Patents by Inventor Yuji Araki

Yuji Araki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11315812
    Abstract: Provided is a semiconductor manufacturing apparatus, comprising: a first device; one or more sensors that detect physical quantities indicating a state of the first device; a first calculation circuit that calculates one or more feature quantities of the first device from the detected physical quantities; and a failure prediction circuit that monitors a temporal change in the one or more feature quantities calculated in the first calculation circuit, and stops receiving a new substrate when a duration for which a degree of deviation of the one or more feature quantities from those at a normal time is increasing exceeds a first time, and/or when a number of increases and decreases per unit time in the degree of deviation of the one or more feature quantities from those at the normal time exceeds a first number.
    Type: Grant
    Filed: April 4, 2018
    Date of Patent: April 26, 2022
    Assignee: EBARA CORPORATION
    Inventors: Jumpei Fujikata, Yuji Araki, Tensei Sato, Ryuya Koizumi
  • Publication number: 20220105478
    Abstract: A gas solution supply device 1 includes: a first gas-liquid separator 8 in which gas solution is stored; a second gas-liquid separator 16 provided at a stage subsequent to the first gas-liquid separator 8 and in which gas solution to be supplied to a use point is stored; an intermediate line 17 provided between the first gas-liquid separator 8 and the second gas-liquid separator 16; a pressure booster pump 18 provided on the intermediate line 17 and increases a pressure of gas solution being supplied from the first gas-liquid separator 8 to the second gas-liquid separator 16; a gas supply line 2 that supplies gas as a material of the gas solution; and a gas dissolving unit 20 provided on the intermediate line 17 and dissolves the gas supplied from the gas supply line 2 in the gas solution supplied from the first gas-liquid separator 8.
    Type: Application
    Filed: September 29, 2021
    Publication date: April 7, 2022
    Inventors: Suguru OZAWA, Yuji ARAKI, Toshifumi WATANABE, Yoichi NAKAGAWA, Risa KIMURA, Tao XU
  • Publication number: 20210245115
    Abstract: A gas solution manufacturing device 1 includes a gas supply line 2 configured to supply a gas as a raw material of a gas solution, a liquid supply line 3 configured to supply a liquid as a raw material of the gas solution, a gas solution production unit 4 configured to mix the gas and the liquid together to produce the gas solution, a gas-liquid separation unit 5 configured to perform gas-liquid separation of the produced gas solution into a supplied liquid to be supplied to a use point and a discharged gas to be discharged through an exhaust port, and a gas dissolving unit 6 provided in the liquid supply line 4 and configured to dissolve the discharged gas resulting from the gas-liquid separation in the liquid. The gas dissolving unit 6 is configured with a hollow fiber membrane configured with a gas permeable membrane.
    Type: Application
    Filed: February 1, 2021
    Publication date: August 12, 2021
    Inventors: Suguru OZAWA, Yuji ARAKI, Yoichi NAKAGAWA, Toshifumi WATANABE
  • Publication number: 20210017056
    Abstract: A gas dissolved liquid manufacturing device includes: a pump configured to pressurize a liquid; a pipe communicating with the pump; a nozzle disposed in the pipe, the nozzle being configured to generate micro bubbles using a supplied gas; and a gas-liquid separation tank whose upper part communicates with the pipe, the gas-liquid separation tank being configured to separate a gas-liquid mixture generated by the nozzle into a gas and a liquid.
    Type: Application
    Filed: July 7, 2020
    Publication date: January 21, 2021
    Inventors: Yoichi NAKAGAWA, Suguru OZAWA, Yuji ARAKI, Toshifumi WATANABE
  • Publication number: 20200385295
    Abstract: A gas dissolution supply apparatus dissolves a gas supplied from a gas supply unit in a liquid supplied from a liquid supply unit to produce a gas dissolution in a gas dissolving unit, stores the gas dissolution produced in the gas dissolving unit in a gas dissolution tank, supplies the gas dissolution from the gas dissolution tank to a point of use, measures the flow rate of a part of the gas dissolution supplied to the point of use that is returned to the gas dissolving unit, and adjusts the flow rate of the liquid supplied from the liquid supply unit to the gas dissolving unit based on the result of the measurement.
    Type: Application
    Filed: May 28, 2020
    Publication date: December 10, 2020
    Inventors: Suguru OZAWA, Yuji ARAKI, Toshifumi WATANABE, Yoichi NAKAGAWA
  • Patent number: 10807838
    Abstract: An apparatus for preventing a remote operation terminal from being mislaid, the remote operation terminal remotely operating a work machine driven via a PTO device in a vehicle, the apparatus being configured so as to have: a reception device for receiving a wireless signal transmitted by a transmission device provided to the remote operation terminal, the reception device being provided to the vehicle; a determination section that, when the PTO device is in an OFF state, determines whether or not the reception strength of the wireless signal received from the transmission device by the reception device is equal to or less than a prescribed threshold value; and a notification section for issuing a notification when the reception strength is equal to or less than the prescribed threshold value.
    Type: Grant
    Filed: April 26, 2018
    Date of Patent: October 20, 2020
    Assignee: TADANO LTD.
    Inventor: Yuji Araki
  • Publication number: 20200140240
    Abstract: An apparatus for preventing a remote operation terminal from being mislaid, the remote operation terminal remotely operating a work machine driven via a PTO device in a vehicle, the apparatus being configured so as to have: a reception device for receiving a wireless signal transmitted by a transmission device provided to the remote operation terminal, the reception device being provided to the vehicle; a determination section that, when the PTO device is in an OFF state, determines whether or not the reception strength of the wireless signal received from the transmission device by the reception device is equal to or less than a prescribed threshold value; and a notification section for issuing a notification when the reception strength is equal to or less than the prescribed threshold value.
    Type: Application
    Filed: April 26, 2018
    Publication date: May 7, 2020
    Applicant: TADANO LTD.
    Inventor: Yuji ARAKI
  • Patent number: 10633757
    Abstract: There are provided a plating apparatus and a plating method that allow determining an appropriate replacement timing of a diaphragm. The plating apparatus includes an anode bath, a cathode bath, a diaphragm, an analyzer, and a control device. The anode bath holds a plating solution and an insoluble anode. The cathode bath holds a plating solution containing an additive and a substrate. The diaphragm separates the plating solution held in the anode bath from the plating solution held in the cathode bath. The analyzer is configured to analyze a concentration of the additive in the plating solution in the cathode bath at every predetermined time interval. The control device is configured to calculate an actual consumption of the additive during the predetermined period based on the concentration of the additive analyzed at the every predetermined time interval. The control device includes a memory that stores an expected consumption of the additive during the predetermined period.
    Type: Grant
    Filed: April 14, 2017
    Date of Patent: April 28, 2020
    Assignee: EBARA CORPORATION
    Inventors: Masashi Shimoyama, Yuji Araki, Mizuki Nagai, Jumpei Fujikata
  • Patent number: 10487415
    Abstract: There is provided a method of adjusting a plating apparatus and a measuring apparatus that can obtain position adjustment amounts/a position adjustment amount of a substrate holder, an anode holder, a regulation plate, and/or a paddle without carrying out plating treatment. There is provided the method of adjusting the plating apparatus that has a plating bath configured to be able to hold the substrate holder, the anode holder, and an electric field adjusting plate.
    Type: Grant
    Filed: August 31, 2018
    Date of Patent: November 26, 2019
    Assignee: EBARA CORPORATION
    Inventors: Jumpei Fujikata, Masashi Shimoyama, Yuji Araki, Mizuki Nagai
  • Publication number: 20190309436
    Abstract: There are provided a plating apparatus and a plating method that allow determining an appropriate replacement timing of a diaphragm. The plating apparatus includes an anode bath, a cathode bath, a diaphragm, an analyzer, and a control device. The anode bath holds a plating solution and an insoluble anode. The cathode bath holds a plating solution containing an additive and a substrate. The diaphragm separates the plating solution held in the anode bath from the plating solution held in the cathode bath. The analyzer is configured to analyze a concentration of the additive in the plating solution in the cathode bath at every predetermined time interval. The control device is configured to calculate an actual consumption of the additive during the predetermined period based on the concentration of the additive analyzed at the every predetermined time interval. The control device includes a memory that stores an expected consumption of the additive during the predetermined period.
    Type: Application
    Filed: April 14, 2017
    Publication date: October 10, 2019
    Inventors: Masashi SHIMOYAMA, Yuji ARAKI, Mizuki NAGAI, Jumpei FUJIKATA
  • Publication number: 20180371636
    Abstract: There is provided a method of adjusting a plating apparatus and a measuring apparatus that can obtain position adjustment amounts/a position adjustment amount of a substrate holder, an anode holder, a regulation plate, and/or a paddle without carrying out plating treatment. There is provided the method of adjusting the plating apparatus that has a plating bath configured to be able to hold the substrate holder, the anode holder, and an electric field adjusting plate.
    Type: Application
    Filed: August 31, 2018
    Publication date: December 27, 2018
    Inventors: Jumpei FUJIKATA, Masashi SHIMOYAMA, Yuji ARAKI, Mizuki NAGAI
  • Patent number: 10100424
    Abstract: There is provided a method of adjusting a plating apparatus and a measuring apparatus that can obtain position adjustment amounts/a position adjustment amount of a substrate holder, an anode holder, a regulation plate, and/or a paddle without carrying out plating treatment. There is provided the method of adjusting the plating apparatus that has a plating bath configured to be able to hold the substrate holder, the anode holder, and an electric field adjusting plate.
    Type: Grant
    Filed: June 14, 2016
    Date of Patent: October 16, 2018
    Assignee: EBARA CORPORATION
    Inventors: Jumpei Fujikata, Masashi Shimoyama, Yuji Araki, Mizuki Nagai
  • Publication number: 20180294174
    Abstract: A semiconductor manufacturing apparatus including: a first device; one or more sensors; a first calculation circuit that calculates one or more feature quantities of the first device from the detected physical quantities; and a failure prediction circuit that compares the one or more feature quantities with a plurality of pieces of model data of a temporal change in one or more feature quantities until the first device fails, decides a piece of model data with the minimum difference from the calculated one or more feature quantities among the plurality of pieces of model data, calculates predicted failure time from a difference between a failure point in time and a point in time at which a difference from the calculated one or more feature quantities is the minimum in the piece of model data.
    Type: Application
    Filed: April 4, 2018
    Publication date: October 11, 2018
    Inventors: Jumpei FUJIKATA, Yuji ARAKI, Tensei SATO, Ryuya KOIZUMI
  • Patent number: 10047454
    Abstract: A plating apparatus 10 includes a rectifier 18 configured to apply a DC current to a substrate, and a plating apparatus control unit 30 that instructs the rectifier 18 on a value of the DC current. The plating apparatus control unit 30 has a setting unit 32 for setting a current value, a storage unit 34 that stores a relational expression between an instructed current value on which the rectifier 18 is instructed and an actual current value which the rectifier 18 outputs in accordance with the instructed current value, a calculation unit 38 that corrects the current value set by the setting unit 32 on the basis of the above-mentioned relational expression to calculate a corrected current value, and an instruction unit 36 that instructs the rectifier 18 on the corrected current value calculated by the calculation unit 38.
    Type: Grant
    Filed: June 1, 2015
    Date of Patent: August 14, 2018
    Assignee: EBARA CORPORATION
    Inventors: Yuji Araki, Jumpei Fujikata, Masashi Shimoyama, Mizuki Nagai
  • Patent number: 9816197
    Abstract: An Sn alloy plating apparatus is disclosed. The apparatus includes a plating bath configured to store an Sn alloy plating solution therein with an insoluble anode and a substrate immersed in the Sn alloy plating solution, an Sn dissolving having an anion exchange membrane therein which isolates an anode chamber, in which an Sn anode is disposed, and a cathode chamber, in which a cathode is disposed, from each other, a pure water supply structure configured to supply pure water to the anode chamber and the cathode chamber, a methanesulfonic acid solution supply structure configured to supply a methanesulfonic acid solution, containing a methanesulfonic acid, to the anode chamber and the cathode chamber, and an Sn replenisher supply structure configured to supply an Sn replenisher, produced in the anode chamber and containing Sn ions and a methanesulfonic acid, to the plating bath.
    Type: Grant
    Filed: May 1, 2014
    Date of Patent: November 14, 2017
    Assignee: EBARA CORPORATION
    Inventors: Masashi Shimoyama, Yuji Araki, Masamichi Tamura, Toshiki Miyakawa
  • Publication number: 20170226656
    Abstract: An improved apparatus for adding powder comprising at least a metal, such as copper, to a plating solution, and supplying the plating solution to a plating tank is disclosed. The apparatus includes a hopper having an inlet which is connectable to a powder conduit of a powder container holding the powder therein, a feeder which communicates with a bottom opening of the hopper, a motor coupled to the feeder, and a plating-solution tank coupled to an outlet of the feeder and configured to dissolve the powder in the plating solution.
    Type: Application
    Filed: February 7, 2017
    Publication date: August 10, 2017
    Inventors: Chunhui DOU, Yoshitaka MUKAIYAMA, Yuji ARAKI, Masashi SHIMOYAMA, Jumpei FUJIKATA
  • Patent number: 9695314
    Abstract: A resin composition contains an aromatic polycarbonate resin, an aromatic polyester resin, an acrylic triblock copolymer composed of a polymer block containing an acrylic acid ester unit and a polymer block containing a methacrylic acid ester unit, a glycidyl group-containing polyethylene copolymer, an organic phosphorus flame retardant, and a flame retardant antidrip agent.
    Type: Grant
    Filed: January 26, 2015
    Date of Patent: July 4, 2017
    Assignee: FUJI XEROX CO., LTD.
    Inventors: Akira Imada, Yuto Hanioka, Yuji Araki
  • Patent number: 9551084
    Abstract: An Sn alloy plating apparatus is disclosed which can relatively easily perform control of an Sn alloy plating solution, including control of the Sn ion concentration and the acid concentration of the plating solution.
    Type: Grant
    Filed: October 28, 2014
    Date of Patent: January 24, 2017
    Assignee: Ebara Corporation
    Inventors: Masashi Shimoyama, Masamichi Tamura, Yuji Araki
  • Publication number: 20160369422
    Abstract: There is provided a method of adjusting a plating apparatus and a measuring apparatus that can obtain position adjustment amounts/a position adjustment amount of a substrate holder, an anode holder, a regulation plate, and/or a paddle without carrying out plating treatment. There is provided the method of adjusting the plating apparatus that has a plating bath configured to be able to hold the substrate holder, the anode holder, and an electric field adjusting plate.
    Type: Application
    Filed: June 14, 2016
    Publication date: December 22, 2016
    Inventors: Jumpei FUJIKATA, Masashi SHIMOYAMA, Yuji ARAKI, Mizuki NAGAI
  • Patent number: 9475936
    Abstract: A resin composition includes a low molecular polycarbonate resin having a weight average molecular weight from 20,000 to 40,000, a high molecular polycarbonate resin having a weight average molecular weight from 50,000 to 70,000, and a polyethylene terephthalate resin having an IV value from 0.5 to 0.8, wherein a weight ratio between a content of the low molecular polycarbonate resin and a content of the high molecular polycarbonate resin is in a range of 30:70 to 70:30.
    Type: Grant
    Filed: January 22, 2015
    Date of Patent: October 25, 2016
    Assignee: FUJI XEROX CO., LTD.
    Inventor: Yuji Araki