Abstract: A method for identifying a value of an unknown circuit component for an analog signal having a known output profile in which a simulation list of the analog circuit is first created including the component with the unknown value. A transfer function for the known output value is then created using a programmed processor and the transfer function is then solved by the processor for the value of the unknown component. For nonlinear circuit components, a linear model is substituted for the nonlinear components prior to creating the simulation list.

Abstract: A control system for a vehicle having a plurality of subsystems in which each subsystem includes a sensor and/or actuator. A general purpose processor is programmed with a plurality of software applications in which each software application is associated with one of the vehicle subsystems. The subsystems and processor communicate with each other through an electrical bus and each subsystem includes a communication interface to receive commands from the processor as well as to send task signals to the processor. A task arbitrator prioritizes the order of execution of multiple task signals received by the processor during a preset time period. The general purpose processor then initiates execution of the software application associated with the subsystem of the sensor signal received from the task arbitrator and thereafter transmits a control signal to one or more of the subsystems via the bus as a result of execution of the associated software application.

Abstract: For reducing volume requirements and magnetic flux leakage, a compact inductor includes a first planar core with a first core thickness along a first axis orthogonal to a plane of the first planar core. In addition, the inductor includes a second planar core disposed parallel to the first planar core with a second core thickness along the first axis. The inductor further includes a plurality of electrical windings disposed between and adjacent to an inside plane of the first planar core and an inside plane of the second planar core. The electrical windings may include insulated electrical wires. No magnetic teeth may be disposed between the first planar core and the second planar core. The first axis is parallel to a magnetic axis of each electrical winding.

Abstract: Apparatus for providing real-time data to a hardware-in-the-loop simulator for an automotive vehicle. The apparatus includes a test vehicle having at least one sensor which generates an output signal representative of a condition of the vehicle. A wireless transmitter such as a cellular phone on the motor vehicle receives the sensor output signal as an input signal and transmits that output signal to a computer network. A simulator data server receives the data from the computer network and provides that data to the hardware-in-the-loop simulator.

Abstract: A device and method for integrated circuits with surrounding gate structures are disclosed. The device includes a semiconductor substrate and a fin structure on the semiconductor substrate. The fin structure is doped with a first conductivity type and includes a source region at one distal end and a drain region at the opposite distal end. The device further includes a gate structure overlying a channel region disposed between the source and drain regions of the fin structure. The fin structure has a rectangular cross-sectional bottom portion and an arched cross-sectional top portion. The arched cross-sectional top portion is semi-circular shaped and has a radius that is equal to or smaller than the height of the rectangular cross-sectional bottom portion. The source, drain, and the channel regions each are doped with dopants of the same polarity and the same concentration.

Abstract: The present techniques include methods and systems for detecting a failure in a capacitor bank of an electrical drive system. Embodiments include using discharge resistors to discharge capacitors in the capacitor bank, forming a neutral node of the capacitor bank. In different capacitor configurations, the neutral node is measured, and the voltage is analyzed to determine whether a capacitor bank unbalance has occurred. In some embodiments, the node is a neutral-to-neutral node between the discharged side of the discharge resistors and a neutral side of the capacitor bank, or between the discharged side of the discharge resistors and a discharged side of a second set of discharge resistors. In some embodiments, the node is a neutral-to-ground node between the discharged side of the discharge resistors and a ground potential.

Abstract: A brushless motor includes a stator comprising a stator core with teeth protruding inwardly and windings wound on the teeth, and a rotor comprising a shaft, a rotor core fixed to the shaft, and a ring magnet fixed to the circumferential outer surface of the rotor core. The ring magnet includes a plurality of magnetic poles radially magnetized so that north poles and south poles are arranged alternately in the circumferential direction, boundary lines between adjacent magnetic poles being skewed by an angle ? relative to an axis of the shaft. A plurality of grooves are formed in a circumferential outer surface of the rotor core. Each groove extends from one axial end to the other axial end of the rotor core, has a circumferential width smaller than each of the magnetic poles, and is covered by the ring magnet with a void formed between the groove and the ring magnet.

Abstract: An electric pump has a pump body, a pump magnet received in the pump body, an impeller received in the pump body and fixed to the pump magnet, and a disc type electric motor. The electric motor includes a stator, disc type coils fixed to a surface of the stator, a rotor rotatably positioned above the coils, and a circuit board electrically connected to the coils. The rotor has a rotor magnet positioned beneath the pump body and magnetically coupled to the pump magnet. When the coils are energized, an axial magnetic field is generated to drive the rotor and, through the magnetic coupling between the rotor magnet and the pump magnet, rotate the impeller.

Abstract: Multilevel power converters, power cells and methods are presented for selectively bypassing a power stage of a multilevel inverter circuit, in which a single relay or contactor includes first and second normally closed output control contacts coupled between a given power cell switching circuit and the given power cell output, along with a normally open bypass contact coupled across the power stage output, with a local or central controller energizing the coil of the relay or contactor of a given cell to bypass that cell.

Abstract: A transmission module assembly comprises a cover and an electrical connector received in the cover. The cover includes a body defining a receiving cavity and a mating section extending forwardly from the body. The connector includes an insulating elongated housing and a number of terminals retained in the housing. Each terminal includes an engaging portion extending forwardly beyond the body into the mating section, a tail portion extending upwardly beyond the housing and a connecting portion retained in the housing. There is a gap between the body and the housing for pouring sealant thereinto. A tuber is defined between the housing and the body, and a pair of stoppers positioned at the body abut forwardly against two lateral sides of the housing in an elongated direction, which can prevent the housing from deforming when temperature changes.

Abstract: A connector (100) and assembly of the same, the connector comprises an insulative housing (1) and a plurality of contacts (2) assembled onto the insulative housing (1), the insulative housing (1) defining a mating surface (11) and a mounting surface (12) opposite to the mating surface (11). Each contact (2) including a contact portion (21) arranged in the insulative housing (1) and a mounting portion (22) locating at the mounting surface (12) and protruding sidewardly beyond said insulative housing, the mounting portion (22) defines a soldering surface (222) for being soldered onto to said printed circuit board (200), said soldering surface (222) face toward the mounting surface (12). Therefore, when the connector (100) assembled to the printed circuit board (200), we could make full use of the height space at the up and down direction of the printed circuit board (200), thus greatly reducing the height space occupied by the connector (100).

Abstract: A connector (100) comprises an insulative housing (1) and a plurality of contacts (2) assembled onto the insulative housing (1), the insulative housing (1) defining a mating surface (11), a mounting surface (12) opposite to the mating surface (11) and a plurality of contact grooves (13) passing though the mating surface (11) and the mounting surface (12). The contact (2) assembled onto the insulative housing (1) from the mounting surface (12) of the insulative housing (1), each contact (2) including a contact portion (21) received in the contact grooves (13) and a mounting portion (22) extending out of the insulative housing (1). Wherein the connector (100) further includes a shell (4) assembled to the insulative housing (1), the shell (4) includes a shielding portion (41) shielding the mounting surface (12), thereby preventing the contact (2) shedding from the insulative housing (1) or loosening in the insulative housing (1) to make the combine of the contact (2) and insulative housing (1) reliable.

Abstract: A control system for a vehicle having a plurality of subsystems in which each subsystem includes a sensor and/or actuator. A general purpose processor is programmed with a plurality of software applications in which each software application is associated with one of the vehicle subsystems. The subsystems and processor communicate with each other through an electrical bus and each subsystem includes a communication interface to receive commands from the processor as well as to send task signals to the processor. A task arbitrator prioritizes the order of execution of multiple task signals received by the processor during a preset time period. The general purpose processor then initiates execution of the software application associated with the subsystem of the sensor signal received from the task arbitrator and thereafter transmits a control signal to one or more of the subsystems via the bus as a result of execution of the associated software application.

Abstract: A signal transmission module includes a shell and a connector. The shell includes a box and a mating portion. The connector includes an insulative housing received in the box and a set of contacts. Each contact includes a middle portion, a contacting portion extending into the mating portion and a tail portion. A gap is formed between the insulative housing and the box for sealant being injected. The signal transmission module further includes a horizontal channel located between the insulative housing and the box for the sealant entering into and a vertical channel connecting the horizontal channel.

Abstract: A device and method for integrated circuits with surrounding gate structures are disclosed. The device includes a semiconductor substrate and a fin structure on the semiconductor substrate. The fin structure is doped with a first conductivity type and includes a source region at one distal end and a drain region at the opposite distal end. The device further includes a gate structure overlying a channel region disposed between the source and drain regions of the fin structure. The fin structure has a rectangular cross-sectional bottom portion and an arched cross-sectional top portion. The arched cross-sectional top portion is semi-circular shaped and has a radius that is equal to or smaller than the height of the rectangular cross-sectional bottom portion. The source, drain, and the channel regions each are doped with dopants of the same polarity and the same concentration.

Abstract: A semiconductor device and a method for fabricating the same are disclosed. In the method, a substrate structure is provided, including a substrate and a fin-shaped buffer layer formed on the surface of the substrate. A QW material layer is formed on the surface of the fin-shaped buffer layer. A barrier material layer is formed on the QW material layer. The QW material layer is suitable for forming an electron gas therein. Thereby the short-channel effect is improved, while high mobility of the semiconductor device is guaranteed. In addition, according to the present disclosure, thermal dissipation of the semiconductor device may be improved, and thus performance and stability of the device may be improved.

Abstract: Multilevel power converters, power cells and methods are presented for selectively bypassing a power stage of a multilevel inverter circuit, in which a single relay or contactor includes one or more normally closed output control contacts coupled between a given power cell switching circuit and the given power cell output, along with a normally open bypass contact coupled across the power stage output, with a local or central controller energizing the coil of the relay or contactor of a given cell to bypass that cell.

Abstract: A device and method for integrated circuits with surrounding gate structures are disclosed. The device includes a semiconductor substrate and a fin structure on the semiconductor substrate. The fin structure is doped with a first conductivity type and includes a source region at one distal end and a drain region at the opposite distal end. The device further includes a gate structure overlying a channel region disposed between the source and drain regions of the fin structure. The fin structure has a rectangular cross-sectional bottom portion and an arched cross-sectional top portion. The arched cross-sectional top portion is semi-circular shaped and has a radius that is equal to or smaller than the height of the rectangular cross-sectional bottom portion. The source, drain, and the channel regions each are doped with dopants of the same polarity and the same concentration.

Abstract: Power conversion systems are presented with common mode reduction by space vector pulse width modulation zero vector selection to counteract common mode contribution of active vectors.

Abstract: A semiconductor device and a method for fabricating the same are disclosed. In the method, a substrate structure is provided, including a substrate and a fin-shaped buffer layer formed on the surface of the substrate. A QW material layer is formed on the surface of the fin-shaped buffer layer. A barrier material layer is formed on the QW material layer. The QW material layer is suitable for forming an electron gas therein. Thereby the short-channel effect is improved, while high mobility of the semiconductor device is guaranteed. In addition, according to the present disclosure, thermal dissipation of the semiconductor device may be improved, and thus performance and stability of the device may be improved.