Abstract: A radio-frequency module includes a transmission path which has one end connected to a transmission terminal and on which a transmission signal in Band A is transmitted; a reception path (62) which has one end connected to a reception terminal (120B) and on which a reception signal in Band B is transmitted; a reception path (63) which has one end connected to a reception terminal (120C) and on which a reception signal in Band C is transmitted; a switch (11) having a common terminal (11a) and selection terminals (11b and 11c); and a switch (12) having a common terminal (12a) and selection terminals (12b and 12c).

Abstract: A high-frequency module includes a high-frequency switch, filters (21 to 23), (31 to 33), and connection circuits (41 to 46). The high-frequency switch has filter-side terminals (Ps1 to Ps 6). The filters (21, 22, 23) each include a plurality of filters having characteristics different from each other. The filters (31, 32, 33) each include one type of filter. The connection circuits (41, 42, 43) connect the terminals (Ps1, Ps2, Ps3) of the high-frequency switch to the common terminals (Pc21, Pc22, Pc23) of the filters (21, 22, 23), respectively. The connection circuits (44, 45, 46) connect the terminals (Ps4, Ps5, Ps6) of the high-frequency switch to the filters (31, 32, 33), respectively. The connection circuits (41, 42, 43) are shorter than the connection circuits (44, 45, 46).

Abstract: A radio frequency module includes a module board including a first principal surface and a second principal surface on opposite sides thereof; a transmission power amplifier; a control circuit configured to control the transmission power amplifier; a first transmission filter and a second transmission filter; and a first switch configured to switch connection of an output terminal of the transmission power amplifier between the first transmission filter and the second transmission filter. The control circuit is disposed on the first principal surface, and the first switch is disposed on the second principal surface.

Abstract: In a radio frequency module, the first inductor is disposed on the first principal surface of the mounting board and located on the first reception path through which a first reception signal of a first frequency passes, on an input side of the first low noise amplifier. The second inductor is disposed on the first principal surface of the mounting board and located on the second reception path through which a second reception signal of a second frequency lower than the first frequency passes, on an input side of the second low noise amplifier. The radio frequency component is disposed between the first inductor and the second inductor. A distance between the first inductor and the shielding layer is greater than a distance between the second inductor and the shielding layer. The first inductor overlaps the first low noise amplifier in a thickness direction of the mounting board.

Abstract: A radio frequency module includes a module substrate having main surfaces facing each other and enabling radio frequency components to be mounted on both main surfaces, a power amplifier configured to amplify transmission signals in a cellular band, and a low noise amplifier configured to amplify GPS reception signals. The power amplifier and the low noise amplifier are mounted on the same module substrate.

Abstract: A radio frequency module includes: a switch that includes: a common terminal connected to a first common transmission path; a first selection terminal connected to a first transmission path; and a second selection terminal connected to a second transmission path, and switches between connecting the common terminal to the first selection terminal and to the second selection terminal; a transmission power amplifier disposed on the module board and on first common transmission path; and first circuit components disposed on a reception path. The first transmission path is a path through which a transmission signal of a first communication band is transferred, the second transmission path is a path through which a transmission signal of a second communication band is transferred, the switch is disposed on a first principal surface, and at least one of the first circuit components is disposed on a second principal surface.

Abstract: A radio frequency module includes a module board including a first principal surface and a second principal surface on opposite sides of the module board, a transmission power amplifier connected to a transmission path, a first circuit component connected to a reception path, and a control circuit that controls the transmission power amplifier. The control circuit is disposed on the first principal surface, and the first circuit component is disposed on the second principal surface.

Abstract: A radio frequency module includes: a module board including a first principal surface and a second principal surface on opposite sides of the module board; an antenna connection terminal; a diplexer connected to the antenna connection terminal and including at least a first inductor which is a chip inductor; a transmission power amplifier; and a first circuit component disposed on a transmission path connecting the diplexer and the transmission power amplifier. The first inductor is disposed on the first principal surface, and one of the transmission power amplifier and the first circuit component is disposed on the second principal surface.

Abstract: A radio-frequency module (1) includes a module substrate (70) having major surfaces (701 and 702) opposite to each other, external connection terminals (90a and 90b) disposed on the major surface (702), a power amplifier (11) having major surfaces (111 and 112) opposite to each other and being disposed on the major surface (702) such that the major surface (111) is a mounting surface on the module substrate (70), a bonding wire (45) coupled to the major surface (112), and a heat dissipation electrode (91) disposed apart from the power amplifier (11) on the major surface (112) side with respect to the power amplifier (11) and coupled to the bonding wire (45).

Abstract: A semiconductor devices comprises a first member including a first circuit partially formed by an elemental semiconductor element at a surface layer, a first conductive raised portion at the first member, and a second member smaller than the first member in plan view joined to the first member. The second member includes a second circuit partially formed by a compound semiconductor element. A second conductive raised portion is at the second member. A power amplifier includes a first-stage amplifier circuit included in the first or second circuit and a second-stage amplifier circuit included in the second circuit. The first circuit includes a first switch for inputting to the first-stage amplifier circuit a radio-frequency signal inputted to a selected contact, a control circuit to control the first- and second-stage amplifier circuits, and a second switch for outputting from a selected contact a radio-frequency signal outputted by the second-stage amplifier circuit.

Abstract: In a semiconductor module, a first conductive portion is raised on a lower surface of a first member to which a second member including a semiconductor element and being smaller than the first member in plan view is joined. A second conductive portion is raised at the second member in the same direction as the first conductive portion. The first and second members are mounted on a module substrate with the interposed first and second conductive portions. A sealing material is disposed on a mounting surface of the module substrate, while covering at least an area of the first member. The sealing material has a top surface facing in the same direction as the top surface of the first member and side surfaces connected to its top surface. A metal film is disposed on the top and side surfaces of the sealing material and side surfaces of the module substrate.

Abstract: A radio frequency module includes a module board including a first principal surface and a second principal surface on opposite sides thereof, a transmission power amplifier, a control circuit that controls the transmission power amplifier, and a first inductor connected to an output terminal of the transmission power amplifier. The control circuit is disposed on the first principal surface, and the first inductor is disposed on the second principal surface.

Abstract: A radio-frequency module includes a mounting substrate, a first power amplifier, a second power amplifier, a circuit component (IC chip), and an external connection terminal. The mounting substrate has a first main surface and a second main surface on opposite sides of the mounting substrate. The first power amplifier is mounted on the first main surface of the mounting substrate. The second power amplifier is mounted on the first main surface of the mounting substrate. The circuit component is mounted on the second main surface of the mounting substrate. The external connection terminal is disposed on the second main surface of the mounting substrate. The external connection terminal is connected to a power supply that supplies a power supply voltage to the first power amplifier and the second power amplifier.

Abstract: A radio-frequency module includes a first power amplifier, a second power amplifier, a switch, a plurality of first filters, and a second filter. The first power amplifier amplifies a transmission signal of a first frequency band and outputs the amplified transmission signal. The second power amplifier amplifies a transmission signal of a second frequency band and outputs the amplified transmission signal. The pass bands of the plurality of first filters are contained within the first frequency band. The pass band of the second filter is contained within the second frequency band. The second power amplifier has a greater output power level than the first power amplifier. The first output terminal of the first power amplifier is switchably connectable to the plurality of first filters via the switch. The second output terminal of the second power amplifier is connected to the second filter without the switch interposed therebetween.

Abstract: A radio-frequency module includes a mounting substrate and first and second power amplifiers. The first and second power amplifiers are each mounted on one main surface of the mounting substrate. The first power amplifier includes a first input terminal and a first outer periphery. The first outer periphery includes a first edge section. The second power amplifier includes a second input terminal and a second outer periphery. The second outer periphery includes a second edge section. The second edge section opposes the first edge section in a first direction. The first input terminal is disposed in the first edge section of the first power amplifier. The second input terminal is disposed in the second edge section of the second power amplifier. The first and second input terminals do not overlap each other in the first direction.

Abstract: A radio-frequency module includes a mounting substrate having a first main surface; a first power amplifier that is mounted on the first main surface and that amplifies a first transmission signal in a first frequency band; a second power amplifier that is mounted on the first main surface and that amplifies a second transmission signal in a second frequency band different from the first frequency band; a first output matching circuit that is mounted on the first main surface and that receives the first transmission signal amplified by the first power amplifier; and a second output matching circuit that is mounted on the first main surface and that receives the second transmission signal amplified by the second power amplifier. The first output matching circuit and the second output matching circuit are mounted along a second direction intersecting with the first direction.

Abstract: A radio-frequency module includes a mounting board having first and second major surfaces opposite to each other and a duplexer including a transmit filter coupled to a node and a receive filter coupled to the node. The transmit filter is mounted on the first major surface, and the receive filter is mounted on the second major surface. When the mounting board is viewed in a plan view, a footprint of the transmit filter at least partially overlaps a footprint of the receive filter.

Abstract: A radio-frequency module includes a mounting substrate including a ground electrode layer formed by a planar wiring pattern; multiple ground terminals, which are multiple external connection terminals that are arranged on a first main surface of the mounting substrate and that are set to ground potential; and a first radio-frequency component (for example, a reception filter and/or a low noise amplifier) mounted on the first main surface. The multiple ground terminals are arranged at an outer periphery side of the first main surface with respect to the first radio-frequency component and are connected to the ground electrode layer. In a plan view of the mounting substrate, at least part of the first radio-frequency component is overlapped with the ground electrode layer.

Abstract: A radio frequency module and a communication device capable of reducing a mounting substrate size. The radio frequency module includes a mounting substrate, a first filter, and a second filter. The mounting substrate has a first main surface and a second main surface that are on opposite sides of the mounting substrate. The first filter is provided on the first main surface and allows a first receiving signal in a first frequency band to pass through. The second filter is stacked on the first filter and allows a second receiving signal in a second frequency band different from the first frequency band to pass through.

Abstract: A radio frequency module includes: a module board including first and second principal surfaces; first and second power amplifiers on the first principal surface; external-connection terminals on the second principal surface; and first and second via conductors connecting the first and second principal surfaces. The first and second via conductors are spaced apart in the module board, one end of the first via conductor is connected to a first ground electrode of the first power amplifier, the other end of the first via conductor is connected to a first external-connection terminal, one end of the second via conductor is connected to a second ground electrode of the second power amplifier, the other end of the second via conductor is connected to a second external-connection terminal, and the first and second via conductors each penetrate through the module board in a direction normal to the first and second principal surfaces.