Patents by Inventor Yuji Yano

Yuji Yano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wiring substrate, semiconductor device and package stack semiconductor device
    Publication number: 20020000327
    Abstract: A wiring substrate of the present invention includes a terminal section, provided on a first surface of an insulating substrate, for wire or flip-chip bondings; a land section, provided on the insulating substrate, for an external connection terminal; wiring patterns, respectively provided on the first surface and a second surface on the other side of the first surface, for making electrical connection between the terminal section and the land section; and a support pattern, provided on the second surface corresponding in position to the terminal section, for improving bondings. The wiring substrate can relieve connection failure in bondings.
    Type: Application
    Filed: June 5, 2001
    Publication date: January 3, 2002
    Inventors: Hiroyuki Juso, Yasuki Fukui, Yuji Yano, Seiji Ishihara
  • Fluid/electrical rotary joint
    Patent number: 5498163
    Abstract: A composite rotary joint for both fluid and electrical connections particularly suitable for application with a rotary table. The rotary joint provides a substantially more compact and serviceable arrangement than existing rotary joints.
    Type: Grant
    Filed: April 29, 1994
    Date of Patent: March 12, 1996
    Assignee: Kuroda Precision Industries, Ltd.
    Inventors: Zenichi Takamura, Yuji Yano, Yasuo Sato