Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes at least one semiconductor die, an interposer, a molding compound and connectors. The interposer has a first surface, a second surface opposite to the first surface and sidewalls connecting the first and second surfaces. The at least one semiconductor die is disposed on the first surface of interposer and electrically connected with the interposer. The molding compound is disposed over the interposer and laterally encapsulates the at least one semiconductor die. The molding compound laterally wraps around the interposer and the molding compound at least physically contacts a portion of the sidewalls of the interposer. The connectors are disposed on the second surface of the interposer, and are electrically connected with the at least one semiconductor die through the interposer.

Abstract: The present invention provides a smart wearable device, which is held on an upper body of a wearer by a plurality of contact pad sets, and has a connection unit, a first sensing module, a second sensing module, and an extension unit.

Abstract: A semiconductor structure includes a first interposer; a second interposer laterally adjacent to the first interposer, where the second interposer is spaced apart from the first interposer; and a first die attached to a first side of the first interposer and attached to a first side of the second interposer, where the first side of the first interposer and the first side of the second interposer face the first die.

Abstract: A staining kit is provided, including a first pattern including antibodies against T cell, B cell, NK cell, monocyte, regulatory cell, CD8, CD45, and CTLA4; a second pattern including antibodies against T cell, B cell, NK cell, monocyte, regulatory cell, dendritic cell, and CD45; a third pattern including antibodies against T cell, B cell, NK cell, monocyte, CD8, CD45, CD45RA, CD62L, CD197, CX3CR1 and TCR??; and a fourth pattern including antibodies against B cell, CD23, CD38, CD40, CD45 and IgM, wherein the antibodies of each pattern are labeled with fluorescent dyes. A method of identifying characterized immune cell subsets of a disease and a method of predicting the likelihood of NPC in a subject in the need thereof using the staining kit are also provided.

Abstract: An electronic modulating device is provided, which includes a first substrate, an electrode, and an insulating layer. The electrode is disposed on the first substrate, wherein the electrode comprises an opening defining a top edge and a bottom edge of the electrode, and the opening has a central portion. The insulating layer is disposed on the electrode and within the opening. Wherein a thickness of the insulating layer at the bottom edge is greater than a thickness of the insulating layer at the central portion, and the electrode has a first inner side and at least a portion of the first inner side is uneven.

Abstract: An integrated chip including a gate layer. An insulator layer is over the gate layer. A channel structure is over the insulator layer. A pair of source/drains are over the channel structure and laterally spaced apart by a dielectric layer. The channel structure includes a first channel layer between the insulator layer and the pair of source/drains, a second channel layer between the insulator layer and the dielectric layer, and a third channel layer between the second channel layer and the dielectric layer. The first channel layer, the second channel layer, and the third channel layer include different semiconductors.

Abstract: A video decoding method includes: before residual decoding of a coding unit is completed, referring to available information to determine whether to decode information that an inverse transform (IT) circuit needs for applying inverse transform to transform blocks of the coding unit, and generating a determination result; and controlling coefficient transmission of the coding unit to the IT circuit according to the determination result.

Abstract: A control device for an unmanned aerial vehicle (UAV) and a control method therefor are provided. The control device includes a sensing device, an image receiver, a control transmitter, a display, and a processor. The sensing device is used to sense an action of the user. The image receiver is used to receive an image including at least a part or all of the body in the UAV from a first image capturing device of the UAV. The processor uses the display to continuously present the image. The processor obtains the action by the sensing device, converts the action into the control signal corresponding to the UAV, and transmits the control signal to the UAV through the control transmitter. The UAV is controlled by the control signal transmitted by the control device.

Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes at least one semiconductor die, an interposer, a molding compound and connectors. The interposer has a first surface, a second surface opposite to the first surface and sidewalls connecting the first and second surfaces. The at least one semiconductor die is disposed on the first surface of interposer and electrically connected with the interposer. The molding compound is disposed over the interposer and laterally encapsulates the at least one semiconductor die. The molding compound laterally wraps around the interposer and the molding compound at least physically contacts a portion of the sidewalls of the interposer. The connectors are disposed on the second surface of the interposer, and are electrically connected with the at least one semiconductor die through the interposer.

Abstract: An electronic device includes a substrate, plurality of electrodes disposed on the substrate, a plurality of metal elements disposed on the substrate, a plurality of first lines disposed on the substrate, and a radio frequency signal processor. One of the plurality of metal elements is overlapped one of the plurality of electrodes. The radio frequency signal processor provides a signal to the one of the plurality of electrodes through one of the plurality of first lines.

Abstract: A laser-debondable composition includes an acrylic resin, a light-shielding material, an additive, and a solvent. Wherein, the acrylic resin includes at least one nitrogen-containing organic group selected from a group consisting of tertiary amino groups and secondary amino groups, an organic group having a cyclic ether group, and an organic group having a hydroxyl group, and the additive includes at least one adhesion promoter. The laser-debondable composition has excellent adhesion ability to a substrate, attachability, and solvent resistance.

Abstract: An electronic device is provided. The electronic device includes a substrate, a feeding line, and a phase shifter electrode. The feeding line is disposed on the substrate and has a signal transmitting end. The phase shifter electrode is disposed on the substrate and has a signal receiving end. The signal transmitting end of the feeding line and the signal receiving end of the phase shifter electrode are a first distance apart. The first distance between the signal transmitting end of the feeding line and the signal receiving end of the phase shifter electrode is in a range from 0.05 mm to 5 mm.

Abstract: An electronic modulating device is provided, which includes a first substrate, an electrode, and an insulating layer. The electrode is disposed on the first substrate, wherein the electrode comprises an opening defining a top edge and a bottom edge of the electrode, and the opening has a central portion. The insulating layer is disposed on the electrode and within the opening. Wherein a thickness of the insulating layer at the bottom edge is greater than a thickness of the insulating layer at the central portion, and the electrode has a first inner side and at least a portion of the first inner side is uneven.

Abstract: An electronic device is provided. The electronic device includes a substrate, a feeding line and an electrode. The feeding line is disposed on the substrate for transmitting a signal. The electrode is disposed on the substrate for receiving the signal. In addition, an end portion of the feeding line is disposed opposite to an end portion of the electrode.

Abstract: An electronic device is provided. The electronic device includes a first electronic device unit. The first electronic device unit includes a first substrate and a second substrate disposed opposite to the first substrate. The first substrate includes a protruding part which protrudes outward a boundary of the second substrate along a protruding direction perpendicular to a normal direction of the first substrate. The protruding part includes a first side surface having a portion that has been grinded and a portion that has been ungrinded, and a surface roughness of the portion that has been grinded is different from a surface roughness of the portion that has been ungrinded.

Abstract: A control device for an unmanned aerial vehicle (UAV) and a control method therefor are provided. The control device includes a sensing device, an image receiver, a control transmitter, a display, and a processor. The sensing device is used to sense an action of the user. The image receiver is used to receive an image including at least a part or all of the body in the UAV from a first image capturing device of the UAV. The processor uses the display to continuously present the image. The processor obtains the action by the sensing device, converts the action into the control signal corresponding to the UAV, and transmits the control signal to the UAV through the control transmitter. The UAV is controlled by the control signal transmitted by the control device.

Abstract: An electronic modulating device is provided, which includes a first substrate, a second substrate disposed opposing to the first substrate, and a modulating material disposed between the first substrate and the second substrate. The electronic modulating device includes a buffer layer disposed on the first substrate, and a first electrode disposed on the buffer layer. The buffer layer includes a first opening defining a first top edge and a first bottom edge of the buffer layer. The first electrode includes a second opening defining a second top edge and a second bottom edge of the first electrode. The electronic modulating device includes an organic insulating layer disposed on the first electrode and within the first opening and the second opening. The thickness of the organic insulating layer at the second bottom edge is greater than the thickness of the organic insulating layer at the first top edge.

Abstract: An electronic device is provided. The electronic device includes a first electronic device unit and a second electronic device unit. The first electronic device unit includes a first substrate and a second substrate disposed opposite to the first substrate, and a portion of the first substrate protrudes outward a boundary of the second substrate in a first protruding direction perpendicular to a normal direction of the first substrate. The second electronic device unit is connected to the first electronic device unit and includes a third substrate and a fourth substrate disposed opposite to the third substrate, and a portion of the fourth substrate protrudes outward a boundary of the third substrate in a second protruding direction perpendicular to a normal direction of the third substrate. In addition, the portion of the first substrate and the portion of the fourth substrate each includes a grinded portion.

Abstract: An electronic device is provided. The electronic device includes a substrate, a feeding line and an electrode. The feeding line is disposed on the substrate for transmitting a signal. The electrode is disposed on the substrate for receiving the signal. In addition, an end portion of the feeding line is disposed opposite to an end portion of the electrode.

Abstract: An electronic device includes a substrate, plurality of electrodes disposed on the substrate, a plurality of metal elements disposed on the substrate, a plurality of first lines disposed on the substrate, and a radio frequency signal processor. One of the plurality of metal elements is overlapped one of the plurality of electrodes. The radio frequency signal processor provides a signal to the one of the plurality of electrodes through one of the plurality of first lines.