Patents by Inventor Yuan Yi
Yuan Yi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20190057927Abstract: A component coupled to a heat dissipation unit, allowing a screwing element to be pivotally coupled to a heat dissipation unit, includes a body, a stop portion, a first inner engagement portion, a second inner engagement portion and a first outer engagement portion. The body has a first part and a second part and forms therein a through hole which extends axially. The stop portion is circumferentially disposed at the rim of the first or second part. The first inner engagement portion has checking plates and corresponds in position to the stop portion. The second inner engagement portion has stop blocks disposed at the first or second part. The first outer engagement portion is disposed at the rim of the body and opposite the stop portion. The screwing element is fixed to the heat dissipation unit temporarily but firmly, thereby preventing disintegration and disconnection during transport.Type: ApplicationFiled: September 25, 2018Publication date: February 21, 2019Inventors: Sheng-Huang Lin, Yuan-Yi Lin
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Publication number: 20190019497Abstract: Methods and systems for audio content production are provided whereby expressive speech is generated via acoustic elements extracted from human input. One of the inputs to the system is a human designating an intonation to be applied onto text-to-speech (TTS) generated synthetic speech. The human intonation includes the pitch contour and other acoustic features extracted from the speech. The system is designed to be used for, and is capable of speech generation, speech analysis, speech transformation, and speech re-synthesis at the acoustic level.Type: ApplicationFiled: July 12, 2018Publication date: January 17, 2019Applicant: I AM PLUS Electronics Inc.Inventors: So Young SHIN, Yuan-Yi FAN, Vidyut SAMANTA
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Patent number: 10181093Abstract: A scanning device includes a base, an upper cover pivotally covered to the base, a motor mounted to the base, two roller assemblies, a sensor mounted in the first channel, and a card supporting mechanism. A first channel, a scanning channel and a second channel are formed between the upper cover and the base. The scanning channel has a scanning read line. The first channel, the scanning channel and the second channel are communicated with one another. The two roller assemblies are connected with and driven by the motor. The card supporting mechanism is mounted to the base. The card supporting mechanism includes a blocking board movably disposed behind the second channel along the longitudinal direction, and a front surface of the blocking board is parallel to the scanning read line and orthogonal to the second channel.Type: GrantFiled: April 14, 2017Date of Patent: January 15, 2019Assignee: FOXLINK IMAGE TECHNOLOGY CO., LTD.Inventors: Yuan Yi Lin, Hung Ming Chang
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Publication number: 20180300593Abstract: A scanning device includes a base, an upper cover pivotally covered to the base, a motor mounted to the base, two roller assemblies, a sensor mounted in the first channel, and a card supporting mechanism. A first channel, a scanning channel and a second channel are formed between the upper cover and the base. The scanning channel has a scanning read line. The first channel, the scanning channel and the second channel are communicated with one another. The two roller assemblies are connected with and driven by the motor. The card supporting mechanism is mounted to the base. The card supporting mechanism includes a blocking board movably disposed behind the second channel along the longitudinal direction, and a front surface of the blocking board is parallel to the scanning read line and orthogonal to the second channel.Type: ApplicationFiled: April 14, 2017Publication date: October 18, 2018Inventors: Yuan Yi Lin, Hung Ming Chang
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Publication number: 20180273649Abstract: The invention provides a crosslinked polymer, a hydrogel, a water-based fracturing fluid comprising the same, and methods of making and using thereof. The crosslinked polymer of the invention is represented by formula (I), wherein * denotes a combining site with a polymer starting material and *? denotes an optional combining site with the polymer starting material, wherein the combining sites denoted by * and *? may be located in the same polymer molecule, or in different polymer molecules, but there are at least two combining sites located in different polymer molecules; X1 and X2, which may be the same or different, are independently an oxy (—O—) or imino (—NH—) group; X3 is an oxy (—O—) or imino (—NH—) group when *? denotes a combining site with the polymer starting material, or X3 is a halogen, NH2 or OH when *? isn't a combining site with the polymer starting material.Type: ApplicationFiled: May 26, 2016Publication date: September 27, 2018Inventor: Yuan Yi
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Patent number: 10021813Abstract: A thermal module assembling structure includes a heat sink, at least one leaf spring, at least one holding member and a shaft rod. The heat sink has a base seat and multiple radiating fins disposed on the base seat. At least one perforation is formed on each of two opposite sides of the base seat. The heat sink is correspondingly assembled on the leaf spring. At least one engagement post is disposed on the leaf spring corresponding to the perforation. The holding member is slidably capped on the engagement post and has a first end and a second end. The second end is formed with a socket having an internal receiving space in which a raised section is formed. The engagement post is inlaid in the receiving space. The shaft rod passes through the heat sink. Two ends of the shaft rod are respectively connected with the engagement posts.Type: GrantFiled: October 13, 2015Date of Patent: July 10, 2018Assignee: ASIA VITAL COMPONENTS CO., LTD.Inventors: Yuan-Yi Lin, Yen-Lin Chu
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Patent number: 9989321Abstract: A heat dissipation device includes a heat dissipation member, a heat transfer member, and a reinforcing member. The heat transfer member has one side attached to the heat dissipation member, and two opposite lateral edges thereof are respectively provided with at least one connection portion and at least one through hole. The reinforcing member is connected to the other side of the heat transfer member, and two opposite lateral edges thereof are respectively formed with at least one mating connection portion for correspondingly connecting to the connection portion. The reinforcing member is provided at a central portion with an opening. With these arrangements, the heat transfer member can bear a larger locking force when the heat dissipation member is locked thereto, and is also prevented from deformation.Type: GrantFiled: November 20, 2014Date of Patent: June 5, 2018Assignee: Asia Vital Components Co., Ltd.Inventor: Yuan-Yi Lin
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Publication number: 20170245395Abstract: A component coupled to a heat dissipation unit, allowing a screwing element to be pivotally coupled to a heat dissipation unit, includes a body, a stop portion, a first inner engagement portion, a second inner engagement portion and a first outer engagement portion. The body has a first part and a second part and forms therein a through hole which extends axially. The stop portion is circumferentially disposed at the rim of the first or second part. The first inner engagement portion has checking plates and corresponds in position to the stop portion. The second inner engagement portion has stop blocks disposed at the first or second part. The first outer engagement portion is disposed at the rim of the body and opposite the stop portion. The screwing element is fixed to the heat dissipation unit temporarily but firmly, thereby preventing disintegration and disconnection during transport.Type: ApplicationFiled: February 24, 2016Publication date: August 24, 2017Inventors: Sheng-Huang Lin, Yuan-Yi Lin
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Publication number: 20170105316Abstract: A thermal module assembling structure includes a heat sink, at least one leaf spring, at least one holding member and a shaft rod. The heat sink has a base seat and multiple radiating fins disposed on the base seat. At least one perforation is formed on each of two opposite sides of the base seat. The heat sink is correspondingly assembled on the leaf spring. At least one engagement post is disposed on the leaf spring corresponding to the perforation. The holding member is slidably capped on the engagement post and has a first end and a second end. The second end is formed with a socket having an internal receiving space in which a raised section is formed. The engagement post is inlaid in the receiving space. The shaft rod passes through the heat sink. Two ends of the shaft rod are respectively connected with the engagement posts.Type: ApplicationFiled: October 13, 2015Publication date: April 13, 2017Inventors: Yuan-Yi Lin, Yen-Lin Chu
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Publication number: 20170080533Abstract: A method is disclosed for manufacturing a heat dissipation device including a substrate and at least one heat pipe, which is pressed to tightly fit in a receiving groove defined by the substrate to make two opposite lateral sides of the heat pipe tightly respectively in contact with two opposite inner sides of the receiving groove to tightly connect the substrate to the heat pipe to solve the problem existing in the conventional heat dissipation device of a poor levelness of the receiving groove on a top and a bottom side of the substrate due to secondary processing, so as to have reduced manufacturing costs and provide uniform temperature effect.Type: ApplicationFiled: September 17, 2015Publication date: March 23, 2017Inventors: Sheng-Huang Lin, Yuan-Yi Lin
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Publication number: 20170082377Abstract: A heat dissipation device includes a substrate and at least one heat pipe, which is pressed to tightly fit in a receiving groove defined by the substrate to make two opposite lateral sides of the heat pipe tightly respectively in contact with two opposite inner sides of the receiving groove to tightly connect the substrate to the heat pipe to solve the problem existing in the conventional heat dissipation device of a poor levelness of the receiving groove on a top and a bottom side of the substrate, so as to have reduced manufacturing costs and provide uniform temperature effect.Type: ApplicationFiled: September 17, 2015Publication date: March 23, 2017Inventors: Sheng-Huang Lin, Yuan-Yi Lin
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Publication number: 20160150672Abstract: A heat dissipation device includes a heat dissipation member, a heat transfer member, and a reinforcing member. The heat transfer member has one side attached to the heat dissipation member, and two opposite lateral edges thereof are respectively provided with at least one connection portion and at least one through hole. The reinforcing member is connected to the other side of the heat transfer member, and two opposite lateral edges thereof are respectively formed with at least one mating connection portion for correspondingly connecting to the connection portion. The reinforcing member is provided at a central portion with an opening. With these arrangements, the heat transfer member can bear a larger locking force when the heat dissipation member is locked thereto, and is also prevented from deformation.Type: ApplicationFiled: November 20, 2014Publication date: May 26, 2016Inventor: Yuan-Yi Lin
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Patent number: 9072176Abstract: An assembling structure of heat dissipation device is applied to a circuit board. A heat generation unit is disposed on one side of the circuit board. The assembling structure of the heat dissipation device includes a heat dissipation unit, at least one latch member and at least one retainer member. The heat dissipation unit is attached to one side of the heat generation unit, which side is distal from the circuit board. At least one latch section outward extends from an edge of the heat dissipation unit. The latch member is fixedly disposed on the circuit board and formed with at least one opening and at least one perforation. The latch section is correspondingly latched in the opening. An elastic member is fitted on the retainer member. The retainer member correspondingly passes through the perforation to fix the latch member on the circuit board.Type: GrantFiled: May 28, 2013Date of Patent: June 30, 2015Assignee: ASIA VITAL COMPONENTS CO., LTD.Inventor: Yuan-Yi Lin
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Patent number: 8921097Abstract: The present invention relates to a method of expressing an immunotoxin in Pichia pastoris strain mutated to toxin resistance comprising a) growing the Pichia pastoris in a growth medium comprising an enzymatic digest of protein and yeast extract and maintaining a dissolved oxygen concentration at 40% and above; and b) performing methanol induction with a limited methanol feed of 0.5-0.75 ml/min/IO L of initial volume during induction along with a continuous infusion of yeast extract at a temperature below 17.5° C., antifoaming agent supplied up to 0.07%, agitation reduced to 400 RPM, and the induction phase extended out to 163 h.Type: GrantFiled: November 30, 2010Date of Patent: December 30, 2014Assignee: The United States of America, as represented by the Secretary, Department of Health & Human ServicesInventors: David M. Neville, Jr., Jung-Hee Woo, Yuan-Yi Liu
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Publication number: 20140353008Abstract: An assembling structure of heat dissipation device is applied to a circuit board. A heat generation unit is disposed on one side of the circuit board. The assembling structure of the heat dissipation device includes a heat dissipation unit, at least one latch member and at least one retainer member. The heat dissipation unit is attached to one side of the heat generation unit, which side is distal from the circuit board. At least one latch section outward extends from an edge of the heat dissipation unit. The latch member is fixedly disposed on the circuit board and formed with at least one opening and at least one perforation. The latch section is correspondingly latched in the opening. An elastic member is fitted on the retainer member. The retainer member correspondingly passes through the perforation to fix the latch member on the circuit board.Type: ApplicationFiled: May 28, 2013Publication date: December 4, 2014Applicant: ASIA VITAL COMPONENTS CO., LTD.Inventor: Yuan-Yi Lin
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Patent number: 8816084Abstract: The present invention relates to a X-form crystal of 17-cyclopropylmethyl-3,14?-dihydroxy-4,5?-epoxy-6?-[N-methyl-trans-3-(3-furyl)acrylamido]morphinan hydrochloride and the manufacturing method thereof, wherein the X-form crystal of the compound has characteristic diffraction peaks at positions of 2? of 13.6°(±0.2°), 17.2°(±0.2°), 19.1°(±0.2°), 23.2°(±0.2°), and 23.8°(±0.2°) in a powder X-ray diffraction pattern thereof. The present invention also relates to a pharmaceutical composition comprising the above-mentioned X-form crystal of morphinan derivative hydrochloride.Type: GrantFiled: January 28, 2014Date of Patent: August 26, 2014Assignee: Everlight Chemical Industrial CorporationInventors: Yuan-Yi Wang, Yu-Kai Li, Yu-Ting Su, Chia-Chen Hung, Chi-Hsiang Yao
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Publication number: 20140198019Abstract: A display apparatus and display panel thereof are provided. The display panel includes pixels, first lines, second lines, and data lines. The pixels are located at a display area of the display panel. The first lines are located on a first side of the display area and receive first data signals. The second lines are located on a second side of the display area and receive second data signals. The second side is opposite to the first side. The data lines are electrically connected to the corresponding pixels, respectively. Each of the (4i+1)th and (4i+2)th data lines is electrically connected to one of the (2i+1)th and (2i+2)th first lines exclusively, and each of the (4i+3)th and (4i+4)th data lines is electrically connected to one of the (2i+1)th and (2i+2)th second lines exclusively, wherein i is an integer greater than or equal to 0.Type: ApplicationFiled: March 7, 2013Publication date: July 17, 2014Applicant: CHUNGHWA PICTURE TUBES, LTD.Inventors: Yi-Ching Wei, Yuan-Yi Liao, Sheh-Cha Cho
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Patent number: 8710062Abstract: This invention relates to piperazinedione compounds shown in the specification. These compounds are tyrosine kinase inhibitors and can be used to treat cancer.Type: GrantFiled: February 24, 2012Date of Patent: April 29, 2014Assignee: Taipei Medical UniversityInventors: Hui-po Wang, Che-Ming Teng, Chun-Li Wang, Jih-hwa Guh, Shiow-Lin Pan, Yuan-Yi Wang, Jang-Feng Lian
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Publication number: 20130287790Abstract: Methods, compositions, and kits are provided for the use of JAM-A in diagnosing and treating leukemia. These methods, compositions, and kits find many uses, for example in diagnosing an individual with a leukemia, classifying a leukemia, providing a prognosis to an individual with a leukemia, treating an individual with a leukemia, screening candidate agents for the ability to treat a leukemia, and in basic research to better understand the molecular and cellular basis of leukemia.Type: ApplicationFiled: March 14, 2013Publication date: October 31, 2013Inventors: Faye Yuan-yi Hsu, Garry Nolan, Yury Goltsev
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Publication number: 20130217861Abstract: The present invention relates to a method of expressing an immunotoxin in Pichia pastoris strain mutated to toxin resistance comprising a) growing the Pichia pastoris in a growth medium comprising an enzymatic digest of protein and yeast extract and maintaining a dissolved oxygen concentration at 40% and above; and b) performing methanol induction with a limited methanol feed of 0.5-0.75 ml/min/IO L of initial volume during induction along with a continuous infusion of yeast extract at a temperature below 17.5° C., antifoaming agent supplied up to 0.07%, agitation reduced to 400 RPM, and the induction phase extended out to 163 h.Type: ApplicationFiled: November 30, 2010Publication date: August 22, 2013Applicant: The USA, as represented by the Secretary, Dept. of Health and Human ServicesInventors: David M. Neville, JR., Jung-Hee Woo, Yuan-Yi Liu