Abstract: An integrated circuit system with one or more copper interconnects is provided. The one or more copper interconnects are in conductive contact with a substrate. The integrated circuit system includes a first dielectric layer, a copper material filling a first via through the first dielectric layer, a second dielectric layer in contact with the first dielectric layer, and a diffusion barrier layer. The diffusion barrier layer at least partially fills a second via through the second dielectric layer. At least a first part of the diffusion barrier layer is in direct contact with the copper material, and at least a second part of the diffusion barrier layer is in direct contact with the second dielectric layer. The integrated circuit system further includes a gold material at least partially filling the second via. The gold material is conductively connected with the copper material through the diffusion barrier layer and conductively connected with a substrate.

Abstract: An electrical connector (100) includes an insulative housing (1) for receiving a number of contacts (2), and a metal shield (3) enclosing the insulative housing (1). The insulative housing has a rear portion (11) and a pair of arms (12, 17) integrally extending from lateral sides of the rear portion with a receiving space (18) formed therebetween. The rear portion comprises a pair of upper and lower tongue plates (13, 14) extending forwardly into the receiving space with a mating slot (15) formed therebetween. Each contact (2) has a contact portion (2211) extending into the mating slot for electrically connecting with a plug. The metal shield (3) includes a top wall, an opposite bottom wall and a pair of side walls substantially engaging with the pair of arms, wherein the top and bottom walls restrict upper and lower positions of the receiving space (18), respectively.

Abstract: A flash memory device, includes a case (1) having a chamber and an opening (1120) at one end thereof. A memory module (2) is received in the chamber and has a plug (22) formed at one end thereof. A pole (3) has a first portion (30) received in the chamber to drive the plug of the memory module moving in or out of the opening, and a second portion (31) opposite to the first portion. A revolver mechanism (5) has a main body (51) which is rotatable, and a spindle (52) assembled to the main body and rotatablely coupled to the second portion to drive the pole moving along a linear direction.

Abstract: An electrical connector (100) includes an insulative housing (1) for receiving a number of contacts (2), and a metal shield (3) enclosing the insulative housing (1). The insulative housing has a rear portion (11) and a pair of side portions (12, 17) extending from the rear portion with a receiving space (18) formed therebetween. The rear portion comprises a pair of upper and lower tongue plates (13, 14) extending forwardly into the receiving space with a mating slot (15) formed therebetween. The upper and lower tongue plates respectively define a plurality of parallel passageways (131, 141). Each contact has a body portion (21) retained in the rear portion, and an upper and a lower section (221, 222) received in the passageways. The upper section (221) has a contact portion (2211) extending into the mating slot for electrically connecting with a plug.

Abstract: Systems and methods are described for controlling power factor in motor drives having a switching rectifier providing a DC link current to an inverter in which the rectifier gain is increased to provide additional DC link current to correct the drive power factor based on current drawn by capacitors of the AC drive power input, and the inverter gain is decreased by introducing bypass states in the inverter switching control scheme or by reducing the motor flux to accommodate the increased DC link current.

Abstract: Simple but practical methods to dice a CMOS-MEMS multi-project wafer are proposed. On this wafer, micromachined microstructures have been fabricated and released. In a method, a photoresist is spun on the full wafer surface, and this photoresist is thick enough to cover all cavities and structures on the wafer, such that the photoresist will protect the released structures free from the chipping, vibrations, and damages in the diamond blade dicing process. In another method, a laser dicing system is utilized to scribe the multi-project wafer placed on a platform, and by precisely controlling the platform moving-track, the dicing path can be programmed to any required shape and region, even it is not straight. In addition, the wafer backside is mounted on a blue-tape at the beginning to enhance the process reliability.

Abstract: An electrical connector (100) has a first end for fitting with another connector and a second end for connecting to a board. The connector comprises an insulative housing (1), a number of contacts (2) and a metal shield (3) enclosing the insulative housing. The insulative housing includes a tongue plate (11) with a number of passageways (110) defined therein for receiving the contacts. The contacts are arranged side by side in the first end and arranged in three parallel rows in the second end. The contacts include signal contact pairs (21) and grounding contacts (22) disposed adjacent to and separating the signal contact pairs. Each signal contact pair includes a first signal contact and a second signal contact being substantially in equal length of the first signal contact. The signal contact pairs have matched impedance for transmitting high-speed signals, thereby canceling any cross talk therebetween.

Abstract: A fully CMOS compatible MEMS multi-project wafer process comprises coating a layer of thick photoresist on a wafer surface, patterning the photoresist to define a micromachining region, and performing a micromachining in the micromachining region to form suspended microstructures.

Abstract: Systems and methods are described for controlling power factor in motor drives having a switching rectifier providing a DC link current to an inverter in which the rectifier gain is increased to provide additional DC link current to correct the drive power factor based on current drawn by capacitors of the AC drive power input, and the inverter gain is decreased by introducing bypass states in the inverter switching control scheme or by reducing the motor flux to accommodate the increased DC link current.

Abstract: An electrical connector (100) includes an insulative housing (1) defining a number of passageways (121) for receiving corresponding contacts (2), and a metal shield (3) enclosing the insulative housing (1). The metal shield has a top face (31), a bottom face (32) and a pair of side faces (33). The bottom face includes a pair of first board mounting legs (325) downwardly and a slot (326) between the first board mounting legs (325). The first board mounting legs (325) are disposed in communication of the slot (326) and mounted on a printed circuit board (4). The length of the slot (326) is equal to the total length of the first board mounting legs (325). With the addition of the first board mounting legs (325), the connector (100) can be more stably mounted on the printed circuit board.

Abstract: An electrical connector (100) includes an insulative housing (1) for receiving a number of contacts (2), and a metal shield (3) enclosing the insulative housing (1). The insulative housing has a rear portion (11) and a pair of arms (12, 17) integrally extending from lateral sides of the rear portion with a receiving space (18) formed therebetween. The rear portion comprises a pair of upper and lower tongue plates (13, 14) extending forwardly into the receiving space with a mating slot (15) formed therebetween. Each contact (2) has a contact portion (2211) extending into the mating slot for electrically connecting with a plug. The metal shield (3) includes a top wall, an opposite bottom wall and a pair of side walls substantially engaging with the pair of arms, wherein the top and bottom walls restrict upper and lower positions of the receiving space (18), respectively.

Abstract: An electrical connector (100) includes an insulative housing (1) for receiving a number of contacts (2), and a metal shield (3) enclosing the insulative housing (1). The insulative housing has a rear portion (11) and a pair of side portions (12, 17) extending from the rear portion with a receiving space (18) formed therebetween. The rear portion comprises a pair of upper and lower tongue plates (13, 14) extending forwardly into the receiving space with a mating slot (15) formed therebetween. The upper and lower tongue plates respectively define a plurality of parallel passageways (131, 141). Each contact has a body portion (21) retained in the rear portion, and an upper and a lower section (221, 222) received in the passageways. The upper section (221) has a contact portion (2211) extending into the mating slot for electrically connecting with a plug.

Abstract: Inductors are described for motor drives or other power converters having an inductor connected in a switching circuit, with one or more conductive shields positioned between an inductor coil winding and a flux-carrying inductor core leg to redirect flux away from the coil winding so as to inhibit heating of the coil.

Abstract: An electrical connector (100) has a first end for fitting with another connector and a second end for connecting to a board. The connector comprises an insulative housing (1), a number of contacts (2) and a metal shield (3) enclosing the insulative housing. The insulative housing includes a tongue plate (11) with a number of passageways (110) defined therein for receiving the contacts. The contacts are arranged side by side in the first end and arranged in three parallel rows in the second end. The contacts include signal contact pairs (21) and grounding contacts (22) disposed adjacent to and separating the signal contact pairs. Each signal contact pair includes a first signal contact and a second signal contact being substantially in equal length of the first signal contact. The signal contact pairs have matched impedance for transmitting high-speed signals, thereby canceling any cross talk therebetween.

Abstract: An improved power converter that produces reduced-levels of common-mode voltages, or even entirely eliminates such voltages, is disclosed herein, along with a method of reducing common-mode voltages. In at least some embodiments, the improved power converter is equipped with common-mode filter inductors and a link coupling input and output ports of the power converter with one another to communicate a ground point associated with the input ports of the converter (and the source) to the load. Further, in at least some embodiments, the method includes providing common mode filter inductors as part of the converter, where the inductors are connected at least indirectly to at least one of a rectifier and an inverter of the converter, and communicating a grounded neutral from input ports of the converter to output ports of the converter by way of at least one additional linkage.

Abstract: An improved power converter that produces reduced-levels of common-mode voltages, or even entirely eliminates such voltages, is disclosed herein, along with a method of reducing common-mode voltages. In at least some embodiments, the improved power converter is equipped with common-mode filter inductors and a link coupling input and output ports of the power converter with one another to communicate a ground point associated with the input ports of the converter (and the source) to the load. Further, in at least some embodiments, the method includes providing common mode filter inductors as part of the converter, where the inductors are connected at least indirectly to at least one of a rectifier and an inverter of the converter, and communicating a grounded neutral from input ports of the converter to output ports of the converter by way of at least one additional linkage.

Abstract: An electrical connector (100) includes an insulative housing (1) defining a number of passageways (121) for receiving corresponding contacts (2), and a metal shield (3) enclosing the insulative housing (1). The metal shield has a top face (31), a bottom face (32) and a pair of side faces (33). The bottom face includes a pair of first board mounting legs (325) downwardly and a slot (326) between the first board mounting legs (325). The first board mounting legs (325) are disposed in communication of the slot (326) and mounted on a printed circuit board (4). The length of the slot (326) is equal to the total length of the first board mounting legs (325). With the addition of the first board mounting legs (325), the connector (100) can be more stably mounted on the printed circuit board.