Patents by Inventor Yuichi Matsuda

Yuichi Matsuda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10858507
    Abstract: Disclosed is a fiber-reinforced polypropylene-based resin composition including a propylene-based polymer (A) and reinforcing fibers (B), in which when a content of at least one olefin-derived structural unit selected from ethylene and an ?-olefin having 4 to 8 carbon atoms in the propylene-based polymer (A) is designated as E (% by mass) (the sum of the propylene-based polymer (A) and the reinforcing fibers (B) is designated as 100% by mass), and a mesopentad fraction of the propylene-based polymer (A) as measured by 13C-NMR is designated as M (%), the following Expression (1) and Expression (2) are satisfied, the fiber-reinforced polypropylene-based resin composition being a resin composition with which a molded product having excellent thermal and mechanical characteristics and having an excellent external appearance of the molded product surface (particularly, external appearance of a grained surface) can be produced.
    Type: Grant
    Filed: May 9, 2017
    Date of Patent: December 8, 2020
    Assignee: PRIME POLYMER CO., LTD.
    Inventor: Yuichi Matsuda
  • Publication number: 20190286468
    Abstract: An apparatus serving as each of multiple slave nodes monitors a communication response condition of containers constituting the multiple slave nodes included in an information processing system in which a container constituting a master node and the containers constituting the multiple slave nodes cooperate with one another and perform distributed processing. When an anomaly is detected in the communication response condition of a given container of the containers included in the multiple slave nodes, the apparatus estimates an operating condition of the given host machine in accordance with information indicating a given host machine on which the given container is running, and sets a time-out time that is calculated based on an amount of data for the distributed processing and that is referred to when it is determined whether to cause the given container to run on a host machine different from the given host machine.
    Type: Application
    Filed: March 1, 2019
    Publication date: September 19, 2019
    Applicant: FUJITSU LIMITED
    Inventors: YUICHI MATSUDA, Nobuyuki KUROMATSU
  • Publication number: 20190144651
    Abstract: Disclosed is a fiber-reinforced polypropylene-based resin composition including a propylene-based polymer (A) and reinforcing fibers (B), in which when a content of at least one olefin-derived structural unit selected from ethylene and an ?-olefin having 4 to 8 carbon atoms in the propylene-based polymer (A) is designated as E (% by mass) (the sum of the propylene-based polymer (A) and the reinforcing fibers (B) is designated as 100% by mass), and a mesopentad fraction of the propylene-based polymer (A) as measured by 13C-NMR is designated as M (%), the following Expression (1) and Expression (2) are satisfied, the fiber-reinforced polypropylene-based resin composition being a resin composition with which a molded product having excellent thermal and mechanical characteristics and having an excellent external appearance of the molded product surface (particularly, external appearance of a grained surface) can be produced.
    Type: Application
    Filed: May 9, 2017
    Publication date: May 16, 2019
    Applicant: PRIME POLYMER CO., LTD.
    Inventor: Yuichi MATSUDA
  • Patent number: 9921874
    Abstract: A non-transitory computer-readable recording medium storing a program causing a processor to execute a process, the process includes detecting input of data into a memory to which data is inputted in sequence, the data being a processing object of first processing; allocating the first processing, of which a processing object is the data, with respect to any node in a communicable node group; determining whether or not the data is provided with tail information, the tail information indicating tail data of a series of data that are processing objects of the first processing, when detecting input of the data; and allocating second processing, of which a processing object is a processing result of the first processing that is executed with respect to each piece of data of the series of data, to any node of the node group when determining that the data is provided with the tail information.
    Type: Grant
    Filed: May 23, 2013
    Date of Patent: March 20, 2018
    Assignee: FUJITSU LIMITED
    Inventors: Yuichi Matsuda, Haruyasu Ueda
  • Patent number: 9698037
    Abstract: A substrate processing apparatus includes a holder configured to hold a substrate and carry the substrate into a process chamber, a waiting station located outside the process chamber in which the holder waits prior to carrying the substrate into the process chamber, a circulation path configured to circulate a gas throughout the waiting station, and an exhaust path formed in the circulation path and configured to exhaust the gas from the waiting station.
    Type: Grant
    Filed: June 9, 2011
    Date of Patent: July 4, 2017
    Assignee: HITACHI KOKUSAI ELECTRIC INC.
    Inventors: Seiyo Nakashima, Yuichi Matsuda, Takashi Nogami, Shinobu Sugiura, Tomoyuki Yamada
  • Patent number: 9535743
    Abstract: A data processing control device performs a MapReduce process. When the data processing control device assigns input data to first Reduce tasks and a second Reduce task performed by using a result of Map processes, the data processing control device assigns input data with smaller amount than any of amounts of the input data which is assigned to the first Reduce tasks to the second Reduce task. The data processing control device assigns the first Reduce tasks and the second Reduce task, to which input data is assigned, to a server that performs Reduce processes in the MapReduce process such that the second Reduce task is started after the assignment of all of the first Reduce tasks.
    Type: Grant
    Filed: July 2, 2015
    Date of Patent: January 3, 2017
    Assignee: FUJITSU LIMITED
    Inventors: Nobuyuki Kuromatsu, Yuichi Matsuda, Haruyasu Ueda
  • Publication number: 20160376430
    Abstract: An object of the invention is to provide a propylene resin composition that can give shaped articles resistant to flaws such as scratches and glazed marks and having excellent mechanical characteristics. The invention achieves the object with a propylene resin composition obtained by blending 35 to 85 parts by weight of a propylene-ethylene random copolymer (A) having a melt flow rate (ASTM D1238, 230° C., 2.16 kg load) of 5 to 100 g/10 min and an ethylene content of 2 to 9 mol %; 5 to 25 parts by weight of an ethylene-?-olefin copolymer (B) obtained by copolymerizing ethylene with one or more olefins selected from ?-olefins having 3 to 10 carbon atoms, and having a melt flow rate (ASTM D1238, 230° C., 2.16 kg load) of 0.1 to 80 g/10 min; 10 to 40 parts by weight of a fibrous filler (C) having an average fiber length of 0.1 to 2 mm and an average fiber diameter of 1 to 25 ?m; 0.01 to 1.0 part by weight of a lubricant (D); and 0.
    Type: Application
    Filed: July 4, 2014
    Publication date: December 29, 2016
    Applicant: Prime Polymer Co., Ltd.
    Inventors: Tatsuya KUSUMOTO, Tatsuji KAWAMURA, Toru FUKADA, Yuichi MATSUDA, Kazuhiro DOI
  • Patent number: 9488677
    Abstract: A probe card includes a wiring substrate including an opening portion and a connection pad arranged on an upper face of the wiring substrate located on the periphery of the opening portion, a resin portion formed in the opening portion of the wiring substrate, and the resin portion formed of a material having elasticity, a contact terminal arranged to protrude from the lower face of the resin portion, and wire buried in the resin portion and connecting the contact terminal and the connection pad, wherein the contact terminal is formed of an end part of the wire, and is formed integrally with the wire.
    Type: Grant
    Filed: October 28, 2013
    Date of Patent: November 8, 2016
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Ryo Fukasawa, Michio Horiuchi, Yasue Tokutake, Yuichi Matsuda, Mitsuhiro Aizawa
  • Patent number: 9476913
    Abstract: A probe card includes a wiring substrate including an opening portion, a first connection pad, and a second connection pad arranged in an opposite area to the first connection pad, a resin portion formed in the opening portion, a first wire buried in the resin portion, in which one end is connected to the first connection pad and other end constitutes a first contact terminal, and a second wire buried in the resin portion, in which one end is connected to the second connection pad and other end constitutes a second contact terminal, wherein the first and second wires extend on one line, and the first and second contact terminals are arranged on the one line, and the first and second contact terminals are gathered to be separated such that the first and second contact terminals touch one electrode pad of a text object with a pair.
    Type: Grant
    Filed: July 10, 2014
    Date of Patent: October 25, 2016
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Ryo Fukasawa, Michio Horiuchi, Yasue Tokutake, Yuichi Matsuda, Mitsuhiro Aizawa
  • Patent number: 9470718
    Abstract: A probe card, includes, a wiring substrate having an opening portion and including a first connection pad and a second connection pad, the first connection pad being arranged at a periphery of the opening portion, the second connection pad being arranged to be adjacent to the first connection pad, a resin portion formed inside the opening portion of the wiring substrate, a first wire buried in the resin portion and having one end connected to the first connection pad and the other end constituting a first contact terminal protruding from a lower face of the resin portion, and a second wire buried in the resin portion and having one end connected to the second connection pad and the other end constituting a second contact terminal protruding from a lower face of the resin portion.
    Type: Grant
    Filed: July 10, 2014
    Date of Patent: October 18, 2016
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Ryo Fukasawa, Michio Horiuchi, Yasue Tokutake, Yuichi Matsuda, Mitsuhiro Aizawa
  • Patent number: 9459289
    Abstract: A probe card includes a frame-shaped wiring substrate having interlayer insulation layers and a wiring layer that are alternately stacked. A cavity is defined in a central portion of the wiring substrate. A first insulation layer is arranged in the cavity so that a frame-shaped clearance exists between an outer side surface of the first insulation layer and an inner side surface of the wiring substrate as viewed from above. The cavity is filled with a second insulation layer. A contact terminal projecting from a lower surface of the first insulation layer is electrically connected to the wiring layer by a conductive wire. Elasticity of the second insulation layer is smaller than elasticity of each interlayer insulation layer.
    Type: Grant
    Filed: October 16, 2014
    Date of Patent: October 4, 2016
    Assignee: Shinko Electric Industries Co., LTD.
    Inventors: Michio Horiuchi, Ryo Fukasawa, Yuichi Matsuda, Yasue Tokutake
  • Patent number: 9460983
    Abstract: A thermal interface material includes a metal foil, which has a first surface and an opposite second surface, and a plurality of rod conductors each having a side surface extending in a thickness direction of the metal foil. The rod conductors are arranged on at least one of the first and second surfaces of the metal foil in a planar direction that is perpendicular to the thickness direction. A resin layer covers at least the first surface and the second surface of the metal foil and the side surfaces of the rod conductors.
    Type: Grant
    Filed: September 13, 2012
    Date of Patent: October 4, 2016
    Assignee: Shinko Electric Industries Co., LTD.
    Inventors: Michio Horiuchi, Yasue Tokutake, Yuichi Matsuda
  • Patent number: 9373587
    Abstract: An electronic component device, includes, a plurality of wiring layers including a component connection pad in a center part and an external connection pad in a periphery, an insulating layer formed on the wiring layers, and the insulating layer in which the component connection pad and the external connection pad are exposed, a frame member arranged on the insulating layer, and the frame member in which an opening portion is provided in an area of the center part in which the component connection pad is arranged, and a connection hole is provided on the external connection pad, an electronic component arranged in the opening portion of the frame member and connected to the component connection pad, a sealing resin formed in the opening portion of the frame member and sealing the electronic component, and a metal bonding material formed on the external connection pad in the connection hole.
    Type: Grant
    Filed: April 24, 2014
    Date of Patent: June 21, 2016
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Michio Horiuchi, Ryo Fukasawa, Yuichi Matsuda, Yasue Tokutake
  • Patent number: 9344347
    Abstract: In a delay time measuring apparatus a sequence number, data length, and receiving time of a data packet transmitted from a source unit to a destination unit are stored in a storage section. In addition, an ACK number and receiving time of an ACK packet returned from the destination unit to the source unit are stored in the storage section. After that, a calculation section obtains an ACK packet an ACK number of which is equal to a value obtained by adding data length of a second data packet of two successive data packets transmitted without waiting for the ACK packet to a sequence number of the second data packet of the two successive data packets from the storage section. Then the calculation section calculates round trip time from receiving time of the second data packet of the two successive data packets and receiving time of the ACK packet obtained.
    Type: Grant
    Filed: March 24, 2009
    Date of Patent: May 17, 2016
    Assignee: FUJITSU LIMITED
    Inventors: Yuichi Matsuda, Yuji Nomura
  • Publication number: 20160019090
    Abstract: A data processing control device performs a MapReduce process. When the data processing control device assigns input data to first Reduce tasks and a second Reduce task performed by using a result of Map processes, the data processing control device assigns input data with smaller amount than any of amounts of the input data which is assigned to the first Reduce tasks to the second Reduce task. The data processing control device assigns the first Reduce tasks and the second Reduce task, to which input data is assigned, to a server that performs Reduce processes in the MapReduce process such that the second Reduce task is started after the assignment of all of the first Reduce tasks.
    Type: Application
    Filed: July 2, 2015
    Publication date: January 21, 2016
    Applicant: FUJITSU LIMITED
    Inventors: Nobuyuki KUROMATSU, Yuichi MATSUDA, Haruyasu UEDA
  • Publication number: 20150365474
    Abstract: A task assignment apparatus executes a process of distributing pieces of divided data contained in a first divided data group, which is obtained by dividing input data, to a plurality of nodes that execute Map processes. The task assignment apparatus, upon completion of Map processes of partial divided groups in the first divided data group, estimates a data amount of each piece of distributed data by applying, to results of the Map processes of the partial divided data groups, a generation rule for generating pieces of the distributed data for a plurality of nodes that execute Reduce processes. The task assignment apparatus starts to control selection of nodes, to which at least some pieces of the distributed data are assigned, on the basis of the estimated data amounts before of all of the Map processes on the first divided data group complete.
    Type: Application
    Filed: May 29, 2015
    Publication date: December 17, 2015
    Applicant: Fujitsu Limited
    Inventor: Yuichi MATSUDA
  • Patent number: 9202781
    Abstract: A wiring substrate includes a core layer, first and second wiring layers, and a first insulating layer. The core layer has one and another surfaces and includes a plate-shaped member formed of an aluminum oxide and multiple linear conductors penetrating the plate-shaped member in a thickness direction of the plate-shaped member. The first wiring layer is formed on the one surface of the core layer. The second wiring layer is formed on the other surface of the core layer. The first insulating layer has a same thickness as the first wiring layer and is formed in an area of the one surface of the core layer on which the first wiring layer is not formed. The first and second wiring layers are positioned superposing each other in a plan view. The first and second wiring layers are electrically connected by way of the multiple linear conductors.
    Type: Grant
    Filed: October 28, 2013
    Date of Patent: December 1, 2015
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Yuko Karasawa, Kazue Ban, Ryo Fukasawa, Yuichi Matsuda, Michio Horiuchi, Yasue Tokutake
  • Patent number: 9204544
    Abstract: A wiring substrate includes, an insulating substrate in which a plurality of penetration conductors are provided, the penetration conductors penetrating in a thickness direction of the insulating substrate, a first connection pad arranged on one face of the insulating substrate, a second connection pad arranged to correspond to the first connection pad on other face of the insulating substrate, a first metal layer arranged to surround the first connection pad, a second metal layer arranged to correspond to the first metal layer, the second metal layer surrounding the second connection pad, the plurality of penetration conductors connecting the first connection pad and the second connection pad, and connecting the first metal layer and the second metal layer, and an elastic body formed in a part of the insulating substrate between the first and second connection pads, and the first and second metal layers.
    Type: Grant
    Filed: March 10, 2014
    Date of Patent: December 1, 2015
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Michio Horiuchi, Ryo Fukasawa, Yuichi Matsuda, Yasue Tokutake
  • Publication number: 20150254102
    Abstract: A master server assigns a first process to each of a plurality of slave servers. When the master server receives one or more completion notifications of one or more first tasks of a first process related to a second task of a second process that is assigned to each of the plurality of slave servers and that is executed by using one or more execution results of the one or more first tasks, the master server estimates a processing amount of the second task. The master server sends information related to the estimated processing amount to the slave servers to each of which the second task is assigned.
    Type: Application
    Filed: February 26, 2015
    Publication date: September 10, 2015
    Applicant: FUJITSU LIMITED
    Inventors: Haruyasu UEDA, Yuichi MATSUDA, Takamitsu MAEDA
  • Publication number: 20150137849
    Abstract: A probe card includes a first insulation layer, a contact terminal arranged on the first insulation layer, and a wiring pattern arranged on an upper surface of the first insulation layer. The wiring pattern includes a rewire connected to the contact terminal and a first pad connected to the rewire. The probe card further includes a wiring substrate. The wiring substrate includes an interlayer insulation layer, a wiring layer, and a cavity defined in central portions of the interlayer insulation layer and the wiring layer. The wiring substrate is spaced apart from the first insulation layer arranged in the cavity. The cavity is filled with a second insulation layer. A conductive wire is arranged in the second insulation layer to electrically connect the first contact terminal and the wiring layer. The second insulation layer has a lower elasticity than the interlayer insulation layer.
    Type: Application
    Filed: October 16, 2014
    Publication date: May 21, 2015
    Applicant: Shinko Electric Industries Co., LTD.
    Inventors: Michio Horiuchi, Ryo Fukasawa, Yuichi Matsuda, Yasue Tokutake