Patents by Inventor Yuji Yagi

Yuji Yagi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7485436
    Abstract: A method of stabilizing an oxidation color former in a solution is provided. N-(carboxymethylaminocarbonyl)-4,4?-bis(dimethylamino) diphenylamine sodium salt as an oxidation color former is stabilized by providing it with at least one of a fructosyl amino acid oxidase (FAOD) and a peroxidase (POD) in the solution. The concentration of the FAOD is in the range from 0.01 to 1.0 g/l or 1 to 100 KU/l, and the concentration of the POD is in the range from 0.01 to 1.0 g/l or 1 to 100 KU/l.
    Type: Grant
    Filed: October 9, 2002
    Date of Patent: February 3, 2009
    Assignee: Arkray, Inc.
    Inventors: Yuji Yagi, Tsuguki Komori
  • Patent number: 7096337
    Abstract: In one embodiment of the invention, a disk storage accessing system for enabling a plurality of computers to share and access a plurality of disk storages comprises a plurality of computers that refer to the disk storages. Each of the computers includes a counting module for counting a frequency of accesses to each of the disk storages, and a module for receiving an access path change command to change access paths for the computer to access a different disk storage according to the command. The system further comprises an instructing module for collecting and totaling a frequency of accesses to each disk storage, and for instructing the receiving module of a computer that accesses the copy source disk storage after receiving a report of copy completion, to change access paths so as to access a target disk storage instead of the copy source disk storage.
    Type: Grant
    Filed: September 13, 2004
    Date of Patent: August 22, 2006
    Assignee: Hitachi, Ltd.
    Inventors: Yuji Yagi, Motoaki Hirabayashi
  • Patent number: 6982027
    Abstract: A biosensor is provided, which can measure an analyte in a sample with high precision. The biosensor is produced by disposing a electrode system including a working electrode 12 and a counter electrode 13 on a substrate 11, and then forming a reagent layer 16 containing a reagent and particulates on the electrode system. The influence of the impurities in the sample on the electrode system can be eliminated by the particulates. The average particle diameter of the particulates preferably is in the range from 0.1 to 45 ?m.
    Type: Grant
    Filed: October 25, 2001
    Date of Patent: January 3, 2006
    Assignee: Arkray, Inc.
    Inventor: Yuji Yagi
  • Patent number: 6969907
    Abstract: A first electronic device, a second electronic device which generates less heat than the first electric device, and an electrode are connected by a heat leveling plate formed of an electrically conductive material having high thermal conductivity. A heat radiation plate is provided below an insulated substrate to which the first and second electronic devices are mounted. The second electronic device is cooled by a heat radiation path which extends through the insulated substrate and the heat radiation plate and a heat radiation path which extends through the second electronic device and the electrode to the heat radiation plate. The first and the second electronic device have substantially the same temperature due to heat radiation through the heat leveling plate. As a result, cooling effect of the electronic devices can be enhanced.
    Type: Grant
    Filed: October 3, 2002
    Date of Patent: November 29, 2005
    Assignee: Toyota Jidosha Kabushiki Kaisha
    Inventors: Makoto Imai, Naoki Ogawa, Yuji Yagi, Takashi Kojima, Yasushi Yamada
  • Patent number: 6916410
    Abstract: A biosensor is constituted by disposing an electrode system including a working electrode and a counter electrode on a substrate, forming an inorganic particulate-containing layer containing inorganic particulates thereon, and forming a reagent layer containing a reagent thereon. The inorganic particulates make it possible to prevent impurities in a sample from being in contact with the electrode system and being adsorbed therein, so that measurement is performed with high precision. The inorganic particulate-containing layer can be formed by applying a dispersion system of inorganic particulates and drying them, and it is preferable that the inorganic particulates are contained in the form of aggregates.
    Type: Grant
    Filed: May 15, 2002
    Date of Patent: July 12, 2005
    Assignee: Arkray, Inc.
    Inventors: Koji Katsuki, Katsumi Hamamoto, Yuji Yagi, Takao Fukuoka
  • Patent number: 6880244
    Abstract: Method of manufacturing a circuit board and semiconductor device wherein the circuit board has a plurality of wiring patterns and protrusions located on the wiring patterns, the method including simultaneously and unitarily forming the wiring patterns and protrusions, and alternatively coupling electrically the protrusions with electrodes on a semiconductor chip component when present.
    Type: Grant
    Filed: January 5, 2001
    Date of Patent: April 19, 2005
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Yuji Yagi, Takeo Yasuho
  • Publication number: 20050038959
    Abstract: In one embodiment of the invention, a disk storage accessing system for enabling a plurality of computers to share and access a plurality of disk storages comprises a plurality of computers that refer to the disk storages. Each of the computers includes a counting module for counting a frequency of accesses to each of the disk storages, and a module for receiving an access path change command to change access paths for the computer to access a different disk storage according to the command.
    Type: Application
    Filed: September 13, 2004
    Publication date: February 17, 2005
    Applicant: Hitachi, Ltd.
    Inventors: Yuji Yagi, Motoaki Hirabayashi
  • Publication number: 20040205900
    Abstract: A method of stabilizing an oxidation color former in a solution is provided. N-(carboxymethylaminocarbonyl)-4,4′-bis(dimethylamino) diphenylamine sodium salt as an oxidation color former is stabilized by providing it with at least one of a fructosyl amino acid oxidase (FAOD) and a peroxidase (POD) in the solution. The concentration of the FAOD is in the range from 0.01 to 1.0 g/l or 1 to 100 KU/l, and the concentration of the POD is in the range from 0.01 to 1.0 g/l or 1 to 100 KU/l.
    Type: Application
    Filed: May 28, 2004
    Publication date: October 21, 2004
    Inventors: Yuji Yagi, Tsuguki Komori
  • Patent number: 6792503
    Abstract: In one embodiment of the invention, a disk storage accessing system for enabling a plurality of computers to share and access a plurality of disk storage comprises a plurality of computers that refer to the disk storage. Each of the computers includes a counting module for counting a frequency of access to each of the disk storage, and a module for receiving an access path change command to change access paths for the computer to access a different disk storage according to the command.
    Type: Grant
    Filed: December 6, 2001
    Date of Patent: September 14, 2004
    Assignee: Hitachi, Ltd.
    Inventors: Yuji Yagi, Motoaki Hirabayashi
  • Patent number: 6790665
    Abstract: A method of determining Hb is provided, by which an amount of Hb can be determined easily and accurately without fear of damage to the environment. Hemoglobin in a sample is denatured with a tetrazolium compound to give denatured hemoglobin, and an amount of an optical change in the sample is measured at an absorption wavelength specific to the denatured hemoglobin. Using the amount of the optical change thus measured, an amount of the hemoglobin in the sample can be determined. The amount of the optical change preferably is measured at a wavelength in a range from 520 to 670 nm. According to this method, an amount of Hb can be determined with high accuracy as shown in FIG. 1.
    Type: Grant
    Filed: March 20, 2003
    Date of Patent: September 14, 2004
    Assignee: Arkray, Inc.
    Inventors: Satoshi Yonehara, Yuji Yagi
  • Publication number: 20040040839
    Abstract: A biosensor is provided, which can measure an analyte in a sample with high precision. The biosensor is produced by disposing a electrode system including a working electrode 12 and a counter electrode 13 on a substrate 11, and then forming a reagent layer 16 containing a reagent and particulates on the electrode system. The influence of the impurities in the sample on the electrode system can be eliminated by the particulates. The average particle diameter of the particulates preferably is in the range from 0.1 to 45 &mgr;m.
    Type: Application
    Filed: April 22, 2003
    Publication date: March 4, 2004
    Inventor: Yuji Yagi
  • Publication number: 20030186449
    Abstract: A method of determining Hb is provided, by which an amount of Hb can be determined easily and accurately without fear of damage to the environment. Hemoglobin in a sample is denatured with a tetrazolium compound to give denatured hemoglobin, and an amount of an optical change in the sample is measured at an absorption wavelength specific to the denatured hemoglobin. Using the amount of the optical change thus measured, an amount of the hemoglobin in the sample can be determined. The amount of the optical change preferably is measured at a wavelength in a range from 520 to 670 nm. According to this method, an amount of Hb can be determined with high accuracy as shown in FIG. 1.
    Type: Application
    Filed: March 20, 2003
    Publication date: October 2, 2003
    Inventors: Satoshi Yonehara, Yuji Yagi
  • Patent number: 6544818
    Abstract: The method of manufacturing a semiconductor device comprising: forming a wiring pattern on a substrate; forming a thermosetting resin layer on the substrate; aligning and adhering a semiconductor chip to the wiring pattern for electric connection via the thermosetting resin layer; and press-bonding an electrode of the chip onto the wiring pattern while the chip is being heated. During the press-bonding step, the substrate is cooled. By the cooling, the amount of thermal expansion of the substrate is suppressed and therefore comes closer to the thermal expansion of the chip. By mounting the chip on the substrate through the steps described above, the reliability of moisture resistance of the semiconductor device is greatly improved.
    Type: Grant
    Filed: March 9, 2001
    Date of Patent: April 8, 2003
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Yuji Yagi, Takeo Yasuho
  • Publication number: 20030025197
    Abstract: A first electronic device, a second electronic device which generates less heat than the first electric device, and an electrode are connected by a heat leveling plate formed of an electrically conductive material having high thermal conductivity. A heat radiation plate is provided below an insulated substrate to which the first and second electronic devices are mounted. The second electronic device is cooled by a heat radiation path which extends through the insulated substrate and the heat radiation plate and a heat radiation path which extends through the second electronic device and the electrode to the heat radiation plate. The first and the second electronic device have substantially the same temperature due to heat radiation through the heat leveling plate. As a result, cooling effect of the electronic devices can be enhanced.
    Type: Application
    Filed: October 3, 2002
    Publication date: February 6, 2003
    Inventors: Makoto Imai, Naoki Ogawa, Yuji Yagi, Takashi Kojima, Yasushi Yamada
  • Patent number: 6514364
    Abstract: The conductive particles can be sintered without being influenced by softening and removing of the adhesive layer. As a result, a wiring pattern of high precision can be formed without causing deformation of conductive pattern.
    Type: Grant
    Filed: December 13, 1999
    Date of Patent: February 4, 2003
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Kazuhiro Miura, Yoshihisa Takase, Masaaki Hayama, Eiji Kawamoto, Yuji Yagi
  • Publication number: 20020189941
    Abstract: A biosensor is constituted by disposing an electrode system including a working electrode and a counter electrode on a substrate, forming an inorganic particulate-containing layer containing inorganic particulates thereon, and forming a reagent layer containing a reagent thereon. The inorganic particulates make it possible to prevent impurities in a sample from being in contact with the electrode system and being adsorbed therein, so that measurement is performed with high precision. The inorganic particulate-containing layer can be formed by applying a dispersion system of inorganic particulates and drying them, and it is preferable that the inorganic particulates are contained in the form of aggregates.
    Type: Application
    Filed: May 15, 2002
    Publication date: December 19, 2002
    Applicant: ARKRAY, Inc.
    Inventors: Koji Katsuki, Katsumi Hamamoto, Yuji Yagi, Takao Fukuoka
  • Publication number: 20020069320
    Abstract: A disk storage accessing system that can disperse the load of each SAN disk storage accessed from a plurality of computers. An access frequency counter 124/134 counts a frequency of accesses to a disk storage of its computer. A resource monitoring/management unit 101 inquiries a resource monitoring unit 121/131 so that counted access frequencies of the disk storages are collected, totaled, then stored in a table 103. When the totaled access frequency of the disk storage is over a first predetermined value, the system requests a SAN controller 102 to copy the disk volume; under a second predetermined value, requests the SAN controller to delete the disk volume. Then, the SAN controller instructs a DKU controller 111 so that: the DKU controller 111, when being instructed to copy, instructs the copy source DKC to copy the disk volume into another disk storage; the DKU controller, when being instructed to delete, instructs the target DKC to delete the copied volume.
    Type: Application
    Filed: December 6, 2001
    Publication date: June 6, 2002
    Applicant: Hitachi, Ltd.
    Inventors: Yuji Yagi, Motoaki Hirabayashi
  • Publication number: 20020056509
    Abstract: The conductive particles can be sintered without being influenced by softening and removing of the adhesive layer. As a result, a wiring pattern of high precision can be formed without causing deformation of conductive pattern.
    Type: Application
    Filed: December 13, 1999
    Publication date: May 16, 2002
    Inventors: KAZUHIRO MIURA, YOSHIHISA TAKASE, MASAAKI HAYAMA, EIJI KAWAMOTO, YUJI YAGI
  • Patent number: 6374733
    Abstract: The present invention relates to a manufacturing method of a ceramic substrate used in various electronic appliances, and more particularly to a manufacturing method of a ceramic substrate forming a conductor pattern by intaglio printing. A conductive paste is supplied in the intaglio by using any one of screen mask, metal mask, or drawing device, and therefore the conductive paste can be supplied uniformly in desired positions only. The supplying amount of the conductive paste can be adjusted by repeating printing, so that an optimum amount can be set depending on the pattern. As a result, a fine wiring pattern of thick film can be easily formed, and a ceramic circuit board low in wiring resistance, high in wiring density, and high in dimensional precision of wiring pattern can be obtained.
    Type: Grant
    Filed: September 25, 2000
    Date of Patent: April 23, 2002
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Masaaki Hayama, Noboru Mouri, Hayami Matsunaga, Masayuki Mizuno, Eiji Kawamoto, Yuji Yagi
  • Publication number: 20010053564
    Abstract: The method of manufacturing a semiconductor device comprising: forming a wiring pattern on a substrate; forming a thermosetting resin layer on the substrate; aligning and adhering a semiconductor chip to the wiring pattern for electric connection via the thermosetting resin layer; and press-bonding an electrode of the chip onto the wiring pattern while the chip is being heated. During the press-bonding step, the substrate is cooled. By the cooling, the amount of thermal expansion of the substrate is suppressed and therefore comes closer to an thermal expansion of the chip. By mounting the chip on the substrate through the steps described above, the reliability of moisture resistance of the semiconductor device is greatly improved.
    Type: Application
    Filed: March 9, 2001
    Publication date: December 20, 2001
    Inventors: Yuji Yagi, Takeo Yasuho