Abstract: A thick document conveying device includes a paper pickup mechanism. The paper pickup mechanism has a pick roller base, a pick roller axle, a pick roller, a switching assembly, a first universal coupling, a driving mechanism, a second universal coupling, a bearing and a gear. The pick roller axle and the pick roller are located in the pick roller base. The switching assembly is located under the pick roller base. The first universal coupling is connected to the pick roller axle. The driving mechanism is sleeved on the first universal coupling. The second universal coupling is connected to the driving mechanism. The bearing is connected to the driving mechanism. The gear is connected to the bearing. As described above, both a thick document and a thin document can be adapted.

Abstract: Disclosed herein are system, method, and computer program product embodiments for visualizing sound coverage in a venue. An embodiment operates by receiving audio content from an audio source, determining audio signal properties of the audio content, where the audio signal properties comprise one or more spectral, temporal, spatial components (e.g., energy, spectrum or directivity), receiving an audio system configuration of loudspeakers or sound beams of a venue, visualizing the audio signal based on a mapping of an intersection of a unique volumetric beam of colored light, representing the spectral, temporal, spatial components, with a portion of the venue and displaying the visualized audio signal as a virtual representation of sound coverage of the portion of the venue.

Abstract: A downhole throttling device based on wireless control includes an inlet nozzle, a throttling assembly, an electrical sealing cylinder, a gas guide cylinder, a lower adapter sleeve, an end socket, a female sleeve, and electrical components. The inlet nozzle is connected to the throttling assembly, the throttling assembly is connected to the electrical sealing cylinder and the gas guide cylinder, the electrical sealing cylinder and the gas guide cylinder are both connected to the lower adapter sleeve, the lower adapter sleeve is respectively connected to the end socket and the female sleeve, and the electrical components are arranged in the electrical sealing cylinder. A throttling effect is achieved by detecting the temperature and pressure in a tube by a temperature/pressure sensor in the electrical components and controlling a motor to rotate a movable valve in the throttling assembly by a circuit control assembly, thereby achieving wireless control over downhole throttling.

Abstract: Systems and methods for rendering spatial audio in accordance with embodiments of the invention are illustrated. One embodiment includes a spatial audio system, including a primary network connected speaker, including a plurality of sets of drivers, where each set of drivers is oriented in a different direction, a processor system, memory containing an audio player application, wherein the audio player application configures the processor system to obtain an audio source stream from an audio source via the network interface, spatially encode the audio source, decode the spatially encoded audio source to obtain driver inputs for the individual drivers in the plurality of sets of drivers, where the driver inputs cause the drivers to generate directional audio.

Abstract: A bonding tool includes a gas supply line that may extend directly between valves associated with one or more gas supply tanks and a processing chamber such that gas supply line is uninterrupted without any intervening valves or other types of structures that might otherwise cause a pressure buildup in the gas supply line between the processing chamber and the valves associated with the one or more gas supply tanks. The pressure in the gas supply line may be maintained at or near the pressure in the processing chamber so that gas provided to the processing chamber through the gas supply line does not cause a pressure imbalance in the processing chamber, which might otherwise cause early or premature contact between semiconductor substrates that are to be bonded in the processing chamber.

Abstract: An electronic system using a USB type-C port and an abnormal elimination method thereof are provided. After sending a hard reset request to a power adapter, a host device determines whether to enter an error recovery state according to whether an initialization signal is at a first preset level for a first preset time, so that the initialization signal is changed to a second preset level, or whether to force the initialization signal to change to the second preset level according to whether the initialization signal is at the first preset level for a second preset time.

Abstract: A heat sink structure includes a base seat and at least one heat dissipation unit. The base seat has a first face and a second face. At least one extension column extends from the second face of the base seat. The heat dissipation unit is disposed above the base seat and spaced from the base seat by a gap. The extension column serves to restrict or secure the heat dissipation unit in horizontal and vertical directions. The heat dissipation unit with different structures provides multiple heat dissipation features to enhance the entire heat dissipation performance.

Abstract: Provided herein are system, method, and computer program product embodiments for providing an interactive visual representation of loudspeaker sound coverage in a venue. An embodiment enables temporal, spectral, and spatial audio metering from digital audio to venue acoustics. This technology can visualize audio capabilities of one or more loudspeaker arrays using light to provide visualization grouping of large audio channel outputs. This can allow spatial information to be visually represented by mapping directional sound to light beams.

Abstract: Disclosed herein are system, method, and computer program product embodiments for visualizing sound coverage in a venue. An embodiment operates by receiving audio content from an audio source, determining audio signal properties of the audio content, where the audio signal properties comprise one or more spectral, temporal, spatial components (e.g., energy, spectrum or directivity), receiving an audio system configuration of loudspeakers or sound beams of a venue, visualizing the audio signal based on a mapping of an intersection of a unique volumetric beam of colored light, representing the spectral, temporal, spatial components, with a portion of the venue and displaying the visualized audio signal as a virtual representation of sound coverage of the portion of the venue.

Abstract: An electronic device and a manufacturing method thereof are provided. The electronic device includes a substrate, a plurality of light-emitting elements, and a reflective structure. A plurality of light-emitting elements is disposed on the substrate. The reflective structure is disposed on the substrate and located between adjacent two of the plurality of light-emitting elements. The thickness of the reflective structure is designated as Y1, half of a pitch between the adjacent two of the plurality of light-emitting elements is designated as X1, and the light that is emitted by one of the adjacent two of the plurality of light-emitting elements has an emitting angle, and half of the emitting angle is designated as ?. X1, ?, and Y1 conform to the following relationship: X1×0.5×tan(90??)?Y1?X1×1.8×tan(90??).

Abstract: Systems and methods for rendering spatial audio in accordance with embodiments of the invention are illustrated. One embodiment includes a spatial audio system, including a primary network connected speaker, including a plurality of sets of drivers, where each set of drivers is oriented in a different direction, a processor system, memory containing an audio player application, wherein the audio player application configures the processor system to obtain an audio source stream from an audio source via the network interface, spatially encode the audio source, decode the spatially encoded audio source to obtain driver inputs for the individual drivers in the plurality of sets of drivers, where the driver inputs cause the drivers to generate directional audio.

Abstract: A heat transfer member reinforcement structure includes a main body. The main body has a first side, a second side and a reinforcement member. The reinforcement member is selectively disposed between the first and second sides or inlaid in a sink formed on the first side. The reinforcement member is connected with the main body to enhance the structural strength of the main body.

Abstract: A manufacturing method of thermal module includes steps of: providing at least one aluminum heat conduction component and at least one copper heat conduction component; disposing a copper embedding layer, by means of physical or chemical processing, a copper embedding layer being disposed on a processed section or processed face of the aluminum heat conduction component, which processed section or processed face is correspondingly assembled with the copper heat conduction component; and welding and connecting, the surface of the aluminum heat conduction component, on which the copper embedding layer is disposed, being securely welded and connected with the copper heat conduction component so as to securely connect the aluminum heat conduction component with the copper heat conduction component. By means of the copper embedding layer, the aluminum heat conduction component can be welded and connected with other heat conduction components made of heterogeneous materials and the same material.

Abstract: A thermal module structure includes an aluminum base having an upper and a lower surface, at least one L-shaped copper heat pipe, a first aluminum fin assembly, a second aluminum fin assembly, and at least one copper embedding layer. The copper heat pipe includes a heat absorption section fitted on the aluminum base, and a heat dissipation section connected to the second aluminum fin assembly. The copper embedding layers are provided on the aluminum base at areas corresponding to the first aluminum fin assembly and the heat absorption section of the copper heat pipe, and on a bottom surface of the first aluminum fin assembly that is to be connected to the aluminum base. Thus, the first aluminum fin assembly and the copper heat pipe can be directly welded to the aluminum base via the copper embedding layers without the need of electroless nickel plating.

Abstract: A heat sink assembly with heat pipe includes at least one aluminum fin assembly and at least one copper heat pipe, which are made of dissimilar metal materials. The aluminum fin assembly includes at least one area to be connected to other members of the heat sink assembly, such as a groove. A copper embedding layer is provided on a groove inner surface of the groove for connecting the aluminum fin assembly to the copper heat pipe. By providing the copper embedding layer, the connection between the aluminum fin assembly and the copper heat pipe made of dissimilar metal materials is improved, and the problems of eutectic grains formed on the surface of the aluminum fin assembly and environmental pollution caused by electroless nickel plating are eliminated.

Abstract: A heat dissipation device assembly includes an aluminum base seat, an aluminum radiating fin assembly and at least one U-shaped copper heat pipe, which is upright arranged or horizontally arranged. The aluminum base seat has at least one connection section. A copper embedding layer is disposed on the connection section. The aluminum radiating fin assembly is assembled and disposed on the aluminum base seat. The copper heat pipe has a heat dissipation section and a heat absorption section respectively connected on the aluminum radiating fin assembly and the connection section of the aluminum base seat. By means of the copper embedding layer, the aluminum base seat and the copper heat pipe can be directly welded and connected with each other without chemical nickel treatment.

Abstract: A heat sink structure with heat pipe includes at least one aluminum fin assembly and at least one copper heat pipe, which are made of dissimilar metal materials. The aluminum fin assembly includes at least one through hole and al least one groove, in which a copper embedding layer is provided for contacting with and connected to the copper heat pipe. By providing the copper embedding layer, the connection between the aluminum fin assembly and the copper heat pipe made of dissimilar metal materials is improved, and the problems of eutectic grains formed on the surface of the aluminum fin assembly and environmental pollution caused by electroless nickel plating are eliminated.

Abstract: A heat dissipation device includes an aluminum base seat and any or both of at least one copper two-phase fluid component and a copper heat conduction component. The aluminum base seat has an upper face and a lower face. A connection section is formed on the lower face and a copper embedding layer is disposed on the connection section. Any or both of the copper two-phase fluid component and the copper heat conduction component are disposed on the connection section and connected with the copper embedding layer. By means of the copper embedding layer disposed on the connection section, the aluminum base seat can be directly welded and connected with the copper two-phase fluid component and/or the copper heat conduction component made of heterogeneous metal materials without chemical nickel treatment procedure.

Abstract: A thermal module structure includes an aluminum base having a heat pipe receiving groove formed on one side thereof; a heat dissipation unit including a plurality of radiation fin assemblies or heat sinks and being provided with a first heat pipe receiving section; a plurality of heat pipes made of a copper material and respectively having a heat absorption section and a horizontally extended condensation section; and a copper embedding layer provided on surfaces of the heat pipe receiving groove and the first heat pipe receiving section. The aluminum base and the heat dissipation unit are horizontally parallelly arranged. The heat absorption sections are fitted in the heat pipe receiving groove, and the condensation sections are extended through the first heat pipe receiving section. With the copper embedding layer, the aluminum base and the heat dissipation unit can be directly welded to the heat pipes.

Abstract: A thermal module assembling structure includes an aluminum base seat which has a heat absorption side, a heat conduction side and a connection section. The connection section is selectively disposed on the heat absorption side, the heat conduction side or embedded in the aluminum base seat (between the heat absorption side and the heat conduction side). The connection section is correspondingly connected with at least one copper heat pipe. A copper embedding layer is disposed on a portion of the connection section, which portion is in contact and connection with the copper heat pipe. A welding material layer is disposed between the copper embedding layer and the copper heat pipe, whereby the aluminum base seat and the copper heat pipe can be more securely connected with each other. The conventional chemical nickel plating is replaced with the copper embedding layer so as to improve the problem of environmental pollution, etc.