Abstract: A supporting member on which a wafer table is mounted is substantially kinematically supported, via six rod members placed on a slider. Further, coupling members are placed facing in a non-contact manner via a predetermined gap, thin plate-shaped edges provided at both ends in the Y-axis direction of the supporting member. By this arrangement, vibration-damping is performed by the coupling members (squeeze dampers) facing the edges, on vibration of the supporting member mounted on the wafer table. Further, because the supporting member is kinematically supported via the plurality of rod members, it becomes possible to reduce deformation of the wafer table that accompanies deformation of the slider.

Abstract: A determination apparatus has a calculation section, where first and second direction pitches intersecting within a predetermined plane of a plurality of detection areas are D1 and D2, respectively, sizes in the first and second directions of each of a plurality of divided areas arranged two-dimensionally along the first and second directions on a substrate are W1 and W2, respectively, and first and second direction pitches of a plurality of marks arranged on the substrate are p1 and p2, respectively, calculates pitch p1 and pitch p2 of the plurality of marks that satisfy formulas (a) and (b) below, based on pitch D1, pitch D2, size W1, and size W2.

Abstract: In corner sections of first to fourth quadrants whose origin point is a center of an upper surface of a stage, three each of two-dimensional heads are provided. The three each of two-dimensional heads include one first head and two second heads. The stage is driven, while measuring a position of the stage using three first heads that face a two-dimensional grating of a scale plate provided above the stage from the four first heads, and during the driving, difference data of measurement values of the two second heads with respect to the first head in a measurement direction are taken in for head groups to which the three first heads belong, respectively, and using the difference data, grid errors are calibrated.

Abstract: While a wafer stage linearly moves in a Y-axis direction, a multipoint AF system detects surface position information of the wafer surface at a plurality of detection points that are set at a predetermined distance in an X-axis direction and also a plurality of alignment systems that are arrayed in a line along the X-axis direction detect each of marks at positions different from one another on the wafer. That is, detection of surface position information of the wafer surface at a plurality of detection points and detection of the marks at positions different from one another on the wafer are finished, only by the wafer stage (wafer) linearly passing through the array of the plurality of detection points of the multipoint AF system and the plurality of alignment systems, and therefore, the throughput can be improved.

Abstract: A movement area of a stage includes first-fifth areas. In the first area, three of four heads except for a first head respectively face three of four sections of a scale member except for a first section. In the second area, three of four heads except for a second head respectively face three of four sections except for a second section of the scale member. In the third area, three of four heads except for a third head respectively face three of four sections except for a third section of the scale member. In the fourth area, three of four heads except for a fourth head respectively face three of four sections of the scale member. In the fifth area, the four heads respectively face the four sections. The stage is moved from one of the first-fourth areas to another of those areas via the fifth area.

Abstract: A measurement system to be used in a micro-device manufacturing line is equipped with: a plurality of measurement devices which performs measurement processing on each substrate; and a controller that can control the plurality of measurement devices, and the plurality of measurement devices includes at least one first measurement device which acquires position information of a plurality of marks formed on a substrate.

Abstract: A substrate holding device is equipped with a substrate holder that adsorbs and holds a substrate, and a plurality of vertical movement pin units that each have, at one end, an adsorption section to adsorb a rear surface of the substrate, and are movable relative to the substrate holder in a state of adsorbing the rear surface of the substrate with the adsorption section. The plurality of vertical movement pin units each have at least part including the adsorption section that is displaced in at least one direction, by an action of a force received from the adsorbed substrate.

Abstract: In an exposure operation, as a second stage is moved in a direction parallel to a predetermined plane, another head different from a plurality of heads faces a grating section instead of one head of the plurality of heads, and positional information of the second stage is measured by multiple heads including remaining heads and the another head, the remaining heads excluding the one head of the plurality of heads, and correction information is acquired for the positional information obtained from the another head, based on the positional information obtained from the plurality of heads including the one head.

Abstract: In an exposure operation, as a second stage is moved in a direction parallel to a predetermined plane, another head different from a plurality of heads faces a grating section instead of one head of the plurality of heads, and positional information of the second stage is measured by multiple heads including remaining heads and the another head, the remaining heads excluding the one head of the plurality of heads, and correction information is acquired for the positional information obtained from the another head, based on the positional information obtained from the plurality of heads including the one head.

Abstract: A supporting member on which a wafer table is mounted is substantially kinematically supported, via six rod members placed on a slider. Further, coupling members are placed facing in a non-contact manner via a predetermined gap, thin plate-shaped edges provided at both ends in the Y-axis direction of the supporting member. By this arrangement, vibration-damping is performed by the coupling members (squeeze dampers) facing the edges, on vibration of the supporting member mounted on the wafer table. Further, because the supporting member is kinematically supported via the plurality of rod members, it becomes possible to reduce deformation of the wafer table that accompanies deformation of the slider.

Abstract: Position information of a movable body within an XY plane is measured with high accuracy by an encoder system whose measurement values have favorable short-term stability, without being affected by air fluctuations, and also position information of the movable body in a Z-axis direction orthogonal to the XY plane is measured with high accuracy by a surface position measuring system, without being affected by air fluctuations. In this case, since both of the encoder system and the surface position measuring system directly measure the upper surface of the movable body, simple and direct position control of the movable body can be performed.

Abstract: In an exposure operation, as a second stage is moved in a direction parallel to a predetermined plane, another head different from a plurality of heads faces a grating section instead of one head of the plurality of heads, and positional information of the second stage is measured by multiple heads including remaining heads and the another head, the remaining heads excluding the one head of the plurality of heads, and correction information is acquired for the positional information obtained from the another head, based on the positional information obtained from the plurality of heads including the one head.

Abstract: A substrate holding device is equipped with a substrate holder that adsorbs and holds a substrate, and a plurality of vertical movement pin units that each have, at one end, an adsorption section to adsorb a rear surface of the substrate, and are movable relative to the substrate holder in a state of adsorbing the rear surface of the substrate with the adsorption section. The plurality of vertical movement pin units each have at least part including the adsorption section that is displaced in at least one direction, by an action of a force received from the adsorbed substrate.

Abstract: While a wafer stage moves linearly in a Y-axis direction, surface position information of a wafer surface at a plurality of detection points set at a predetermined interval in an X-axis direction is detected by a multipoint AF system, and by a plurality of alignment systems arranged in a line along the X-axis direction, marks at different positions on the wafer are each detected, and a part of a chipped shot of the wafer is exposed by a periphery edge exposure system. This allows throughput to be improved when compared with the case when detection operation of the marks, detection operation of the surface position information (focus information), and periphery edge exposure operation are performed independently.

Abstract: While a wafer stage linearly moves in a Y-axis direction, a multipoint AF system detects surface position information of the wafer surface at a plurality of detection points that are set at a predetermined distance in an X-axis direction and also a plurality of alignment systems that are arrayed in a line along the X-axis direction detect each of marks at positions different from one another on the wafer. That is, detection of surface position information of the wafer surface at a plurality of detection points and detection of the marks at positions different from one another on the wafer are finished, only by the wafer stage (wafer) linearly passing through the array of the plurality of detection points of the multipoint AF system and the plurality of alignment systems, and therefore, the throughput can be improved.

Abstract: A first stage system having a first stage and a first drive system that moves the first stage is configured to hold a mask illuminated with illumination light. A second stage system having a second stage and a second drive system that moves the second stage is configured to hold a substrate. A measurement system having a first encoder system and a second encoder system measures positional information of the first and second stages, respectively. The second encoder system measures the positional information of the second stage with a plurality of heads that face a grating section. The first and second drive systems are controlled while compensating for a measurement error that occurs due to at least one of a gradient and a telecentricity of the head, based on correction information.

Abstract: A scanning lithography tool that includes a reticle stage for clamping and imparting a bending moment onto a reticle by applying a force along a plane surface of the reticle to bend the reticle in a deterministic manner.

Abstract: In an exposure operation of a substrate, a controller controls first and second drive systems based on correction information for compensating for a measurement error of an encoder system and measurement information of first and second measurement devices, so that scanning exposure is performed and a measurement error is compensated for. In the scanning exposure, a mask and the substrate are each moved relative to illumination light with a first direction serving as a scanning direction, the measurement error occurring due to a difference between a position of a reference plane and a position of a grating surface of a grating section in a third direction orthogonal to a predetermined plane that includes the first direction, and the reference plane being a reference plane for position control or positioning of a second stage or a reference plane with which the substrate coincides in the exposure operation.

Abstract: While a wafer stage moves linearly in a Y-axis direction, surface position information of a wafer surface at a plurality of detection points set at a predetermined interval in an X-axis direction is detected by a multipoint AF system, and by a plurality of alignment systems arranged in a line along the X-axis direction, marks at different positions on the wafer are each detected, and a part of a chipped shot of the wafer is exposed by a periphery edge exposure system. This allows throughput to be improved when compared with the case when detection operation of the marks, detection operation of the surface position information (focus information), and periphery edge exposure operation are performed independently.

Abstract: In an exposure apparatus that has an illumination optical system to illuminate a mask with an illumination light and a projection optical system to project a pattern image of the illuminated mask onto a substrate, first and second movable bodies, respectively holding the mask and the substrate, are moved based on measurement information of first and the second encoder systems so that, in an exposure operation of the substrate, scanning exposure in which the mask and the substrate are each moved relative to the illumination light is performed with a first direction within the predetermined plane serving as a scanning direction while compensating for a measurement error of the second encoder system that occurs due to at least one of tilt of the second head of the second encoder system and tilt in telecentricity of the second head.