Abstract: An apparatus for decoding GNSS navigation data to generate at least a target string or subframe includes a demodulator and a processing unit. The demodulator is utilized for demodulating a received signal to generate at least a plurality of strings or subframes having a same string index or subframe index. The processing unit is coupled to the demodulator, and is utilized for determining the target string or subframe according to the plurality of strings or subframes.

Abstract: A method of forming an integrated circuit structure on a wafer includes providing a first etcher comprising a first electrostatic chuck (ESC); placing the wafer on the first ESC; and forming a via opening in the wafer using the first etcher. After the step of forming the via opening, a first reverse de-chuck voltage is applied to the first ESC to release the wafer. The method further includes placing the wafer on a second ESC of a second etcher; and performing an etching step to form an additional opening in the wafer using the second etcher. After the step of forming the additional opening, a second reverse de-chuck voltage is applied to the second ESC to release the wafer. The second reverse de-chuck voltage is different from the first reverse de-chuck voltage.

Abstract: A perfume bottle spray head assembly is disclosed to include a nozzle head, a lock cap, a receptacle, a plug, a dip tube, an outer cap and a rotary shut-off control plate. The nozzle head has passage means defined therein to facilitate mixing of liquid perfume with compressed air for enabling well-mixed liquid perfume and compressed air mixture to be sprayed out in a mist. The rotary shut-off control plate is operable to rotate the plug in the receptacle between a close position to shut off the liquid perfume passage and an open position to open the liquid perfume passage.

Abstract: A capacitor structure and a manufacturing method thereof. The capacitor structure includes a first conductor layer, a dielectric layer and a second conductor layer. The first conductor layer has a first metal material and a second metal material. The first metal material is formed with voids and the second metal material is filled in the voids via hot melt. Accordingly, in the first conductor layer, the second metal material is filled into the voids of the first metal material by means of hot melt to bond with the first metal material. In this case, the thermal treatment temperature can be effectively lowered and the electrical conductivity of the capacitor structure can be increased. Also, the strength of the capacitor structure is increased.

Abstract: A low-profile light-emitting diode (LED) lamp includes a base, a cover, a heat dissipation plate, an LED module, a circuit board, and a light guide hood. The base and the cover respectively form a base opening and a cover opening. The base and the cover include a recess-projection mating structure therebetween to form an outer water sealing wall and an inner water sealing wall that surround the base opening and the cover opening. The light guide hood, the circuit board, and the LED module are arranged inside the inner water sealing wall. The base and the cover are fixed together through recess-projection mating formed between posts and holes to also realize water resistance. The heat generated by the LED module is dissipated by the heat dissipation plate, which is set on an outer surface of the base and is provided with a plurality of convection chambers that induce heat convection.

Abstract: A perfume bottle sealing structure includes a cover, which is covered on the bottleneck of a perfume bottle and has an air hole and a tubular center shaft defining a longitudinal fluid passage, and a seal that is fastened to the top end of the tubular center shaft to seal the longitudinal fluid passage and the air hole during transportation of the perfume bottle and, which has a plug rod and a bottom pin respectively fitted into the longitudinal fluid passage and the air hole to seal the bottleneck when the seal is fastened to the cover.

Abstract: An LED lamp with a flow guide structure guides external air to dissipate heat from the LED lamp includes a lamp base, a heat dissipating body, a heat dissipating plate and an LED module installed in the lamp base, and heat dissipating holes formed on the lamp base. The heat dissipating body includes heat dissipating fins, and a heat dissipating passage defined between any two fins and disposed corresponding to the heat dissipating hole. The LED module is in a thermal contact with the heat dissipating plate. The heat dissipating plate is attached onto the heat dissipating fins and includes openings. A flow guide plate is formed at a lateral edge of each opening and extended from the heat dissipating plate for guiding external air into the heat dissipating passage and out from the heat dissipating hole to expedite a natural convection in the lamp and prevent a thermal aggregation.

Abstract: Human antibodies and antigen-binding portions of those antibodies that specifically bind extended Type I chain glycosphingolipids are provided.

Abstract: A housing for an electronic device is disclosed, the housing comprises a base layer and a transparent film layer overlapped in the base layer, the film layer includes an inner surface abutting the base layer and an outer surface having ridges protruding thereform. The housing is formed by injection molding a molten plastic material over the transparent film layer, the ridges are formed on the transparent film layer by the molten plastic pressing the transparent film layer in injection molding. It is also disclosed a mold for making the housing and a method to make the housing.

Abstract: An image display apparatus according to the present invention includes a housing, a front frame provided forward of the housing, and a display assembly accommodated in the housing. The display assembly includes a display and a transparent plate provided forward of the display. The transparent plate is larger in outer dimension than the display and has a flange portion extending outward with respect to an outer edge of the display. A seal member is interposed between the flange portion and an outer peripheral portion of the housing. When the housing and the front frame are fastened to each other, a front surface of the flange portion of the transparent plate is brought into pressure contact with a rear surface of the front frame, and the seal member is sandwiched between the front frame and the housing with a pressure applied thereto.

Abstract: A control circuit for use in a power converter has a multi-function terminal, a current comparator circuit, and an under-voltage detection circuit. The current comparator circuit compares current flowing through a power switch of the power converter with a reference value through the multi-function terminal when the power switch is on, and turns the power switch off when the current reaches the reference value. The under-voltage detection circuit determines whether an input voltage of the power converter is less than a predetermined value through the multi-function terminal when the power switch is turned off.

Abstract: An LED lamp with a flow guide structure guides external air to dissipate heat from the LED lamp includes a lamp base, a heat dissipating body, a heat dissipating plate and an LED module installed in the lamp base, and heat dissipating holes formed on the lamp base. The heat dissipating body includes heat dissipating fins, and a heat dissipating passage defined between any two fins and disposed corresponding to the heat dissipating hole. The LED module is in a thermal contact with the heat dissipating plate. The heat dissipating plate is attached onto the heat dissipating fins and includes openings. A flow guide plate is formed at a lateral edge of each opening and extended from the heat dissipating plate for guiding external air into the heat dissipating passage and out from the heat dissipating hole to expedite a natural convection in the lamp and prevent a thermal aggregation.

Abstract: A perfume bottle sealing structure includes a cover, which is covered on the bottleneck of a perfume bottle and has an air hole and a tubular center shaft defining a longitudinal fluid passage, and a seal that is fastened to the top end of the tubular center shaft to seal the longitudinal fluid passage and the air hole during transportation of the perfume bottle and, which has a plug rod and a bottom pin respectively fitted into the longitudinal fluid passage and the air hole to seal the bottleneck when the seal is fastened to the cover.

Abstract: The disclosure provides a unit with a sound isolation/vibration isolation structure, an array employing the same, and a method for fabricating the same. The unit with a sound isolation/vibration isolation structure includes: a hollow frame surrounding an inside space; a film disposed within the inside space, vertically contacting an inside wall of the hollow frame; and a body mass disposed on a top surface of the film. Particularly, the horizontal area of the inside space is larger than the area of the top surface of the film.

Abstract: A light guiding diffuser used for assembling with a light emitting diode module to form an illuminating light source. The light guiding diffuser includes an elliptical ring-shaped base portion and a convex portion extended from a surface of the base portion and formed a space with the base portion for accommodating the light emitting diode module. The convex portion has a cross section which has a minimum thickness in a center thereof and the thickness of the cross section continuous increases from the center toward the base portion.

Abstract: An ESD protection circuit for a differential I/O pair is provided. The circuit includes an ESD detection circuit, a discharge device, and four diodes. The first diode is coupled between the first I/O pin and the discharge device in a forward direction toward the discharge device. The second diode is coupled between the second I/O pin and the discharge device in a forward direction toward the second I/O pin. The third diode is coupled between the discharge device and the positive power line in a forward direction toward the positive power line. The fourth diode is coupled between the discharge device and the negative power line in a forward direction toward the discharge device. Via an output end, the ESD detection circuit triggers the discharge device during ESD events.

Abstract: A method of forming an integrated circuit structure on a wafer includes providing an etcher having an electrostatic chuck (ESC); and placing the wafer on the ESC. The wafer includes a conductive feature and a dielectric layer over the conductive feature. The method further includes forming and patterning a photo resist over the wafer; and etching the dielectric layer to form a via opening in the wafer using the etcher. An ashing is performed to the photo resist to remove the photo resist. An oxygen neutralization is performed to the wafer. A de-chuck step is performed to release the wafer from the ESC.

Abstract: A method of forming an integrated circuit structure on a wafer includes providing a first etcher comprising a first electrostatic chuck (ESC); placing the wafer on the first ESC; and forming a via opening in the wafer using the first etcher. After the step of forming the via opening, a first reverse de-chuck voltage is applied to the first ESC to release the wafer. The method further includes placing the wafer on a second ESC of a second etcher; and performing an etching step to form an additional opening in the wafer using the second etcher. After the step of forming the additional opening, a second reverse de-chuck voltage is applied to the second ESC to release the wafer. The second reverse de-chuck voltage is different from the first reverse de-chuck voltage.

Abstract: Human antibodies and antigen-binding portions of those antibodies that specifically bind extended Type I chain glycosphingolipids are provided.

Abstract: An ESD protection circuit is provided. The circuit includes a discharging component, a diode, and an ESD detection circuit. The discharging component is coupled between an input/output pad and a first power line of an IC. The diode is coupled between the input/output pad and a second power line of the IC in a forward direction toward the second power line. The ESD detection circuit includes a capacitor, a resistor, and a triggering component. The capacitor and the resistor are formed in series and coupled between the first power line and the second power line. The triggering component has a positive power end coupled to the input/output pad and a negative power end coupled to the first power line. An input of the triggering component is coupled to a node between the capacitor and the resistor.