Abstract: A first electronic device, a second electronic device which generates less heat than the first electric device, and an electrode are connected by a heat leveling plate formed of an electrically conductive material having high thermal conductivity. A heat radiation plate is provided below an insulated substrate to which the first and second electronic devices are mounted. The second electronic device is cooled by a heat radiation path which extends through the insulated substrate and the heat radiation plate and a heat radiation path which extends through the second electronic device and the electrode to the heat radiation plate. The first and the second electronic device have substantially the same temperature due to heat radiation through the heat leveling plate. As a result, cooling effect of the electronic devices can be enhanced.

Abstract: An acceleration sensor made available without using a high-level semiconductor technology or a micro-machining technology. The sensor detects an acceleration with a high precision, yet the manufacturing cost is inexpensive. In the sensor, a silicon substrate (1) is used only for a portion with which a strain is caused by an acceleration, while an auxiliary substrate (4A,4B), a cap (8A,8B) and a mass substance (6A,6B) are formed of glass material. Joining of the silicon substrate (1) to the mass substance (6A,6B) and the auxiliary substrate (4A,4B), and the auxiliary substrate (4A,4B) to the cap (8A,8B) are made by direct bonding.

Abstract: A circuit board with protrusions at desired locations on a wiring pattern that on the surface of the board. The protrusions are made of the same conductive material used in the wiring pattern, and formed unitarily and simultaneously with the wiring pattern. Conductive material is filled into grooves having different depths and formed on a film. The filled conductive material is transferred onto the board, and then fired. Thus the circuit board is manufactured. Semiconductor devices and general-purpose components are mounted on the circuit board, whereby a semiconductor device can be manufactured with high reliability and at an inexpensive cost.

Abstract: A circuit board with protrusions at desired locations on a wiring pattern that on the surface of the board. The protrusions are made of the same conductive material used in the wiring pattern, and formed unitarily and simultaneously with the wiring pattern. Conductive material is filled into grooves having different depths and formed on a film. The filled conductive material is transferred onto the board, and then fired. Thus the circuit board is manufactured. Semiconductor devices and general-purpose components are mounted on the circuit board, whereby a semiconductor device can be manufactured with high reliability and at an inexpensive cost.

Abstract: An information recording/reproducing apparatus removably holding a disk cartridge including a case having a head window and a recording medium stored in the case is provided.

Abstract: A magnetic recording and reproducing apparatus comprising: a magnetic recording and reproducing medium; a spindle motor for effecting rotational drive of the magnetic recording and reproducing medium; a transducer for recording and reproducing information on one face of the magnetic recording and reproducing medium; a displacement member for displacing the transducer to an arbitrary radial position on the face of the magnetic recording and reproducing medium; an electric circuit board for processing the information and controlling the spindle motor and the displacement member; and a casing in which the magnetic recording and reproducing medium, the spindle motor, the transducer, the displacement member and the electric circuit board are mounted; the casing having a bottom wall such that a boxlike space is defined below the bottom wall; the electric circuit board being disposed in the boxlike space.

Abstract: A vehicle wiper blade assembly has a cover for covering blade support members, which support a wiper blade at different points therealong, and for covering portions of the wiper blade. A blade spoiler can be adjustably attached either to a primary lever, which connects the support members with the cover to a wiper arm, or to the wiper arm. The spoiler presses the wiper blade against the windshield when the vehicle is moving, improving the wiping efficiency. The lower edge of the spoiler is positioned nearer to the windshield than to the to the bottom of the cover to improve air and debris (such as snow) flow. The support members are also pivotally coupled to both ends of the primary lever to improve the wiper blade efficiency.

Abstract: A composition for detecting or quantitatively measuring a peroxide active material in a sample, containing an organic hydroperoxide, a chromogen, and an iron (111) complex of the formula: [(OOC-X-COO).sub.3 Fe]M.sub.3 in which X is an alkylene group:-(CH.sub.2).sub.n - (n=0-5) or an allyl group, and M is a monovalent cation, which can eliminate the influence of reducing compounds such as ascorbic acid contained in the sample.

Abstract: A magnetic disc apparatus has a rocking type actuator driven in a rocking motion by the driving force of a VCM (voice coil motor). Two flexible bending members fixed to a rotor move in synchronization with the driving of the rocking type actuator. The respective flexible bending members are attached to two FPC (Flexible printed circuit sheet) fixing portions provided on the outer wall of the rotor and radially arranged with respect to the driving center of the rocking type actuator so as to have the bending portions bent in directions opposite to each other. The reaction forces of the flexible printed circuit sheets are then canceled out with respect to each other at all times, and hardly affect the driving of the actuator. Therefore, reserve power may be given to the VCM (voice coil motor) while an actuator having a favorable follow-up characteristic with respect to data tracks can be obtained.

Abstract: There is disclosed an electromechanical semiconductor transducer which is composed of a substrate of a first compound semiconductor and layers of second to fifth compound semiconductors grown on the substrate. The compound semiconductor contains at least one element such as aluminum, gallium, and arsenic selected from Groups III and V of the periodic table. The transducer converts mechanical strain into electrical signals.