Abstract: A modularized probe card with coaxial transmitter is disclosed. At least a coaxial transmitter is modularized and installed between a first printed circuit board and a second printed circuit board. The coaxial transmitter has a first connector and a second connector correspondingly connecting two ends of each coaxial cable of the coaxial transmitter for electrically connecting corresponding in location to first printed circuit board and second printed circuit board. A probe head is bonded on second printed circuit board. The second connector of the coaxial transmitter is connected with the second printed circuit board in a plug-in and pull-away type.

Abstract: A multilayered packaging film having good antifog performance that is suitable for use in food packaging. The multilayered film comprises an outer film attached to an inner film, which outer film is a combination of a first nylon layer, an ethylene vinyl alcohol layer attached to a surface of the first nylon layer and a second nylon layer attached to the ethylene vinyl alcohol layer. The inner film is a combination of a third nylon layer having a silicone oil on a first surface of the third nylon layer, and a sealant film on a second surface of the third nylon layer, attached either directly or via an intermediate adhesive layer. An antifog composition is either contained within the sealant film or is coated on a surface of the sealant film opposite the third nylon layer. The silicone oil effectively blocks the migration of the antifog composition into an adjacent nylon layer when the multilayered film is stored in roll form.

Abstract: A golf club head includes a golf club head body and a striking plate. The golf club head body has an opening on a front side thereof, with a flange being formed on the front side and extending along an outer peripheral edge defining the opening. A plurality of engaging notches are defined in the flange. The striking plate has a plurality of supporting rods. Each supporting rod is engaged in an associated one of the engaging notches when the striking plate is inserted into the opening of the golf club head body to thereby support the striking plate and to thereby position the striking plate in the opening of the golf club head body before high energy welding.

Abstract: A modularized probe card comprising an interface board, a probe head and at least a compressible electrical connection device is disclosed. The compressible electrical connection device comprises an insulation layer with a plurality of circuits on one of its surface. Two ends of each circuit connect respectively to the first contacting pad and the second contacting pad which combine with elastic contact members. Each elastic contact member has a supporter combining with a conductive layer for electrical connections by pushing and compressing. While a probe head is modularized installed on an interface board, the elastic contact members of the compressible electrical connection device is elastically contacted and compressed the probe head and the interface board to acquire modularized electrical connection of the probe card.

Abstract: A process for forming thin film laminations of thin fluoropolymer films to receiver sheets, more particularly, the production of very thin, transferable fluoropolymer films. A thin fluoropolymer base layer is applied onto a support layer, which may be a thicker film. The support layer/thin base layer is then laminated to a receiver sheet, followed by stripping away the support layer, leaving the base film on the receiver sheet.

Abstract: A process for transferring a thin polymeric film to either woven or non-woven fabrics by first coextruding the thin polymeric film with a plastic support layer, then adhesively laminating the polymeric film to a fabric, followed by delaminating the support layer. The thin base layer remaining on the fabric imparts desired properties to the fabric while maintaining the soft feel, or drapeability, of the fabric, as opposed to lamination of thicker polymeric films to fabrics.

Abstract: A method for designing a metal ion for use in a MD simulation can include the steps of building a metal ion molecule having a center atom and a dummy atom, assigning a van der Waals radius to the center atom, and assigning a charge to the dummy atom. A metal ion molecule can have. The center atom covalently linked to one or more dummy atoms resulting in the metal ion molecule having a polyhedron geometry. New force field parameters may be used in methods for designing metal ions for use in MD simulations.

Abstract: The invention provides a novel amino acid, neo-tryptophan, as well as polypeptides containing this novel amino acid such as neurotensin analogs. In addition, the invention provides neo-tryptophan derivatives, serotonin-like neo-tryptophan derivatives, and polypeptides containing such derivatives. The invention also provides methods for making neo-tryptophan, neo-tryptophan derivatives, serotonin-like neo-tryptophan derivatives, and compositions containing these compounds. Further, the invention provides methods for inducing a neurotensin response in a mammal as well as methods for treating a mammal having a serotonin recognition molecule.

Abstract: A method and a system for performing memory repair analysis are provided. A merge circuit is connected between test storage device of semiconductor testing equipment and pre-analysis storage device of repair analysis apparatus. Prior to memory repair analysis process, data from a plurality of functional tests are merged as a functional test data with addresses of fail bits by the merge circuit, then stored in pre-analysis storage device for analyzing. Therefore, test time is reduced and test efficiency is improved.

Abstract: Disclosed are efficient methods for loading amino derivatives onto trityl chloride resins and for cleaving chemically modified amino derivatives from trityl chloride resins. Methods for making a library of discrete chemically modified amino derivatives also disclosed.

Abstract: A golf club head includes a golf club head body and a striking plate. The golf club head body has an opening on a front side thereof, with a flange being formed on the front side and extending along an outer peripheral edge defining the opening. A plurality of engaging notches are defined in the flange. The striking plate has a plurality of supporting rods. Each supporting rod is engaged in an associated one of the engaging notches when the striking plate is inserted into the opening of the golf club head body to thereby support the striking plate and to thereby position the striking plate in the opening of the golf club head body before high energy welding.

Abstract: A semiconductor package and a fabrication method thereof are provided, in which a ground pad on a chip is electrically connected to a ground plane on a substrate by means of an electrically-conductive wall formed over a side surface of the chip and an electrically-conductive adhesive used for attaching the chip to the substrate. Therefore, a wire-bonding process is merely implemented for power pads and signal I/O (input/output) pads on the chip without having to form ground wires on the ground pads for electrical connection purposes. This benefit allows the use of a reduced number of bonding wires and simplifies wire arrangement or routability. And, a grounding path from the chip through the electrically-conductive wall and electrically-conductive adhesive to the substrate is shorter than the conventional one of using ground wires, thereby reducing a ground-bouncing effect and improving electrical performances of the semiconductor package.

Abstract: A laser engraving and coloring method for a golf club head using a laser beam to process on a titanium alloy surface. Processing conditions of the laser beam are laser frequency in the range of 7500-35000 Hz, current in the range of 14-17 A, power in the range of 25-45 W, moving speed in the range of 5-55 M/sec, and process route as an ellipse to thereby form various predetermined colors.

Abstract: A multilayered packaging film having good antifog performance that is suitable for use in food packaging. The multilayered film comprises an outer film attached to an inner film, which outer film is a combination of a first nylon layer, an ethylene vinyl alcohol layer attached to a surface of the first nylon layer and a second nylon layer attached to the ethylene vinyl alcohol layer. The inner film is a combination of a third nylon layer having a silicone oil on a first surface of the third nylon layer, and a sealant film on a second surface of the third nylon layer, attached either directly or via an intermediate adhesive layer. An antifog composition is either contained within the sealant film or is coated on a surface of the sealant film opposite the third nylon layer. The silicone oil effectively blocks the migration of the antifog composition into an adjacent nylon layer when the multilayered film is stored in roll form.

Abstract: The present invention provides a striking plate having an outer surface and an inner surface. The outer surface serves as a striking face formed with a plurality of grooves, and the inner surface is a highly-polished face with a surface roughness below 6.3 &mgr;m so as to eliminate surface defects that may otherwise cause contraction of impact stress. The striking plate can be integrated with a sole plate and a crown plate into a golf club head.

Abstract: A method to make probes of a probe card includes providing a blocking plate on an electroplating tank. The blocking plate has a plurality of openings according to the layout of contact pads on a probe head. There are bumps on the contact pads of probe head. Continuous electroplating process can be executed after bumps (contact pads) contact electroplating solution in the electroplating tank through the openings of the blocking plate. By continuously moving the probe head according to the desired shape of probes, probes were formed by electroplating. These probes can be made into different shapes with good uniformity in elasticity and heights to increase the quality of electrical contact during wafer probing. Moreover, the process lead time and fabrication cost are saved.

Abstract: A flip chip type semiconductor device for reducing signal skew includes: a chip with bonding pads, and a plurality of bumping pads on the chip. Between each bonding pad and corresponding bumping pads is connected with a metal redistribution trace covered by a passivation layer. Each metal trace has an equal trace length for reducing signal skew.

Abstract: A method and apparatus for reducing gouging during via formation. In one embodiment, the present invention is comprised of a method which includes forming an opening into a substrate. The opening is formed extending into the substrate and terminating on at least a portion of a target to which it is desired to form an electrical connection. After the formation of the opening, the present embodiment lines the opening with a liner material. In this embodiment, the liner material is adapted to at least partially fill a portion of the opening which is not landed on the target. The liner material of the present embodiment prevents substantial further etching of the substrate conventionally caused by the opening being at least partially unlanded on the target. Next, the present embodiment subjects the liner material to an etching process such that the liner material is substantially removed from that region of the target where the opening was landed on the target.

Abstract: A probe card with full wafer contact configuration comprises a back plate and a plurality of modular multiplayer ceramic wiring boards coplanarly mounted on the back plate. The total size of the modular multilayer ceramic wiring boards is larger than that of a wafer under test in order to fully contact all the bonding pads of the wafer under test. The modular multilayer ceramic wiring boards can be manufactured separately according to various locations. Thus, the manufacturing cost is reduced and yield is improved and lead time is shortened.

Abstract: A method and apparatus for reducing gouging during via formation. In one embodiment, the present invention is comprised of a method which includes forming an opening into a substrate. The opening is formed extending into the substrate and terminating on at least a portion of a target to which it is desired to form an electrical connection. After the formation of the opening, the present embodiment lines the opening with a liner material. In this embodiment, the liner material is adapted to at least partially fill a portion of the opening which is not landed on the target. The liner material of the present embodiment prevents substantial further etching of the substrate conventionally caused by the opening being at least partially unlanded on the target. Next, the present embodiment subjects the liner material to an etching process such that the liner material is substantially removed from that region of the target where the opening was landed on the target.