Abstract: A radio-frequency module includes a transmission path which has one end connected to a transmission terminal and on which a transmission signal in Band A is transmitted; a reception path (62) which has one end connected to a reception terminal (120B) and on which a reception signal in Band B is transmitted; a reception path (63) which has one end connected to a reception terminal (120C) and on which a reception signal in Band C is transmitted; a switch (11) having a common terminal (11a) and selection terminals (11b and 11c); and a switch (12) having a common terminal (12a) and selection terminals (12b and 12c).

Abstract: A radio frequency module includes: a first power amplifier and a second power amplifier on a first principal surface of a module board; external-connection terminals on a second principal surface; and a first via-conductor and a second via-conductor apart from each other inside of the board. One end of the first via-conductor is connected to a ground electrode of the first power amplifier, and the other end is connected to a first external-connection terminal. One end of the second via-conductor is connected to a ground electrode of the second power amplifier, and the other end is connected to a second external-connection terminal. The second via-conductor penetrates the board in a normal direction of the first principal surface, and the first via-conductor includes columnar conductors cascaded with central axes thereof displaced in the normal direction and has no region where the columnar conductors overlap in a plan view of the board.

Abstract: A radio frequency module includes: a module board; a first electronic component and a second electronic component that are disposed apart from each other on the module board; and a third electronic component that is electrically connected to both the first electronic component and the second electronic component, and is disposed extending across the first electronic component and the second electronic component.

Abstract: A radio-frequency module includes a switch performing switching of the connection between a common terminal and a selection terminal, a reception filter having a reception band in a band A as a passband, a transmission filter that has a transmission band in a band B as a passband and has an output terminal connected to the selection terminal, a filter that has the transmission band in a band B as an attenuation band and has an input terminal connected to the selection terminal, a reception path which connects the selection terminal and an input terminal of the reception filter and on which the filter is disposed, a bypass path which connects the selection terminal and the input terminal of the reception filter and on which no filter is disposed, and a transmission path which connects the selection terminal and a transmission terminal and on which the transmission filter is disposed.

Abstract: A radio frequency module includes: a module board that includes a first principal surface and a second principal surface on opposite sides of the module board; a first power amplifier disposed on the first principal surface and configured to amplify a transmission signal in a first frequency band; a second power amplifier disposed on the first principal surface and configured to amplify a transmission signal in a second frequency band different from the first frequency band; and a power amplifier (PA) control circuit disposed on the second principal surface and configured to control the first power amplifier and the second power amplifier.

Abstract: A radio frequency module includes: a module board that includes a first principal surface and a second principal surface on opposite sides of the module board; a first power amplifier disposed on the first principal surface and configured to amplify a transmission signal in a first frequency band; a second power amplifier disposed on the first principal surface and configured to amplify a transmission signal in a second frequency band different from the first frequency band; and a switch disposed on the second principal surface and connected to an output terminal of the first power amplifier and an output terminal of the second power amplifier.

Abstract: A radio frequency module includes: a module board that includes a first principal surface and a second principal surface on opposite sides of the module board; a first power amplifier configured to amplify a transmission signal in a first frequency band; a second power amplifier configured to amplify a transmission signal in a second frequency band different from the first frequency band; and a switch having a first pole connected to an input terminal of the first power amplifier and a second pole connected to an input terminal of the second power amplifier. The first power amplifier and the second power amplifier are disposed on the first principal surface, and the switch is disposed on the second principal surface.

Abstract: A semiconductor device includes a base, a first switching unit disposed on the base, the first switching unit having a substantially rectangular shape and including plural first switches, and an amplifier unit disposed on the base, the amplifier unit including plural amplifier circuits to which a radio-frequency signal is inputted after passing through the first switching unit. In plan view of the base, the first switching unit has four edges including a first edge, a second edge orthogonal to the first edge, and a third edge parallel to the first edge and orthogonal to the second edge, the amplifier unit includes a first region extending along the first edge, a second region extending along the second region, and a third region extending along the third edge, and at least one of the plural amplifier circuits is disposed in each of the first region, the second region, and the third region.

Abstract: A radio frequency module includes a module board including a first principal surface and a second principal surface on opposite sides thereof; a transmission power amplifier; a control circuit configured to control the transmission power amplifier; a first transmission filter and a second transmission filter; and a first switch configured to switch connection of an output terminal of the transmission power amplifier between the first transmission filter and the second transmission filter. The control circuit is disposed on the first principal surface, and the first switch is disposed on the second principal surface.

Abstract: In a radio frequency module, the first inductor is disposed on the first principal surface of the mounting board and located on the first reception path through which a first reception signal of a first frequency passes, on an input side of the first low noise amplifier. The second inductor is disposed on the first principal surface of the mounting board and located on the second reception path through which a second reception signal of a second frequency lower than the first frequency passes, on an input side of the second low noise amplifier. The radio frequency component is disposed between the first inductor and the second inductor. A distance between the first inductor and the shielding layer is greater than a distance between the second inductor and the shielding layer. The first inductor overlaps the first low noise amplifier in a thickness direction of the mounting board.

Abstract: A radio frequency module includes: a module board including a first principal surface and a second principal surface on opposite sides of the module board; an antenna connection terminal; a filter that is on the first principal surface and connected to the antenna connection terminal, wherein the filter includes one or more inductors and one or more capacitors, and is configured to allow a transmission signal and a reception signal to pass through; and a reception low noise amplifier on the second principal surface and configured to amplify the reception signal.

Abstract: A radio frequency module includes: a module substrate that includes a principal surface on which external-connection terminals are disposed; a power amplifier that is disposed on the principal surface of the module substrate and amplifies a radio frequency transmission signal; and a heat dissipator that dissipates heat of the power amplifier. The heat dissipator includes: a heat dissipation plate that covers a surface of the power amplifier which is opposite to a surface that faces the module substrate; and at least a first leg that extends from the heat dissipation portion toward the principal surface of the module substrate.

Abstract: A radio frequency module includes a module board including a first principal surface and a second principal surface on opposite sides thereof; a transmission power amplifier; a control circuit configured to control the transmission power amplifier; a first transmission filter and a second transmission filter; and a first switch configured to switch connection of an output terminal of the transmission power amplifier between the first transmission filter and the second transmission filter. The control circuit is disposed on the first principal surface, and the first switch is disposed on the second principal surface.

Abstract: A radio frequency module includes: a switch that includes: a common terminal connected to a first common transmission path; a first selection terminal connected to a first transmission path; and a second selection terminal connected to a second transmission path, and switches between connecting the common terminal to the first selection terminal and to the second selection terminal; a transmission power amplifier disposed on the module board and on first common transmission path; and first circuit components disposed on a reception path. The first transmission path is a path through which a transmission signal of a first communication band is transferred, the second transmission path is a path through which a transmission signal of a second communication band is transferred, the switch is disposed on a first principal surface, and at least one of the first circuit components is disposed on a second principal surface.

Abstract: A radio frequency module includes a module board including a first principal surface and a second principal surface on opposite sides thereof; a transmission power amplifier; a control circuit configured to control the transmission power amplifier; a first transmission filter and a second transmission filter; and a first switch configured to switch connection of an output terminal of the transmission power amplifier between the first transmission filter and the second transmission filter. The control circuit is disposed on the first principal surface, and the first switch is disposed on the second principal surface.

Abstract: A radio frequency module includes a module board including a first principal surface and a second principal surface on opposite sides of the module board, a transmission power amplifier connected to a transmission path, a first circuit component connected to a reception path, and a control circuit that controls the transmission power amplifier. The control circuit is disposed on the first principal surface, and the first circuit component is disposed on the second principal surface.

Abstract: A radio frequency module includes: a module board including a first principal surface and a second principal surface on opposite sides of the module board; an antenna connection terminal; a diplexer connected to the antenna connection terminal and including at least a first inductor which is a chip inductor; a transmission power amplifier; and a first circuit component disposed on a transmission path connecting the diplexer and the transmission power amplifier. The first inductor is disposed on the first principal surface, and one of the transmission power amplifier and the first circuit component is disposed on the second principal surface.

Abstract: A radio frequency module includes: a module board including a first principal surface and a second principal surface on opposite sides of the module board; a transmission power amplifier configured to amplify a transmission signal; a first switch; and a first inductor included in a matching circuit connected between an output terminal of the transmission power amplifier and the first switch. The first inductor is disposed on the first principal surface, and the first switch is disposed on the second principal surface.

Abstract: A radio frequency module includes a module board including a first principal surface and a second principal surface on opposite sides thereof, a transmission power amplifier, a control circuit that controls the transmission power amplifier, and a first inductor connected to an output terminal of the transmission power amplifier. The control circuit is disposed on the first principal surface, and the first inductor is disposed on the second principal surface.

Abstract: A high-frequency module includes a high-frequency switch, filters (21 to 23), (31 to 33), and connection circuits (41 to 46). The high-frequency switch has filter-side terminals (Ps1 to Ps 6). The filters (21, 22, 23) each include a plurality of filters having characteristics different from each other. The filters (31, 32, 33) each include one type of filter. The connection circuits (41, 42, 43) connect the terminals (Ps1, Ps2, Ps3) of the high-frequency switch to the common terminals (Pc21, Pc22, Pc23) of the filters (21, 22, 23), respectively. The connection circuits (44, 45, 46) connect the terminals (Ps4, Ps5, Ps6) of the high-frequency switch to the filters (31, 32, 33), respectively. The connection circuits (41, 42, 43) are shorter than the connection circuits (44, 45, 46).