Patents by Inventor Yun Chi

Yun Chi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250246558
    Abstract: Semiconductor-on-insulator (SOI) structures with variable resistivity epitaxial semiconductor layers and methods of making the same are disclosed. The SOI structures may include customized resistivity profiles without changing the epitaxial structure of vendor-supplied base materials or requiring the development of new etching chemistries. An SOI structure may be formed by forming a second epitaxial semiconductor layer over a first epitaxial semiconductor layer on a first substrate, where the resistivity of the second epitaxial semiconductor layer is different than the resistivity of the first epitaxial semiconductor layer, forming a dielectric capping layer over the second epitaxial semiconductor layer, bonding the dielectric capping layer to a second dielectric capping layer on a second substrate, and removing the first substrate to provide the SOI structure. An optional third epitaxial semiconductor layer may be formed over the first epitaxial semiconductor layer.
    Type: Application
    Filed: January 29, 2024
    Publication date: July 31, 2025
    Inventors: Yun-Chi Wu, Po-Wei Liu, Ping-Cheng Li, Yu-Hung Cheng, Yung-Lung Lin
  • Publication number: 20250229655
    Abstract: A power management system and a power management method for wireless power supply are provided. The power management system includes a first electric auxiliary vehicle, a second electric auxiliary vehicle, a management device and a wireless charging platform. When the first electric auxiliary vehicle is located within a wireless charging range of the wireless charging platform, the wireless charging platform generates a password and provides the password and a user identification code of the first electric auxiliary vehicle to the management device. The first electric auxiliary vehicle communicates with the management device according to the user identification code to receive the password from the management device and displays the password, and activates a wireless power supply function according to a verification operation of the password and the user identification code, thereby providing power to the second electric auxiliary vehicle by a wireless power supply manner.
    Type: Application
    Filed: December 12, 2024
    Publication date: July 17, 2025
    Applicant: APh ePower Co., Ltd.
    Inventors: Hsiu-Hsien Su, Yun-Chi Tzeng, Kuan-Chieh Huang
  • Publication number: 20250226701
    Abstract: A wireless charging system and an operating method for the wireless charging system are provided. The wireless charging system includes a power supply device, a first transmission coil, a second transmission coil, an electric auxiliary vehicle, and a processing device. The power supply device provides a power source. The first transmission coil transmits a first wireless electric energy to a first parking position and a second parking position in a wireless transmission manner according to the power source. The electric auxiliary vehicle includes a vehicle coil circuit. The processing device guides the electric auxiliary vehicle to stop at the second parking position. The processing device uses the vehicle coil circuit to transmit a coupled electric energy to the second transmission coil, so that the second transmission coil uses the coupled electric energy to transmit a second wireless electric energy to the third parking position in the wireless transmission manner.
    Type: Application
    Filed: December 17, 2024
    Publication date: July 10, 2025
    Applicant: APh ePower Co., Ltd.
    Inventors: Hsiu-Hsien Su, Yun-Chi Tzeng, Tsung-Shiun Lee
  • Publication number: 20250217569
    Abstract: A method of extracting parasitic parameters of a 3D IC, including steps of merging respective layouts of multiple dies and backside layout of a 3D IC into a common layout, establishing a common LVS file and a common LPE file for those dies and backside layout based on the common layout, establishing respective LVS files and respective LPE files for every die based on the respective layouts, creating a common netlist from the common LVS file and common LPE file, creating corresponding respective netlists from the respective LVS files and respective LPE files, merging the common netlist and respective netlists into a netlist, and extracting common parasitic parameters of the dies from the netlist.
    Type: Application
    Filed: January 29, 2024
    Publication date: July 3, 2025
    Applicant: UNITED MICROELECTRONICS CORP
    Inventors: Chih-Yueh Lin, Chun-Yi Lin, Yun-Chi Chiu, Shang-Yu Liu, Yi-Chien Lai, Hsin-Yao Wang, Tsan-Tang Chen, Yen-Hsueh Huang
  • Publication number: 20250204021
    Abstract: A semiconductor structure can include a high voltage region, a first moat trench isolation structure electrically insulating the high voltage region from low voltage regions of the semiconductor structure, and a second moat trench isolation structure electrically insulating the high voltage region from the low voltage regions of the semiconductor structure. The first moat trench isolation structure can include dielectric sidewall spacers and a conductive fill material portion located between the dielectric sidewall spacers. The second moat trench isolation structure can include only at least one dielectric material, and can include a dielectric moat trench fill structure having a same material composition as the dielectric sidewall spacers and having a lateral thickness that is greater than a lateral thickness of the dielectric sidewall spacers and is less than twice the lateral thickness of the dielectric sidewall spacers.
    Type: Application
    Filed: March 3, 2025
    Publication date: June 19, 2025
    Inventors: Hung-Ling Shih, Tsung-Yu Yang, Yun-Chi Wu, Po-Wei Liu
  • Publication number: 20250187456
    Abstract: Disclosed is a power management system for a wireless power supply. The power management system includes multiple control devices, a wireless charging platform, and a remote monitoring device. The control devices are respectively disposed on one of multiple electric auxiliary vehicles. The wireless charging platform wirelessly charges at least one of the electric auxiliary vehicles. The remote monitoring device wirelessly communicates with the wireless charging platform to control a power supply behavior of the wireless charging platform. A first control device among the control devices is disposed on a first electric auxiliary vehicle among the electric auxiliary vehicles. The wireless charging platform wirelessly powers the first electric auxiliary vehicle in response to a first command. The wireless charging platform wirelessly powers at least one of the other electric auxiliary vehicles by using a battery power of the first electric auxiliary vehicle in response to a second command.
    Type: Application
    Filed: July 9, 2024
    Publication date: June 12, 2025
    Applicant: APh ePower Co., Ltd.
    Inventors: Hsiu-Hsien Su, Yun-Chi Tzeng, Kuan-Chieh Huang
  • Publication number: 20250192592
    Abstract: Disclosed is a power management circuit for an electric auxiliary vehicle. The electric auxiliary vehicle includes a battery, a motor, and a power receiving terminal. The power management circuit includes a transformer, a primary circuit, first and second power transmission circuits, and a controller. The transformer includes primary and secondary windings. The primary circuit is connected to the primary winding and the power receiving terminal. The first power transmission circuit is connected to the secondary winding and the battery. The second power transmission circuit is connected to the secondary winding, battery, and motor. The controller controls the primary circuit and the first power transmission circuit to provide battery power of the battery to the power receiving terminal in a first operating mode. The controller controls the second power transmission circuit in a second operating mode, so that the second power transmission circuit uses power of motor to charge the battery.
    Type: Application
    Filed: June 28, 2024
    Publication date: June 12, 2025
    Applicant: APh ePower Co., Ltd.
    Inventors: Hsiu-Hsien Su, Yun-Chi Tzeng, Te-Chun Hung
  • Publication number: 20250187459
    Abstract: Disclosed are a wireless power supply system and an operating method for a wireless power supply system. The wireless power supply system includes a charging device and a plurality of electric auxiliary vehicles. The charging device includes a device converter and a device induction coil. A first electric auxiliary vehicle among the electric auxiliary vehicles provides a wireless vehicle power to the device induction coil in a first operating mode. The charging device provides the wireless vehicle power to at least one electric auxiliary vehicle other than the first electric auxiliary vehicle in the first operating mode.
    Type: Application
    Filed: July 4, 2024
    Publication date: June 12, 2025
    Applicant: APh ePower Co., Ltd.
    Inventors: Hsiu-Hsien Su, Yun-Chi Tzeng, Tsung-Shiun Lee
  • Publication number: 20250183137
    Abstract: A semiconductor structure may include a wire-bond pad including a first electrically conducting surface, a flip-chip bump including a second electrically conducting surface, a polymer layer formed over a surface of the semiconductor structure, wherein the first electrically conducting surface of the wire-bond pad is located under a first opening in the polymer layer, and wherein the flip-chip bump extends through a second opening in the polymer layer.
    Type: Application
    Filed: December 1, 2023
    Publication date: June 5, 2025
    Inventors: Yun-Chi Wu, Cheng-Bo Shu, Po-Wei Liu
  • Patent number: 12317584
    Abstract: A method includes: etching a trench on a surface of a substrate; filling the trench with a dielectric material to form a first isolation region; depositing a patterned mask layer on the substrate, the patterned mask layer comprising an opening exposing the substrate; implanting oxygen into the substrate through the opening to form an implant region; generating a second isolation region from the implant region; and forming a transistor on the substrate. The transistor includes a channel laterally surrounding the second isolation region.
    Type: Grant
    Filed: May 26, 2022
    Date of Patent: May 27, 2025
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Yuan-Cheng Yang, Yun-Chi Wu, Tsu-Hsiu Perng, Shih-Jung Tu, Cheng-Bo Shu, Chia-Chen Chang
  • Publication number: 20250113499
    Abstract: A semiconductor device including a substrate, a magnetic core and a conductor coil is provided. The magnetic core is disposed on the substrate, and formed by sub-layers of different materials stacked alternatively on one another. The conductor coil is disposed on the substrate, wherein the magnetic core partially extends to a level between an upper surface of the conductor coil and a bottom surface of the conductor coil.
    Type: Application
    Filed: October 3, 2023
    Publication date: April 3, 2025
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yun-Chi Chiang, Meng-Pei Lu, Shin-Yi Yang, Cian-Yu Chen, Chien-Hsin Ho, Ming-Han Lee, Shau-Lin Shue
  • Patent number: 12266577
    Abstract: A semiconductor structure can include a high voltage region, a first moat trench isolation structure electrically insulating the high voltage region from low voltage regions of the semiconductor structure, and a second moat trench isolation structure electrically insulating the high voltage region from the low voltage regions of the semiconductor structure. The first moat trench isolation structure can include dielectric sidewall spacers and a conductive fill material portion located between the dielectric sidewall spacers. The second moat trench isolation structure can include only at least one dielectric material, and can include a dielectric moat trench fill structure having a same material composition as the dielectric sidewall spacers and having a lateral thickness that is greater than a lateral thickness of the dielectric sidewall spacers and is less than twice the lateral thickness of the dielectric sidewall spacers.
    Type: Grant
    Filed: August 10, 2022
    Date of Patent: April 1, 2025
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Hung-Ling Shih, Tsung-Yu Yang, Yun-Chi Wu, Po-Wei Liu
  • Publication number: 20250105099
    Abstract: A semiconductor arrangement includes a first dielectric feature passing through a semiconductive layer and a first dielectric layer over a substrate. The semiconductor arrangement includes a conductive feature passing through the semiconductive layer and the first dielectric layer and electrically coupled to the substrate. The conductive feature is adjacent the first dielectric feature and electrically isolated from the semiconductive layer by the first dielectric feature.
    Type: Application
    Filed: December 9, 2024
    Publication date: March 27, 2025
    Inventors: Josh LIN, Chung-Jen HUANG, Yun-Chi WU, Tsung-Yu YANG
  • Patent number: 12252640
    Abstract: This invention relates to an iridium metal complex. The iridium metal complex comprises no more than three 1,3-dihydro-2H-benzo[d]imidazol-2-ylidene based carbene cyclometalate ligands. The iridium metal complex provides a blue emission. This is useful for organic light emitting diode (OLED) components where blue emitters have trailed behind the advances 5 of red and green emitters.
    Type: Grant
    Filed: September 2, 2021
    Date of Patent: March 18, 2025
    Assignee: CITY UNIVERSITY OF HONG KONG
    Inventors: Yun Chi, Yi Yuan, Caifa You
  • Publication number: 20250079313
    Abstract: A semiconductor structure including a first dielectric layer and a conductive pattern is provided. The conductive pattern is disposed in the first dielectric layer, wherein the conductive pattern comprises an alloy layer and a first conductive layer, the alloy layer surrounds sidewalls and a bottom surface of the first conductive layer, a material of the alloy layer comprises an alloy of at least two metals, and at least one of the at least two metals relative to the rest of the at least two metals tends to be reacted with a dielectric material of the first dielectric layer.
    Type: Application
    Filed: September 4, 2023
    Publication date: March 6, 2025
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Cian-Yu Chen, Chin-Lung Chung, Yun-Chi Chiang, Han-Tang Hung, Meng-Pei Lu, Shin-Yi Yang, Ming-Han Lee, Ching-Fu Yeh
  • Publication number: 20250056835
    Abstract: An integrated circuit structure includes a semiconductor substrate, first and second source/drain features, a gate dielectric layer, a gate electrode, a field plate electrode, first and second metal silicide layers, a dielectric layer, and a spacer. The gate electrode and the field plate electrode are over the gate dielectric layer and respectively vertically overlapping a well region and a drift region in the semiconductor substrate. A first sidewall of the field plate electrode faces the gate electrode. The first and second metal silicide layers are over the gate electrode and the field plate electrode, respectively. The dielectric layer has a first portion between the gate electrode and the first sidewall of the field plate electrode and a second portion below a bottom surface of the field plate electrode. The spacer is alongside a second sidewall of the field plate electrode and over the second portion of the dielectric layer.
    Type: Application
    Filed: October 31, 2024
    Publication date: February 13, 2025
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Cheng-Bo SHU, Yun-Chi WU
  • Publication number: 20250010728
    Abstract: A motor driving device includes a battery module and a conversion circuit. The conversion circuit drives a motor in a driving mode and charges the battery module in a charging mode. The conversion circuit includes a determination circuit, a controller, and a first phase upper arm switch circuit. The first phase upper arm switch circuit includes a power switch and a transistor. First terminals, second terminal, and control terminals of both the power switch and the transistor are respectively coupled to a positive power supply terminal of the battery module, a first phase node, and the controller. In the charging mode, when a first phase voltage value located at the first phase node is greater than a battery voltage value located at the positive power supply terminal, the determination circuit notifies the controller to turn on the transistor.
    Type: Application
    Filed: April 15, 2024
    Publication date: January 9, 2025
    Applicant: APh ePower Co., Ltd.
    Inventors: Jyh-Wei Chen, Hsiu-Hsien Su, Yun-Chi Tzeng
  • Patent number: 12166121
    Abstract: An integrated circuit structure includes a semiconductor substrate, a first source/drain feature, a second source/drain feature, a gate dielectric layer, a gate electrode, a field plate electrode, and a dielectric layer. The semiconductor substrate has a well region and a drift region therein. The first source/drain feature is in the well region. The second source/drain feature is in the semiconductor substrate. The drift region is between the well region and the second source/drain feature. The gate dielectric layer is over the well region and the drift region. The gate electrode is over the gate dielectric layer and vertically overlapping the well region. The field plate electrode is over the gate dielectric layer and vertically overlapping the drift region. The dielectric layer is between the gate electrode and the field plate electrode. A top surface of the gate electrode is free of the dielectric layer.
    Type: Grant
    Filed: May 4, 2023
    Date of Patent: December 10, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Cheng-Bo Shu, Yun-Chi Wu
  • Patent number: 12165955
    Abstract: A semiconductor arrangement includes a first dielectric feature passing through a semiconductive layer and a first dielectric layer over a substrate. The semiconductor arrangement includes a conductive feature passing through the semiconductive layer and the first dielectric layer and electrically coupled to the substrate. The conductive feature is adjacent the first dielectric feature and electrically isolated from the semiconductive layer by the first dielectric feature.
    Type: Grant
    Filed: November 22, 2023
    Date of Patent: December 10, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Josh Lin, Chung-Jen Huang, Yun-Chi Wu, Tsung-Yu Yang
  • Publication number: 20240380219
    Abstract: A wireless charging system is provided. The wireless charging system includes a wireless power supply platform, a first device, and a second device. The wireless power supply platform provides a wireless suppling power. The first device includes a first power receiving circuit, a first power switch, and a first control circuit. The second device includes a second power receiving circuit, a second power switch, and a second control circuit. The second control circuit communicates with the first control circuit to determine a coordinated switching state of the first power switch and the second power switch. The coordinated switching state determines a first output voltage value generated by the first power receiving circuit according to the wireless suppling power and a second output voltage value generated by the second power receiving circuit according to the wireless suppling power.
    Type: Application
    Filed: April 15, 2024
    Publication date: November 14, 2024
    Applicant: APh ePower Co., Ltd.
    Inventors: Hsiu-Hsien Su, Tsung-Shiun Lee, Yun-Chi Tzeng