Patents by Inventor Yuan Yao

Yuan Yao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230160643
    Abstract: A heat exchange apparatus and a manufacturing method therefor are disclosed. The heat exchange apparatus comprises a valve core part and a core body part. The valve core part is provided with a valve base part. The valve seat part is at least partly arranged in a first conduit. The valve base part is provided with a base section with a bottom opening and a middle section with a peripheral opening. The valve base part is provided with a throttling hole. The throttling hole is in communication with the peripheral opening and the bottom opening. The middle section is arranged on a sheet part and the peripheral opening is in communication with inter-sheets channels. The heat exchanging apparatus comprising a connecting element. The connecting element is at least partly inserted into the first conduit. The bottom opening is in communication with a connecting cavity.
    Type: Application
    Filed: April 28, 2021
    Publication date: May 25, 2023
    Applicant: ZHEJIANG SANHUA AUTOMOTIVE COMPONENTS CO., LTD.
    Inventors: Bin Song, Yuan Yao, Keli Ye, Rongrong Zhang
  • Publication number: 20230145891
    Abstract: A heat exchange device including a valve element component, a core body component and a connecting member having a first end and a second end, and the second end is provided with a welding section and an adjacent section; the core body component is provided with a welding matching portion; the welding section is welded to the welding matching portion, and the adjacent section is adjacent to the welding section; the outer diameter of the welding section is smaller than or equal to the inner diameter of the welding matching portion, and the outer diameter of the adjacent section is smaller than or equal to the inner diameter of the welding matching portion; and the distance between the end of the welding matching portion away from the valve element component and the end of the welding section away from the valve element component is larger than or equal to zero.
    Type: Application
    Filed: April 28, 2021
    Publication date: May 11, 2023
    Applicant: ZHEJIANG SANHUA AUTOMOTIVE COMPONENTS CO., LTD.
    Inventors: Bin Song, Yuan Yao, Keli Ye, Rongrong Zhang
  • Publication number: 20230144700
    Abstract: This application discloses an electrical system and an electrical apparatus. The electrical system includes: a first-stage conversion module including a plurality of first controllable switches; a second-stage conversion module including a plurality of second controllable switches; a first digital signal processor configured to control the first controllable switch; and a second digital signal processor configured to control the second controllable switch, where a first output crossbar switch of the first digital signal processor is configured to supply a first internal signal to a first output port, so that the second digital signal processor receives the first internal signal within a preset time through a second input port. The internal signal of the first digital signal processor can be enabled to be transmitted to the second digital signal processor within a relatively short time, thereby reducing a time interval for triggering a protection action between the two digital signal processors.
    Type: Application
    Filed: July 18, 2022
    Publication date: May 11, 2023
    Applicant: CONTEMPORARY AMPEREX TECHNOLOGY CO., LIMITED
    Inventors: Yuan YAO, Weichen HE, Huaisen ZHANG, Guiying LIN, Jinfeng GAO, Zhimin DAN
  • Patent number: 11636803
    Abstract: A display device and a driving method therefor. The display device includes pixel units and pixel scanning circuits, and each of the pixel scanning circuits corresponds to the pixel units of a row. The driving method for the display device includes: driving, by a first driving signal corresponding to a first scanning frequency, the pixel scanning circuits, the first driving signal having row periods corresponding to a frame of image under the first scanning frequency; obtaining a switching signal, and driving, by a second driving signal corresponding to a second scanning frequency, the pixel scanning circuits according to the switching signal. The second driving signal has row periods corresponding to a frame of image under the second scanning frequency, the first scanning frequency is less than the second scanning frequency, and the row period of the first driving signal is greater than the row period of the second driving signal.
    Type: Grant
    Filed: March 1, 2022
    Date of Patent: April 25, 2023
    Assignee: Kunshan Go-Visionox Opto-Electronics Co., Ltd.
    Inventors: Yuan Yao, Shuai Ye, Guangyuan Sun, Wenyuan Xi
  • Publication number: 20230116892
    Abstract: A power supply system, a converter, and a circulating current suppression method of the converter. The power supply system includes at least two converters that are coupled between a direct current power supply and an alternating current grid. Each converter obtains target output reactive power when an output current of the converter starts to increase from an initial current, obtains a reactive power compensation parameter based on the three-phase output voltages. Further, each converter obtains compensated output reactive power of the converter based on the reactive power compensation parameter and adjusts actual output reactive power of the converter based on the target output reactive power and the compensated output reactive power, so that an absolute value of a difference between common-mode output voltages of any two of the at least two adjusted converters is less than a difference threshold.
    Type: Application
    Filed: October 12, 2022
    Publication date: April 13, 2023
    Applicant: Huawei Digital Power Technologies Co., Ltd.
    Inventors: Xinyu YU, Yuan YAO, Fuqiang XU, Kai XIN
  • Patent number: 11621212
    Abstract: In an apparatus for coupling integrated circuits to printed circuit boards, a backing plate with manufactured features on the top surface includes a module lid; a planar structure; a device seated in the planar structure, with the module lid in contact with the top surface of the device; and a backing plate that contains manufactured features on one side. The backing plate is in contact with the planar structure, and a plurality of fastening mechanisms couple together the lid, the device, the planar structure, and the backing plate.
    Type: Grant
    Filed: December 19, 2019
    Date of Patent: April 4, 2023
    Assignee: International Business Machines Corporation
    Inventors: Yuan Yao, Shurong Tian, Todd Edward Takken
  • Publication number: 20230095682
    Abstract: Disclosed are an indoor navigating system and an indoor navigating method based on vision. The indoor navigating method comprises capturing a material channel image; segmenting the material channel image to obtain a material pushing machine and a walkable area from the material channel image, and determining boundaries of the material pushing machine and boundaries of the walkable area; obtaining a distance between a left boundary of the material pushing machine and a left rail of a material channel and/or a distance between a right boundary of the material pushing machine and a right rail of the material channel; obtaining a lateral deviation distance of the material pushing machine, and determining a course angle; and adjust an actual moving direction of the material pushing machine according to the course angle.
    Type: Application
    Filed: May 19, 2020
    Publication date: March 30, 2023
    Inventors: Di Wu, WEN-QUAN ZHAO, LIANG CHEN, QI-CHANG ZHANG, WEN-FANG XIAO, ZHI YANG, Yuan Yao
  • Publication number: 20230078561
    Abstract: A package structure is disclosed. The package structure includes processor die connected to a top surface of a package substrate. The package structure further includes a DC-DC power converter attached to a bottom surface of the package substrate. The DC-DC power converter is located at least within an open area of an interconnect component that connects the bottom surface of the package substrate and a top surface of a motherboard.
    Type: Application
    Filed: September 16, 2021
    Publication date: March 16, 2023
    Inventors: Xin Zhang, Todd Edward Takken, Yuan Yao
  • Publication number: 20230066905
    Abstract: The present disclosure provides a wafer. The wafer includes a die, a scribe line adjacent to the die, and a test circuit adjacent to the scribe line. The test circuit includes a first switch, a second switch, and a third switch. The first switch has a first node coupled to a first device-under-test and a second node coupled to a first signal supply node. The second switch has a first node coupled to the second DUT and a second node coupled to the first signal supply node. The third switch has a first node directly coupled to the first DUT and the second DUT. The third switch has a second node coupled to a second signal supply node. The third switch selectively couples both of the first DUT and the second DUT to the second signal supply node.
    Type: Application
    Filed: August 27, 2021
    Publication date: March 2, 2023
    Inventors: CHIA-WEI HUANG, WEI-JHIH WANG, CHENG-CHENG KUO, YUAN-YAO CHANG
  • Publication number: 20230068503
    Abstract: A chip structure is provided. The chip structure includes a substrate. The chip structure includes a first conductive line over the substrate. The chip structure includes an insulating layer over the substrate and the first conductive line. The chip structure includes a conductive pillar over the insulating layer. The conductive pillar is formed in one piece, the conductive pillar has a lower surface and a bottom protruding portion protruding from the lower surface, the bottom protruding portion passes through the insulating layer over the first conductive line, the bottom protruding portion is in direct contact with the first conductive line, and a first linewidth of a first portion of the first conductive line under the conductive pillar is less than a width of the conductive pillar. The chip structure includes a solder bump on the conductive pillar. The solder bump is in direct contact with the conductive pillar.
    Type: Application
    Filed: August 30, 2021
    Publication date: March 2, 2023
    Inventors: Shan-Yu HUANG, Ming-Da CHENG, Hsiao-Wen CHUNG, Ching-Wen HSIAO, Li-Chun HUNG, Yuan-Yao CHANG, Meng-Hsiu HSIEH
  • Patent number: 11591221
    Abstract: This present invention provides a microporous carbon nanospheres, method for synthesizing and activating thereof, the method comprising: adding and mixing well deionized water, absolute ethanol, triblock copolymer, ammonia solution, resorcinol and formaldehyde solution; separating solid and liquid of the mixture solution, then drying the separated solid substrate to have a dried solid substrate; sintering the dried solid substrate surrounding by nitrogen twice and collecting microporous carbon nanospheres after cooling down. Further sintering to activate these microporous carbon nanospheres surrounding by carbon dioxide, and collecting activated microporous carbon nanospheres after cooling down. Microporous carbon nanospheres and activated microporous carbon nanospheres synthesized by this present invention have spherical structure, small size and high the specific surface area, and the process is simplified, cost-effective and environment-friendly.
    Type: Grant
    Filed: September 30, 2019
    Date of Patent: February 28, 2023
    Assignee: NATIONAL CHUNG CHENG UNIVERSITY
    Inventors: Yuan-Yao Li, Cheng-Yen Tsai, Li-Ming Chiang
  • Patent number: 11586948
    Abstract: An IoT system includes a computing module for controlling an integral function of the system and including an analysis unit and a machine learning unit. The analysis unit is capable of operational analysis and creating a predictive model and creating a predictive model according to the data analyzed. The machine learning unit has an algorithm function to create a corresponding learning model. An IoT module is electrically connected to the computing module to serve as an intermediate role. At least one detection unit is electrically connected to the IoT module and disposed in soil to detect data of environmental and soil conditions and sends the data detected to the computing module for subsequent analysis.
    Type: Grant
    Filed: October 20, 2019
    Date of Patent: February 21, 2023
    Assignee: National Yang Ming Chiao Tung University
    Inventors: Wen-Liang Chen, Lung-Chieh Chen, Szu-Chia Chen, Wei-Han Chen, Chun-Yu Chu, Yu-Chi Shih, Yu-Ci Chang, Tzu-I Hsieh, Yen-Ling Chen, Li-Chi Peng, Meng-Zhan Lee, Jui-Yu Ho, Chi-Yao Ku, Nian-Ruei Deng, Yuan-Yao Chan, Erick Wang, Tai-Hsiang Yen, Shao-Yu Chiu, Jiun-Yi Lin, Yun-Wei Lin, Fung Ling Ng, Yi-Bing Lin, Chin-Cheng Wang
  • Publication number: 20230049638
    Abstract: Disclosed are a material pushing apparatus and a charging method thereof, and a material pushing machine and a material pushing method thereof. The material pushing apparatus comprises a charger (200) and a material pushing machine (100), and when the material pushing machine moves to the position where the charger is located, the charger can automatically supplement electric energy to the material pushing machine, such that the automation level of the material pushing apparatus is improved.
    Type: Application
    Filed: May 19, 2020
    Publication date: February 16, 2023
    Inventors: LIANG CHEN, CHAO ZHENG, WEI ZHOU, YI-CHENG WANG, Di Wu, Yuan Yao, XUE-SONG WANG, SHENG LUO, XIAO-FENG ZHOU
  • Publication number: 20230014148
    Abstract: The present disclosure provides a semiconductor wafer. The semiconductor wafer includes: a scribe line between a first row of dies and a second row of dies; and a benchmark circuit disposed adjacent to the scribe line and electrically coupled to a first conductive contact and a second conductive contact. The benchmark circuit includes a first device-under-test (DUT); a second DUT; a first switching circuit configured to selectively couple the first DUT and the second DUT to the first conductive contact; and a second switching circuit configured to selectively couple the first DUT and the second DUT to the second conductive contact.
    Type: Application
    Filed: July 16, 2021
    Publication date: January 19, 2023
    Inventors: CHU-FENG LIAO, HUNG-PING CHENG, YUAN-YAO CHANG, SHUO-WEN CHANG
  • Patent number: 11532421
    Abstract: Embodiment of the present invention includes a magnetic structure and a magnetic structure used in a direct current (DC) to DC energy converter. The magnetic structure has an E-core and a plate, with the plate positioned in contact or in near contact with the post surfaces of the E-core. The E-core has a base, a no-winding leg, a transformer leg, and an inductor leg. The no-winding leg, the transformer leg, and the inductor leg are perpendicular and magnetically in contact with the base. The plate is a flat slab with lateral dimensions generally larger than its thickness. The plate has a plate nose that overlaps a top no-winding leg surface of the no-winding leg with a no-winding gap area to form a no-winding gap with a no-winding gap reluctance. The plate also has a plate end that overlaps a top inductor leg surface of the inductor leg with an inductor gap area to form an inductor gap with an inductor gap reluctance. In some embodiments, e.g.
    Type: Grant
    Filed: February 12, 2021
    Date of Patent: December 20, 2022
    Assignee: International Business Machines Corporation
    Inventors: Yuan Yao, Todd Edward Takken, Andrew Ferencz, Xin Zhang, Liam Daley McAuliffe
  • Publication number: 20220390193
    Abstract: A heat exchanging assembly, comprising a heat exchanger core body. The heat exchanger core body comprises first-type plates and second-type plates; each first-type plate has a first orifice, a second orifice, and a third orifice; each second-type plate has a first orifice and a second orifice; along the length or width direction of the heat exchange core body, the third orifice is located between the first orifice and the second orifice; a first flow channel has a first partial fluid path, a second partial fluid path, a third partial fluid path, and an inter-plate path; the first partial fluid path is formed at the first orifice; the second partial fluid path is formed at the second orifice; and the inter-plate path is communicated with the first partial fluid path, the second partial fluid path, and the third partial fluid path.
    Type: Application
    Filed: December 28, 2020
    Publication date: December 8, 2022
    Applicant: ZHEJIANG SANHUA AUTOMOTIVE COMPONENTS CO., LTD.
    Inventors: Rongrong Zhang, Yuan Yao, Yong Xu, Weixin Jiang
  • Publication number: 20220367299
    Abstract: One aspect of this description relates to a testing apparatus including an advance process control monitor (APCM) in a first wafer, a plurality of pads disposed over and coupled to the APCM. The plurality of pads are in a second wafer. The testing apparatus includes a testing unit disposed between the first wafer and the second wafer. The testing unit is coupled to the APCM. The testing unit includes a metal structure within a dielectric. The testing apparatus includes a plurality of through silicon vias (TSVs) extending in a first direction from the first wafer, through the dielectric of the testing unit, to the second wafer.
    Type: Application
    Filed: May 12, 2021
    Publication date: November 17, 2022
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Shuo-Wen Chang, Yu-Hsien Li, Min-Tar Liu, Yuan-Yao Chang
  • Publication number: 20220361392
    Abstract: A view-based method for controlling the driving of agricultural machinery includes collecting ground information from images; identifying a target operation area according to the ground image information; determining a navigation route for the agricultural machinery within the target operation area; and determining whether the navigation route is reliable; detecting manual driving signal of the user and allowing manual driving of the agricultural machinery according to the manual driving signal if the navigation route is not reliable; and determining driving adjustment parameters for the navigation route and current driving attitude if the navigation route is found reliable. A system for driving agricultural machinery, a device applying the method, and a non-volatile storage medium are also disclosed.
    Type: Application
    Filed: May 8, 2022
    Publication date: November 17, 2022
    Inventors: Di Wu, Yuan Yao, WEN-QUAN ZHAO, BO WANG, HONG-XIN LI
  • Patent number: 11502412
    Abstract: An antenna configured to transmit or receive a signal is provided. The antenna includes a substantially transparent base substrate and an antenna electrode on the substantially transparent base substrate. The antenna electrode includes a substantially transparent conductive layer, and a first conductive line abutting an edge portion of the substantially transparent conductive layer and electrically connected to the edge portion of the substantially transparent conductive layer. An electrical conductivity of the first conductive line is greater than an electrical conductivity of the substantially transparent conductive layer.
    Type: Grant
    Filed: June 17, 2019
    Date of Patent: November 15, 2022
    Assignees: BOE Technology Group Co., Ltd., Beijing University of Posts and Telecommunications
    Inventors: Yuan Yao, Lei Wang, Tienlun Ting
  • Patent number: 11495647
    Abstract: Disclosed herein is a display substrate of a display panel, comprising: a support; a second layer on the support; a window extending through the second layer and optically coupled with an image sensor; and a sidewall at least partially surrounding the window; wherein the sidewall is configured to attenuate transmission of light through the sidewall.
    Type: Grant
    Filed: February 2, 2019
    Date of Patent: November 8, 2022
    Assignees: Chengdu BOE Optoelectronics Technology Co., Ltd., BEIJING BOE TECHNOLOGY DEVELOPMENT CO., LTD.
    Inventors: Yonglin Guo, Tingliang Liu, Kai Zhang, Yuan Yao, Yi Zhang