Patents by Inventor Yukiya Yamaguchi

Yukiya Yamaguchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210203366
    Abstract: A radio frequency module includes a module board including a first principal surface and a second principal surface on opposite sides thereof; a transmission power amplifier; a control circuit configured to control the transmission power amplifier; a first transmission filter and a second transmission filter; and a first switch configured to switch connection of an output terminal of the transmission power amplifier between the first transmission filter and the second transmission filter. The control circuit is disposed on the first principal surface, and the first switch is disposed on the second principal surface.
    Type: Application
    Filed: March 11, 2021
    Publication date: July 1, 2021
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Takayuki SHINOZAKI, Yukiya YAMAGUCHI, Morio TAKEUCHI, Yoichi SAWADA
  • Publication number: 20210194518
    Abstract: In a radio frequency module, the first inductor is disposed on the first principal surface of the mounting board and located on the first reception path through which a first reception signal of a first frequency passes, on an input side of the first low noise amplifier. The second inductor is disposed on the first principal surface of the mounting board and located on the second reception path through which a second reception signal of a second frequency lower than the first frequency passes, on an input side of the second low noise amplifier. The radio frequency component is disposed between the first inductor and the second inductor. A distance between the first inductor and the shielding layer is greater than a distance between the second inductor and the shielding layer. The first inductor overlaps the first low noise amplifier in a thickness direction of the mounting board.
    Type: Application
    Filed: December 21, 2020
    Publication date: June 24, 2021
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Takanori ITO, Morio TAKEUCHI, Yukiya YAMAGUCHI
  • Publication number: 20210184704
    Abstract: A radio frequency module includes: a module board including a first principal surface and a second principal surface on opposite sides of the module board; an antenna connection terminal; a filter that is on the first principal surface and connected to the antenna connection terminal, wherein the filter includes one or more inductors and one or more capacitors, and is configured to allow a transmission signal and a reception signal to pass through; and a reception low noise amplifier on the second principal surface and configured to amplify the reception signal.
    Type: Application
    Filed: December 9, 2020
    Publication date: June 17, 2021
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Yoichi SAWADA, Yukiya YAMAGUCHI
  • Publication number: 20210136186
    Abstract: A radio frequency module includes: a module substrate that includes a principal surface on which external-connection terminals are disposed; a power amplifier that is disposed on the principal surface of the module substrate and amplifies a radio frequency transmission signal; and a heat dissipator that dissipates heat of the power amplifier. The heat dissipator includes: a heat dissipation plate that covers a surface of the power amplifier which is opposite to a surface that faces the module substrate; and at least a first leg that extends from the heat dissipation portion toward the principal surface of the module substrate.
    Type: Application
    Filed: October 23, 2020
    Publication date: May 6, 2021
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Yoichi SAWADA, Hiroshi NISHIKAWA, Yukiya YAMAGUCHI
  • Patent number: 10979087
    Abstract: A radio frequency module includes a module board including a first principal surface and a second principal surface on opposite sides thereof; a transmission power amplifier; a control circuit configured to control the transmission power amplifier; a first transmission filter and a second transmission filter; and a first switch configured to switch connection of an output terminal of the transmission power amplifier between the first transmission filter and the second transmission filter. The control circuit is disposed on the first principal surface, and the first switch is disposed on the second principal surface.
    Type: Grant
    Filed: September 16, 2020
    Date of Patent: April 13, 2021
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Takayuki Shinozaki, Yukiya Yamaguchi, Morio Takeuchi, Yoichi Sawada
  • Publication number: 20210091807
    Abstract: A radio frequency module includes a module board including a first principal surface and a second principal surface on opposite sides of the module board, a transmission power amplifier connected to a transmission path, a first circuit component connected to a reception path, and a control circuit that controls the transmission power amplifier. The control circuit is disposed on the first principal surface, and the first circuit component is disposed on the second principal surface.
    Type: Application
    Filed: September 16, 2020
    Publication date: March 25, 2021
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Takayuki SHINOZAKI, Yukiya YAMAGUCHI, Morio TAKEUCHI, Yoichi SAWADA
  • Publication number: 20210091800
    Abstract: A radio frequency module includes: a module board including a first principal surface and a second principal surface on opposite sides of the module board; a transmission power amplifier configured to amplify a transmission signal; a first switch; and a first inductor included in a matching circuit connected between an output terminal of the transmission power amplifier and the first switch. The first inductor is disposed on the first principal surface, and the first switch is disposed on the second principal surface.
    Type: Application
    Filed: September 1, 2020
    Publication date: March 25, 2021
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Yoichi SAWADA, Takayuki SHINOZAKI, Yukiya YAMAGUCHI
  • Publication number: 20210091802
    Abstract: A radio frequency module includes: a module board including a first principal surface and a second principal surface on opposite sides of the module board; an antenna connection terminal; a diplexer connected to the antenna connection terminal and including at least a first inductor which is a chip inductor; a transmission power amplifier; and a first circuit component disposed on a transmission path connecting the diplexer and the transmission power amplifier. The first inductor is disposed on the first principal surface, and one of the transmission power amplifier and the first circuit component is disposed on the second principal surface.
    Type: Application
    Filed: September 14, 2020
    Publication date: March 25, 2021
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Yoichi SAWADA, Takayuki SHINOZAKI, Yukiya YAMAGUCHI
  • Publication number: 20210091803
    Abstract: A radio frequency module includes: a switch that includes: a common terminal connected to a first common transmission path; a first selection terminal connected to a first transmission path; and a second selection terminal connected to a second transmission path, and switches between connecting the common terminal to the first selection terminal and to the second selection terminal; a transmission power amplifier disposed on the module board and on first common transmission path; and first circuit components disposed on a reception path. The first transmission path is a path through which a transmission signal of a first communication band is transferred, the second transmission path is a path through which a transmission signal of a second communication band is transferred, the switch is disposed on a first principal surface, and at least one of the first circuit components is disposed on a second principal surface.
    Type: Application
    Filed: September 16, 2020
    Publication date: March 25, 2021
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Morio TAKEUCHI, Yukiya YAMAGUCHI, Yoichi SAWADA
  • Publication number: 20210091801
    Abstract: A radio frequency module includes a module board including a first principal surface and a second principal surface on opposite sides thereof, a transmission power amplifier, a control circuit that controls the transmission power amplifier, and a first inductor connected to an output terminal of the transmission power amplifier. The control circuit is disposed on the first principal surface, and the first inductor is disposed on the second principal surface.
    Type: Application
    Filed: September 10, 2020
    Publication date: March 25, 2021
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Takayuki SHINOZAKI, Yukiya YAMAGUCHI, Morio TAKEUCHI, Yoichi SAWADA
  • Publication number: 20210091796
    Abstract: A radio frequency module includes a module board including a first principal surface and a second principal surface on opposite sides thereof; a transmission power amplifier; a control circuit configured to control the transmission power amplifier; a first transmission filter and a second transmission filter; and a first switch configured to switch connection of an output terminal of the transmission power amplifier between the first transmission filter and the second transmission filter. The control circuit is disposed on the first principal surface, and the first switch is disposed on the second principal surface.
    Type: Application
    Filed: September 16, 2020
    Publication date: March 25, 2021
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Takayuki SHINOZAKI, Yukiya YAMAGUCHI, Morio TAKEUCHI, Yoichi SAWADA
  • Publication number: 20200403596
    Abstract: A high-frequency module includes a high-frequency switch, filters (21 to 23), (31 to 33), and connection circuits (41 to 46). The high-frequency switch has filter-side terminals (Ps1 to Ps 6). The filters (21, 22, 23) each include a plurality of filters having characteristics different from each other. The filters (31, 32, 33) each include one type of filter. The connection circuits (41, 42, 43) connect the terminals (Ps1, Ps2, Ps3) of the high-frequency switch to the common terminals (Pc21, Pc22, Pc23) of the filters (21, 22, 23), respectively. The connection circuits (44, 45, 46) connect the terminals (Ps4, Ps5, Ps6) of the high-frequency switch to the filters (31, 32, 33), respectively. The connection circuits (41, 42, 43) are shorter than the connection circuits (44, 45, 46).
    Type: Application
    Filed: September 4, 2020
    Publication date: December 24, 2020
    Inventors: Yukiya YAMAGUCHI, Shun HARADA
  • Publication number: 20200328766
    Abstract: A radio frequency module includes a first terminal, a second terminal, a third terminal, a first switching circuit, a bandpass filter, a first band elimination filter, and a first wiring conductor. The first switching circuit switches between a connection between a first switch terminal and a second switch terminal and a connection between the first switch terminal and a third switch terminal. The bandpass filter is disposed on a first signal path connecting the first terminal to the first switch terminal, and has a first passband. The first band elimination filter is disposed on a second signal path connecting the second switch terminal to the second terminal, and has a first elimination band included in the first passband. The first wiring conductor forms a third signal path connecting the third switch terminal to the third terminal.
    Type: Application
    Filed: June 24, 2020
    Publication date: October 15, 2020
    Inventor: Yukiya YAMAGUCHI
  • Publication number: 20200228151
    Abstract: A semiconductor device includes a base, a first switching unit disposed on the base, the first switching unit having a substantially rectangular shape and including plural first switches, and an amplifier unit disposed on the base, the amplifier unit including plural amplifier circuits to which a radio-frequency signal is inputted after passing through the first switching unit. In plan view of the base, the first switching unit has four edges including a first edge, a second edge orthogonal to the first edge, and a third edge parallel to the first edge and orthogonal to the second edge, the amplifier unit includes a first region extending along the first edge, a second region extending along the second region, and a third region extending along the third edge, and at least one of the plural amplifier circuits is disposed in each of the first region, the second region, and the third region.
    Type: Application
    Filed: March 27, 2020
    Publication date: July 16, 2020
    Inventors: Yusuke NANIWA, Hideki MUTO, Yukiya YAMAGUCHI, Shun HARADA
  • Patent number: 10715097
    Abstract: A multiplexer includes a first filter disposed on a first signal path, a second filter disposed on a second signal path different from the first signal path, the second filter having a passband different from that of the first filter, a common connection point at which the first signal path and the second signal path are connected to each other, and an inductor disposed in series on a path connecting the common connection point and the first filter, the path being a portion of the first signal path. On the first signal path, a distance connecting the common connection point and the inductor is shorter than a distance connecting the inductor and the first filter.
    Type: Grant
    Filed: February 13, 2019
    Date of Patent: July 14, 2020
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Shun Harada, Yukiya Yamaguchi
  • Publication number: 20190280668
    Abstract: A multiplexer includes a first filter disposed on a first signal path, a second filter disposed on a second signal path different from the first signal path, the second filter having a passband different from that of the first filter, a common connection point at which the first signal path and the second signal path are connected to each other, and an inductor disposed in series on a path connecting the common connection point and the first filter, the path being a portion of the first signal path. On the first signal path, a distance connecting the common connection point and the inductor is shorter than a distance connecting the inductor and the first filter.
    Type: Application
    Filed: February 13, 2019
    Publication date: September 12, 2019
    Inventors: Shun HARADA, Yukiya YAMAGUCHI
  • Patent number: 9948276
    Abstract: In a high-frequency module, first and second inductors that adjust attenuation characteristics of a first filter of a filter component, are separated from each other such that the first and second inductors readily magnetic field couple with each other. Consequently, an amount of wiring used to define a first wiring electrode inside the filter component is reduced and a number of layers of a package substrate and the profile of the filter component are reduced. Consequently, variations in the attenuation characteristics of the first filter caused by the first wiring electrode electromagnetic-field coupling with another wiring electrode are prevented. The attenuation characteristics of the first filter is easily adjusted and improved by adjusting the inductance value of the second inductor.
    Type: Grant
    Filed: February 9, 2017
    Date of Patent: April 17, 2018
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Yukiya Yamaguchi
  • Publication number: 20170155376
    Abstract: In a high-frequency module, first and second inductors that adjust attenuation characteristics of a first filter of a filter component, are separated from each other such that the first and second inductors readily magnetic field couple with each other. Consequently, an amount of wiring used to define a first wiring electrode inside the filter component is reduced and a number of layers of a package substrate and the profile of the filter component are reduced. Consequently, variations in the attenuation characteristics of the first filter caused by the first wiring electrode electromagnetic-field coupling with another wiring electrode are prevented. The attenuation characteristics of the first filter is easily adjusted and improved by adjusting the inductance value of the second inductor.
    Type: Application
    Filed: February 9, 2017
    Publication date: June 1, 2017
    Inventor: Yukiya YAMAGUCHI
  • Patent number: 9484608
    Abstract: A switch module includes a plurality of mounting electrodes for external connection provided on a peripheral portion of one main surface of a wiring substrate. The plurality of mounting electrodes includes a common electrode, a plurality of RF signal electrodes, a control electrode, and a power supply electrode. At least one of the power supply electrode and the control electrode is arranged between the RF signal electrodes.
    Type: Grant
    Filed: April 29, 2013
    Date of Patent: November 1, 2016
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Yukiya Yamaguchi, Takanori Uejima
  • Publication number: 20130314170
    Abstract: A switch module includes a plurality of mounting electrodes for external connection provided on a peripheral portion of one main surface of a wiring substrate. The plurality of mounting electrodes includes a common electrode, a plurality of RF signal electrodes, a control electrode, and a power supply electrode. At least one of the power supply electrode and the control electrode is arranged between the RF signal electrodes.
    Type: Application
    Filed: April 29, 2013
    Publication date: November 28, 2013
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Yukiya YAMAGUCHI, Takanori UEJIMA