Abstract: A first actuator and a second actuator each have a plurality of control calculation units provided redundantly and a plurality of motor drive units provided redundantly. In the first and the second actuators, the control calculation units of the systems paired with each other transmit and receive information to and from each other by a communication between the actuators. When a failure occurs in any system in either of the two actuators, or when a failure occurs in a communication between actuators in either system, the control calculation unit of each actuator of the system in which the failure occurred stops the motor drive control. Then, the motor drive control is continued by the control calculation unit of the normal system in both actuators.

Abstract: A vehicle power supply system includes a power source control device that executes a process of switching a connection state of a driving circuit to the main power source and an auxiliary power source including; a process of switching the connection state so as to transition to a backup state as a voltage decrease of the main power source occurs, and a process of switching the connection state so as to transition to a normal state as the voltage decrease of the main power source is resolved. After a voltage decrease of the main power source occurs, a turning-side control device of a steering control unit sets an output-limited state for a turning-side motor. The output-limited state is canceled upon the power source control device completing switching of the connection state so as to transition.

Abstract: The present invention provides a working machine that makes it possible to alert its operator to cautions properly without obstructing the view of the operator. The working machine includes a cab for its operator to ride in, a projection device that projects image light to form an image of cautions to an operator who operates the working machine, a display unit that displays image light projected by the projection device, state detection element to detect a state of the working machine, and a controller that controls the projection device so that a manner of displaying the cautions on the display unit will change depending on the state of the working machine detected by the state detection element.

Abstract: A power supply system includes a system control unit, an auxiliary power supply, and an auxiliary-power-supply control unit. The system control unit and the auxiliary-power-supply control unit are configured such that information of at least one control unit of the system control unit and the auxiliary-power-supply control unit is able to be output to another control unit of the system control unit and the auxiliary-power-supply control unit. The at least one control unit is configured to output information indicating that an operation of the at least one control unit is stopped to the other control unit when the at least one control unit stops the operation of the at least one control unit.

Abstract: According to one embodiment, a substrate processing method is disclosed. The method can include treating a substrate with a first liquid. The substrate has a structural body formed on a major surface of the substrate. The method can include forming a support member supporting the structural body by bringing a second liquid into contact with the substrate wetted by the first liquid, and changing at least a portion of the second liquid into a solid by carrying out at least one of causing the second liquid to react, reducing a quantity of a solvent included in the second liquid, and causing at least a portion of a substance dissolved in the second liquid to be separated. The method can include removing the support member by changing at least a part of the support member from a solid phase to a gaseous phase, without passing through a liquid phase.

Abstract: According to one embodiment, a substrate processing method is disclosed. The method can include treating a substrate with a first liquid. The substrate has a structural body formed on a major surface of the substrate. The method can include forming a support member supporting the structural body by bringing a second liquid into contact with the substrate wetted by the first liquid, and changing at least a portion of the second liquid into a solid by carrying out at least one of causing the second liquid to react, reducing a quantity of a solvent included in the second liquid, and causing at least a portion of a substance dissolved in the second liquid to be separated. The method can include removing the support member by changing at least a part of the support member from a solid phase to a gaseous phase, without passing through a liquid phase.

Abstract: According to one embodiment, a substrate treatment method of removing an upper end of a protrusion on a substrate is disclosed. An unevenness is formed on a surface of the substrate. The method can supply a first liquid on the surface of the substrate. The unevenness is formed on the surface. The method can form a protective layer. The protective layer covers the surface of the substrate from the first liquid supplied to the surface of the substrate. The method can supply a second liquid onto the protective layer. In addition the method can physically remove the protective layer which is on the upper end of the protrusion, and can bring the second liquid into contact with the upper end of the protrusion. The protective layer is removed from the upper end of the protrusion.

Abstract: The present invention provides a working machine that makes it possible to alert its operator to cautions properly without obstructing the view of the operator. The working machine includes a cab for its operator to ride in, a projection device that projects image light to form an image of cautions to an operator who operates the working machine, a display unit that displays image light projected by the projection device, state detection element to detect a state of the working machine, and a controller that controls the projection device so that a manner of displaying the cautions on the display unit will change depending on the state of the working machine detected by the state detection element.

Abstract: A memory controller includes: a memory access part which writes, to memory, an encrypted data acquired by encrypting information data, a first code for error detection based on the information data, and a second code for error detection based on the encrypted data and which reads the encrypted data, the first and second codes from the memory during a monitoring process being executed with a monitoring part; a decryption part for acquiring readout data by decrypting the encrypted data; and an error detection part which acquires a first error detection result by performing an error detection process on the readout data and the first code and a second error detection result by performing an error detection process on the encrypted data and the second code. The monitoring part stops the decryption part during the monitoring process and determines a deterioration level of memory based on the second error detection result.

Abstract: According to one embodiment, a substrate processing apparatus includes a processing chamber, a support part, a heater, and an optical member. In the processing chamber, air flows from the top to the bottom. The support part is located in the processing chamber to support a substrate having a surface to be treated. The heater is arranged so as not to be above the support part and emits light for heating. The optical member is arranged in the processing chamber so as not to be above the support part to guide the light emitted by the heater and having passed above the support part to the surface to be treated of the substrate supported by the support part.

Abstract: A substrate processing device 10 has a water removing unit 110 and, when a solvent supply unit 58 supplies a volatile solvent to a surface of a substrate W, the water removing unit 110 supplies a water removing agent to the surface of the substrate W to promote replacement of the cleaning water on the surface of the substrate W with the volatile solvent.

Abstract: According to one embodiment, a substrate processing method is disclosed. The method can include treating a substrate with a first liquid. The substrate has a structural body formed on a major surface of the substrate. The method can include forming a support member supporting the structural body by bringing a second liquid into contact with the substrate wetted by the first liquid, and changing at least a portion of the second liquid into a solid by carrying out at least one of causing the second liquid to react, reducing a quantity of a solvent included in the second liquid, and causing at least a portion of a substance dissolved in the second liquid to be separated. The method can include removing the support member by changing at least a part of the support member from a solid phase to a gaseous phase, without passing through a liquid phase.

Abstract: According to one embodiment, a substrate processing apparatus (1) includes: a support (4) configured to support a substrate (W) in a plane; a rotation mechanism (5) configured to rotate the support (4) about an axis that crosses a surface of the substrate (W) supported by the support (4) as a rotation axis; a plurality of nozzles (6a, 6b, 6c), which are aligned from the center toward the periphery of the substrate (W) supported by the support (4), configured to eject a treatment liquid to the surface of the substrate (W) on the support (4) being rotated by the rotation mechanism (5), and a controller (9) configured to control the nozzles to eject the treatment liquid at different ejection timings according to the thickness of a film of the treatment liquid formed on the surface of the substrate (W) on the support (4) being rotated by the rotation mechanism (5).

Abstract: According to one embodiment, a substrate processing apparatus (1) includes a table (4) configured to support a substrate W, a solvent supply unit (8) configured to supply a volatile solvent to a surface of the substrate W on the table (4), and an irradiator (10) configured to emit light to the substrate W, which has been supplied with the volatile solvent, and function as a heater that heats the substrate W such that a gas layer is formed on the surface of the substrate W to make the volatile solvent into a liquid ball. Thus, it is possible to dry the substrate successfully as well as to suppress pattern collapse.

Abstract: A substrate processing device includes a suction drying section drying a surface of a substrate by absorbing and removing a liquid droplet of volatile solvent formed on the surface of the substrate by a heating operation of a heating section.

Abstract: A memory controller includes: a memory access part which writes, to memory, an encrypted data acquired by encrypting information data, a first code for error detection based on the information data, and a second code for error detection based on the encrypted data and which reads the encrypted data, the first and second codes from the memory during a monitoring process being executed with a monitoring part; a decryption part for acquiring readout data by decrypting the encrypted data; and an error detection part which acquires a first error detection result by performing an error detection process on the readout data and the first code and a second error detection result by performing an error detection process on the encrypted data and the second code. The monitoring part stops the decryption part during the monitoring process and determines a deterioration level of memory based on the second error detection result.

Abstract: According to the embodiment, a substrate treating device 10 for treating a semiconductor wafer W using an etchant L containing hydrofluoric acid and nitric acid includes a storage tank 210 that stores the etchant L; a concentration sensor 256 that measures a concentration of nitrous acid in the etchant L; an alcohol feeding line 280 that feeds IPA to the etchant L and maintains the concentration of nitrous acid to a predetermined value or more; and a substrate treating unit 100 that feeds the etchant L in the storage tank 210 to the semiconductor wafer W. The substrate treating device can improve the etching efficiency by efficiently generating nitrous acid, and thereby producing an etchant having a nitrous acid concentration suitable for etching.

Abstract: According to one embodiment, a substrate processing apparatus includes a first liquid supplier, a second liquid supplier, and a controller. The first liquid supplier supplies a substrate with a sulfuric acid solution having a first temperature equal to or higher than the boiling point of hydrogen peroxide water. The second liquid supplier supplies a surface to be treated of the substrate with a mixture of sulfuric acid solution and hydrogen peroxide water having a second temperature lower than the first temperature. The controller controls the first liquid supplier to supply the sulfuric acid solution so as to heat the substrate to the boiling point of hydrogen peroxide water or higher. When the temperature of the substrate becomes equal to or higher than the second temperature, the controller controls the first liquid supplier to stop supplying the sulfuric acid solution and controls the second liquid supplier to supply the mixture.

Abstract: According to one embodiment, a substrate processing apparatus includes a processing chamber, a support part, a heater, and an optical member. In the processing chamber, air flows from the top to the bottom. The support part is located in the processing chamber to support a substrate having a surface to be treated. The heater is arranged so as not to be above the support part and emits light for heating. The optical member is arranged in the processing chamber so as not to be above the support part to guide the light emitted by the heater and having passed above the support part to the surface to be treated of the substrate supported by the support part.

Abstract: According to one embodiment, a processing apparatus includes a container, a processor, a supply unit, a recovery unit, a calculator, and a replenishing liquid supply unit. The container contains buffered hydrogen fluoride. The processor performs processing of a processing object using the buffered hydrogen fluoride. The supply unit supplies the buffered hydrogen fluoride to the processor. The buffered hydrogen fluoride is contained in the container. The recovery unit recovers the buffered hydrogen fluoride used in the processor and supplies the recovered buffered hydrogen fluoride to the container. The calculator calculates an evaporation amount of the buffered hydrogen fluoride. The replenishing liquid supply unit supplies the same amount of a replenishing liquid as the calculated evaporation amount of the buffered hydrogen fluoride to the buffered hydrogen fluoride. The replenishing liquid includes ammonia and water.