constitute a body member. The annular flexible portions are provided on an inner surface of the golf club head body. Thereby, the annular flexible portions can increase an elastic deformation of the golf club head body.

Abstract: A method to make probes of a probe card includes providing a blocking plate on an electroplating tank. The blocking plate has a plurality of openings according to the layout of contact pads on a probe head. There are bumps on the contact pads of the probe head. Continuous electroplating process can be executed after bumps (contact pads) contact electroplating solution in the electroplating tank through the openings of the blocking plate. By continuously moving the probe head according to the desired shape of probes, probes were formed by electroplating. These probes can be made into different shapes with good uniformity in elasticity and heights to increase the quality of electrical contact during wafer probing. Moreover, the process lead time and fabrication cost are saved.

Abstract: Multilayered packaging films having good antifog performance that are suitable for use in food packaging. One multilayered film comprises at least one nylon layer having a silicone oil blended therein or coated on a surface thereof, and also comprises a barrier film that includes a sealant film having an antifog composition either contained within at least part of the sealant film or is coated on a surface of the sealant film. The silicone oil effectively blocks the migration of the antifog composition into an adjacent nylon layer when the multilayered film is stored in roll form.

Abstract: Security films that are useful for pharmaceutical packaging. In particular, anti-counterfeiting security films having a luminescent composition on or in a fluoropolymer layer, which luminescent composition luminesces upon the application of ultraviolet radiation in the 200 nm to 300 nm range, in which the luminescent component is optionally and preferably not viewable to the unaided eye. The films are particularly useful for the formation of anti-counterfeiting blister packaging in compliance with FDA regulations.

Abstract: The invention provides a novel amino acid, neo-tryptophan, as well as polypeptides containing this novel amino acid such as neurotensin analogs. In addition, the invention provides neo-tryptophan derivatives, serotonin-like neo-tryptophan derivatives, and polypeptides containing such derivatives. The invention also provides methods for making neo-tryptophan, neo-tryptophan derivatives, serotonin-like neo-tryptophan derivatives, and compositions containing these compounds. Further, the invention provides methods for inducing a neurotensin response in a mammal as well as methods for treating a mammal having a serotonin recognition molecule.

Abstract: A manufacturing method for a golf club head. The method includes the steps of: casting a cast body provided with a recession thereon; cutting the cast body to form with at least one cut opening in the recession on the golf club head; adhering a carbon-fiber plate to the recession to seal the cut opening; defining a buffer groove between the carbon-fiber plate and the cast body; and filling with an elastic material into the buffer groove; processing the cast body to an end product.

Abstract: The invention provides a novel amino acid, neo-tryptophan, as well as polypeptides containing this novel amino acid such as neurotensin analogs. In addition, the invention provides neo-tryptophan derivatives, serotonin-like neo-tryptophan derivatives, and polypeptides containing such derivatives. The invention also provides methods for making neo-tryptophan, neo-tryptophan derivatives, serotonin-like neo-tryptophan derivatives, and compositions containing these compounds. Further, the invention provides methods for inducing a neurotensin response in a mammal as well as methods for treating a mammal having a serotonin recognition molecule.

Abstract: A semiconductor package and a fabrication method thereof are provided, in which a ground pad on a chip is electrically connected to a ground plane on a substrate by means of an electrically-conductive wall formed over a side surface of the chip and an electrically-conductive adhesive used for attaching the chip to the substrate. Therefore, a wire-bonding process is merely implemented for power pads and signal I/O (input/output) pads on the chip without having to form ground wires on the ground pads for electrical connection purposes. This benefit allows the use of a reduced number of bonding wires and simplifies wire arrangement or routability. And, a grounding path from the chip through the electrically-conductive wall and electrically-conductive adhesive to the substrate is shorter than the conventional one of using ground wires, thereby reducing a ground-bouncing effect and improving electrical performances of the semiconductor package.

Abstract: A process for transferring a thin polymeric film to either woven or non-woven fabrics by first coextruding the thin polymeric film with a plastic support layer, then adhesively laminating the polymeric film to a fabric, followed by delaminating the support layer. The thin base layer remaining on the fabric imparts desired properties to the fabric while maintaining the soft feel, or drapeability, of the fabric, as opposed to lamination of thicker polymeric films to fabrics.

Abstract: A process for forming thin film laminations of thin fluoropolymer films to receiver sheets, more particularly, the production of very thin, transferable fluoropolymer films. A thin fluoropolymer base layer is applied onto a support layer, which may be a thicker film. The support layer/thin base layer is then laminated to a receiver sheet, followed by stripping away the support layer, leaving the base film on the receiver sheet.

Abstract: A method for fabricating an anisotropic conductive substrate is disclosed. A back holder has metal pins on a surface thereof. A liquid compound is formed on the surface of the back holder with metal pins. The liquid compound is pressed to deform the metal pins into electrodes in the liquid compound. The thickness between upper surface and lower surface of the liquid compound is between 25 ?m and 250 ?m. The electrodes have upper ends and lower ends exposed from upper surface and lower surface of the liquid compound to provide electrical contact of anisotropic conduction.

Abstract: A method for fabricating wafer-level chip scale packages is disclosed. A plurality of sacrificial photoresists with supporting surfaces in strip or bump configuration are formed on a surface of a wafer. Then, a negative photoresist layer is covered on the sacrificial photoresists. The negative photoresist layer is patterned in order to form a plurality of dielectric supporting bars on supporting surfaces of the sacrificial photoresists. Thereafter, a plurality of metal bars are formed on the dielectric supporting bars. Then the sacrificial photoresists are removed in order to form a plurality of pin terminals of the wafer-level chip scale packages for elastically surface-mounting to substrate or printed circuit board.

Abstract: A process for transferring a thin polymeric film to either woven or non-woven fabrics by first coextruding the thin polymeric film with a plastic support layer, then adhesively laminating the polymeric film to a fabric, followed by delaminating the support layer. The thin base layer remaining on the fabric imparts desired properties to the fabric while maintaining the soft feel, or drapeability, of the fabric, as opposed to lamination of thicker polymeric films to fabrics.

Abstract: A probe card assembly is disclosed. The probe card assembly comprises a stiffener ring combining respectively with an upper printed circuit board and a lower printed circuit board. A plurality of coaxial transmitters are installed in the stiffener ring, and connect to the upper and lower printed circuit boards by cable connectors. The lower printed circuit board is assembled with a detachable probe head which comprises a silicon substrate with probing points and a probe head carrier. A downset is formed at the center of the probe head carrier. The standardized coaxial transmitters, printed circuit boards and probe heads are then assembled as a probe card assembly for testing all sorts of IC products.

Abstract: A multilayered packaging film having good antifog performance that is suitable for use in food packaging. The multilayered film comprises a nylon film having first and second surfaces; a silicone oil on the first surface of the nylon film; and a sealant film on the second surface of the nylon film, either directly or via an intermediate adhesive tie layer. An antifog composition is either contained within at least part of the sealant film or is coated on a surface of the sealant film opposite the nylon film. The silicone oil effectively blocks the migration of the antifog composition into the nylon film when the multilayered film is stored in roll form.

Abstract: A manufacturing process of memory module with direct die-attachment is provided to integrate the process of packaging, module assembling and testing. When a plurality of memory chips are singulated from a wafer, a determined amount of the memory chips are directly mounted to a module substrate, and electrically connected to gold fingers of the module substrate. The module substrate mounting the memory chips is loaded in a memory module tester. The memory chips are tested to verify their electrical performance by contacting the gold fingers, and then the bad ones are repaired or replaced before packaging the memory chips. The manufacturing process of memory module with direct die-attachment can reduce the investment of testers and also the cost of testing.

Abstract: A probe card assembly is disclosed. The probe card assembly comprises a stiffener ring combining respectively with an upper printed circuit board and a lower printed circuit board. A plurality of coaxial transmitters are installed in the stiffener ring, and connect to the upper and lower printed circuit boards by cable connectors. The lower printed circuit board is assembled with a detachable probe head which comprises a silicon substrate with probing points and a probe head carrier. A downset is formed at the center of the probe head carrier. The standardized coaxial transmitters, printed circuit boards and probe heads are then assembled as a probe card assembly for testing all sorts of IC products.

Abstract: A manufacturing method for a golf club head. The method includes the steps of: casting a cast body provided with a recession thereon; cutting the cast body to form with at least one cut opening in the recession on the golf club head; adhering a carbon-fiber plate to the recession to seal the cut opening; defining a buffer groove between the carbon-fiber plate and the cast body; and filling with an elastic material into the buffer groove; processing the cast body to an end product.

Abstract: The invention provides a novel amino acid, neo-tryptophan, as well as polypeptides containing this novel amino acid such as neurotensin analogs. In addition, the invention provides neo-tryptophan derivatives, serotonin-like neo-tryptophan derivatives, and polypeptides containing such derivatives. The invention also provides methods for making neo-tryptophan, neo-tryptophan derivatives, serotonin-like neo-tryptophan derivatives, and compositions containing these compounds. Further, the invention provides methods for inducing a neurotensin response in a mammal as well as methods for treating a mammal having a serotonin recognition molecule.

Abstract: A modularized probe card with coaxial transmitter is disclosed. At least a coaxial transmitter is modularized and installed between a first printed circuit board and a second printed circuit board. The coaxial transmitter has a first connector and a second connector correspondingly connecting two ends of each coaxial cable of the coaxial transmitter for electrically connecting corresponding in location to first printed circuit board and second printed circuit board. A probe head is bonded on second printed circuit board. The second connector of the coaxial transmitter is connected with the second printed circuit board in a plug-in and pull-away type.