Abstract: To effectively utilize the polarization property of an inspection subject for obtaining higher inspection sensitivity, for the polarization of lighting, it is necessary to observe differences in the reflection, diffraction, and scattered light from the inspection subject because of polarization by applying light having the same elevation angle and wavelength in the same direction but different polarization. According to conventional techniques, a plurality of measurements by changing polarizations is required to cause a prolonged inspection time period that is an important specification of inspection apparatuses.

Abstract: A defect inspection method and device for irradiating a linear region on a surface-patterned sample mounted on a planarly movable table, with illumination light from an inclined direction relative to a direction of a line normal to the sample, next detecting in each of a plurality of directions an image of the light scattered from the sample irradiated with the illumination light, then processing signals obtained by the detection of the images of the scattered light, and thereby detecting a defect present on the sample; wherein the step of detecting the scattered light image in the plural directions is performed through elliptical lenses in which elevation angles of the optical axes thereof are different from each other, within one plane perpendicular to a plane formed by the normal to the surface of the table on which to mount the sample and the longitudinal direction of the linear region irradiated with the irradiation light, the elliptical lenses being formed of circular lenses having left and right portio

Abstract: A defect inspecting apparatus includes an irradiation optical system having a light source that emits illumination light and a polarization generation part that adjusts polarization state of the illumination light emitted from the light source, a detection optical system having a polarization analysis part that adjusts polarization state of scattered light from a sample irradiated by the irradiation optical system and a detection part that detects the scattered light adjusted by the polarization analysis part, and a signal processing system that processes the scattered light detected by the detection optical system to detect a defect presenting in the sample. The polarization generation part adjusts the polarization state of the illumination light emitted from the light source on the basis of predetermined illumination conditions and the polarization analysis part adjusts the polarization state of the illumination light emitted from the light source on the basis of predetermined detection conditions.

Abstract: An invention being applied is a defect detecting apparatus that has: an illuminating optical system with a laser light source for irradiating a sample on whose surface a pattern is formed with light; a detecting optical system with a sensor for detecting light generated from the sample illuminated by the illuminating optical system; and a signal processing unit that extracts a defect from an image based on the light detected by the detecting optical system, in which an amplification rate of the sensor is dynamically changed during a time when the light is detected by the detecting optical system.

Abstract: Proposed is a defect inspection method whereby: illuminating light having a substantially uniform illumination intensity distribution in one direction of a sample surface irradiated on the sample surface; multiple scattered light components, which are output in multiple independent directions, are detected among the scattered light from the sample surface and multiple corresponding scattered light detection signals are obtained; at least one of the multiple scattered light detection signals is processed and the presence of defects is determined; at least one of the multiple scattered light detection signals that correspond to each of the points determined by the processing as a defect is processed and the dimensions of the defect are determined; and the position and dimensions of the defect on the sample surface, at each of the points determined as a defect, are displayed.

Abstract: A method of inspecting defects and a device inspecting defects of detecting defects at high sensitivity and high capture efficiency even on various patterns existing on a wafer. In the device of inspecting defects, an illumination optical system is formed of two systems of a coherent illumination of a laser 5 and an incoherent illumination of LEDs 6a, 6b, 6c and 6d, and light paths are divided in a detecting system corresponding to respective illumination light, spatial modulation elements 55a and 55b are arranged to detecting light paths, respectively, scattered light inhibiting sensitivity is shielded by the spatial modulating elements 55a and 55b, scattered light transmitted through the spatial modulation elements 55a and 55b is detected by image sensors 90a and 90b arranged to respective light paths, and images detected by these two image sensors 90a and 90b are subjected to a comparison processing, thereby determining a defect candidate.

Abstract: An optical filtering device and an optical inspection apparatus for detecting a defect in a high sensitivity using an optical filtering device which includes a shutter array formed in a two-dimensionally on an optically opaque thin film produced on a SOI wafer and the SOI wafer is removed at portions thereof on the lower side of the shutter patterns to form perforation portions while working electrodes are formed at the remaining portion of the SOI wafer, a glass substrate having electrode patterns formed on the surface thereof and having the shutter array mounted thereon, and a power supply section for supplying electric power to the electrode patterns formed on the glass substrate and the working electrodes of the SOI wafer. And the working electrodes is controlled to cause the shutter patterns to carry out opening and closing movements with respect to the perforation portions to carry out optical filtering.

Abstract: A communication processing device includes a communication data processing circuit that (i) issues an access request for a buffer specified by a descriptor, among a plurality of buffers in a first memory, and (ii) outputs a predetermined switching permission signal at a time when a data access for one of the plurality of buffers is completed. The communication processing device also includes a second memory and a transmission destination switching circuit. The second memory includes a plurality of alternative buffers corresponding to the plurality of buffers. The transmission destination switching circuit switches a transmission destination of the access request from one of the plurality of buffers in the first memory to one of the plurality of alternative buffers in the second memory, based on the switching permission signal.

Abstract: Disclosed is a defect inspection method which makes it possible to scan the entire surface of a sample and detect minute defects without causing thermal damage to the sample. A defect inspection method in which a pulse laser emitted from a light source is subjected to pulse division and irradiated on the surface of a sample which moves in one direction while the divided-pulse pulse laser is rotated, reflection light from the sample irradiated by the divided-pulse pulse laser is detected, the signal of the detected reflection light is processed to detect defects on the sample, and information regarding a detected defect is output to a display screen, wherein the barycentric position of the light intensity of the divided-pulse pulse laser is monitored and adjusted.

Abstract: By including an illumination system and a detection system, an information collecting function of monitoring an environment, such as temperature and atmospheric pressure, and an apparatus state managing function having a feedback function of comparing the monitoring result and a design value, a theoretical calculation value or an ideal value derived from simulation results and calibrating an apparatus so that the monitoring result is brought close to the ideal value, a unit for keeping the apparatus state and apparatus sensitivity constant is provided. A control unit 800 is configured to include a recording unit 801, a comparing unit 802, a sensitivity predicting unit 803, and a feedback control unit 804. In the comparing unit 802, the monitoring result transmitted from the recording unit 801 and an ideal value stored in a database 805 are compared with each other.

Abstract: A defect inspecting method is provided which comprises a pre-scan defect inspecting process including a pre-scan irradiating step for casting irradiation light onto the surface of a sample, a pre-scan detecting step for detecting the scattered lights, and a pre-scan defect information collecting step for obtaining information on preselected defects present on the sample surface on the basis of the scattered lights; a near-field defect inspecting process including a near-field irradiating step in which the distance between the sample surface and a near-field head is adjusted so that the sample surface is irradiated, a near-field detecting step for detecting near-field light response, and a near-field defect information collecting step for obtaining information on the preselected defects on the basis of the near-field light response; and a merging process for inspecting defects present on the sample surface by merging the pieces of information on the preselected defects.

Abstract: In order to enable inspections to be conducted at a sampling rate higher than the pulse oscillation frequency of a pulsed laser beam emitted from a laser light source, without damaging samples, a defect inspection method is disclosed, wherein: a single pulse of a pulsed laser beam emitted from the laser light source is split into a plurality of pulses; a sample is irradiated with this pulse-split pulsed laser beam; scattered light produced by the sample due to the irradiation is focused and detected; and defects on the sample are detected by using information obtained by focusing and detecting the scattered light from the sample. Said defect inspection method is configured such that the splitting a single pulse of the pulsed laser beam into a plurality of pulses is controlled in such a manner that the peak values of the split pulses are substantially uniform.

Abstract: A defect inspection method includes: illuminating an area on surface of a specimen as a test object under a specified illumination condition; scanning a specimen to translate and rotate the specimen; detecting scattering lights to separate each of scattering lights scattered in different directions from the illuminated area on the specimen into pixels to be detected according to a scan direction at the scanning a specimen and a direction approximately orthogonal to the scan direction; and processing to perform an addition process on each of scattering lights that are detected at the step and scatter approximately in the same direction from approximately the same area of the specimen, determine presence or absence of a defect based on scattering light treated by the addition process, and compute a size of the determined defect using at least one of the scattering lights corresponding to the determined defect.

Abstract: In a defect inspection method and an apparatus of the same, for enabling to conduct an inspection of fine defects without applying thermal damages on a sample, the following steps are conducted: mounting a sample on a rotatable table to rotate; irradiating a pulse laser emitting from a laser light source upon the sample rotating; detecting a reflected light from the sample, upon which the pulse laser is irradiated; detecting the reflected light from the sample detected; and detecting a defect on the sample through processing of a signal obtained through the detection, wherein irradiation of the pulse laser emitting from the laser light source upon the sample rotating is conducted by dividing the one pulse emitted from the laser light source into plural numbers of pulses, and irradiating each of the divided pulse lasers upon each of separate positions on the sample, respectively.

Abstract: To process a signal from a plurality of detectors without being affected by a variation in the height of a substrate, and to detect more minute defects on the substrate, a defect inspection device is provided with a photoelectric converter having a plurality of rows of optical sensor arrays in each of first and second light-collecting/detecting unit and a processing unit for processing a detection signal from the first and the second light-collecting/detecting unit to determine the extent to which the positions of the focal points of the first and the second light-collecting/detecting unit are misaligned with respect to the surface of a test specimen, and processing the detection signal to correct a misalignment between the first and the second light-collecting/detecting unit, and the corrected detection signal outputted from the first and the second light-collecting/detecting unit are combined together to detect the defects on the test specimen.

Abstract: A communication processing device includes a communication data processing circuit that (i) issues an access request for a buffer specified by a descriptor, among a plurality of buffers in a first memory, and (ii) outputs a predetermined switching permission signal at a time when a data access for one of the plurality of buffers is completed. The communication processing device also includes a second memory and a transmission destination switching circuit. The second memory includes a plurality of alternative buffers corresponding to the plurality of buffers. The transmission destination switching circuit switches a transmission destination of the access request from one of the plurality of buffers in the first memory to one of the plurality of alternative buffers in the second memory, based on the switching permission signal.

Abstract: A defect inspecting apparatus includes an irradiation optical system having a light source that emits illumination light and a polarization generation part that adjusts polarization state of the illumination light emitted from the light source, a detection optical system having a polarization analysis part that adjusts polarization state of scattered light from a sample irradiated by the irradiation optical system and a detection part that detects the scattered light adjusted by the polarization analysis part, and a signal processing system that processes the scattered light detected by the detection optical system to detect a defect presenting in the sample. The polarization generation part adjusts the polarization state of the illumination light emitted from the light source on the basis of predetermined illumination conditions and the polarization analysis part adjusts the polarization state of the illumination light emitted from the light source on the basis of predetermined detection conditions.

Abstract: A defect inspecting method is provided which comprises a pre-scan defect inspecting process including a pre-scan irradiating step for casting irradiation light onto the surface of a sample, a pre-scan detecting step for detecting the scattered lights, and a pre-scan defect information collecting step for obtaining information on preselected defects present on the sample surface on the basis of the scattered lights; a near-field defect inspecting process including a near-field irradiating step in which the distance between the sample surface and a near-field head is adjusted so that the sample surface is irradiated, a near-field detecting step for detecting near-field light response, and a near-field defect information collecting step for obtaining information on the preselected defects on the basis of the near-field light response; and a merging process for inspecting defects present on the sample surface by merging the pieces of information on the preselected defects.

Abstract: Proposed is a defect inspection method whereby: illuminating light having a substantially uniform illumination intensity distribution in one direction of a sample surface irradiated on the sample surface; multiple scattered light components, which are output in multiple independent directions, are detected among the scattered light from the sample surface and multiple corresponding scattered light detection signals are obtained; at least one of the multiple scattered light detection signals is processed and the presence of defects is determined; at least one of the multiple scattered light detection signals that correspond to each of the points determined by the processing as a defect is processed and the dimensions of the defect are determined; and the position and dimensions of the defect on the sample surface, at each of the points determined as a defect, are displayed.

Abstract: A cleaning method includes: producing an oxidizing solution by electrolysis of sulfuric acid; and cleaning a workpiece with the oxidizing solution. The oxidizing solution is heated by heat of mixing to clean the workpiece. A method for manufacturing an electronic device includes: producing a workpiece; producing an oxidizing solution by electrolysis of sulfuric acid; and cleaning the workpiece with the oxidizing solution. The oxidizing solution is heated by heat of mixing to clean the workpiece.