Abstract: A cache memory die includes a substrate, a predetermined number of sets of memory cells on the substrate, a first set of input/output terminals on a first surface of the cache memory die, and a second set of input/output terminals on a second surface of the cache memory die. The first set of input/output terminals are connected to a primary memory circuit outside the cache memory die. A portion of the second set of input/output terminals are compatible with the first set of input/output terminals.

Abstract: An integrated circuit system comprises an interposer, a first integrated circuit, and at least one voltage regulator module. The first integrated circuit comprises first bond pads, and is electrically connected to the interposer at a first position of the interposer via the first bond pads. The first integrated circuit also comprises second bond pads. The first integrated circuit further comprises at least two circuit blocks. The at least two circuit blocks are configured to operate at different operating voltages. The at least one voltage regulator module is electrically connected to the first integrated circuit via the second bond pads, and the at least one voltage regulator module is configured to convert a received power supply voltage to the respective operating voltage of one of the at least two circuit blocks and supply the respective operating voltage via the second bond pads.

Abstract: A wafer on wafer (WOW) stack includes a first wafer having dies of a first type. The WOW stack further includes a second wafer bonded to the first wafer. The second wafer has dies of a second type. An integer number of dies of the second type are bonded to a corresponding die of the first type. A total area of the dies of the second type bonded to the corresponding die of the first type is less than or equal to an area of the corresponding die of the first type. A functionality of the dies of the first type is different from a functionality of the dies of the second type.

Abstract: An apparatus comprises an integrated circuit and at least one lens. The integrated circuit comprises an image sensor having a light sensing region. The light sensing region is partitioned into sub-regions. The integrated circuit also comprises a processor coupled with and beneath the image sensor. The processor is configured to generate a first processed image based on an image captured by one sub-region, and a second processed image based on another image captured by another sub-region. The first processed image and the second processed image are generated based on a pixel correction process executed by the processor which corrects one or more of the image or the another image based on a predefined light reception factor associated with the sub-regions. The image sensor is configured to receive light via the light sensing region through the at least one lens.

Abstract: A wafer on wafer (WOW) stack includes a first wafer having dies of a first type. The WOW stack further includes a second wafer bonded to the first wafer. The second wafer has dies of a second type. An integer number of dies of the second type are bonded to a corresponding die of the first type. A total area of the dies of the second type bonded to the corresponding die of the first type is less than or equal to an area of the corresponding die of the first type. A functionality of the dies of the first type is different from a functionality of the dies of the second type.

Abstract: The present invention provides therapeutic nucleic acids such as interfering RNA (e.g., siRNA) that target the expression of genes associated with tumorigenesis and/or cell transformation, lipid particles (e.g., nucleic acid-lipid particles) comprising one or more (e.g., a cocktail) of the therapeutic nucleic acids, methods of making the lipid particles, and methods of delivering and/or administering the lipid particles, e.g., for the treatment of a cell proliferative disorder such as cancer.

Abstract: An integrated circuit includes a process voltage temperature (PVT) effect transducer responsive to a PVT effect, a PVT effect quantifier coupled to the PVT effect transducer and configured to quantify the PVT effect to provide an output, and a bias controller configured to receive the output of the PVT effect quantifier and provide a bias voltage for a substrate of an NMOS or a PMOS transistor. The bias controller is configured to compare the output received from the PVT effect quantifier to a threshold value, and decrease or increase the bias voltage depending on whether the output is higher or lower than the threshold value.

Abstract: A package structure includes a networking unit including a plurality of switches/routers and a plurality of network interface units coupled to the plurality of switches/routers, and an interposer including a plurality of metal connections. The interposer is substantially free from functional elements built therein. A functional element is outside of, and bonded onto, the interposer, wherein the functional element is electrically coupled to the networking unit through the plurality of metal connections.

Abstract: One or more techniques or systems for incorporating a common template into a system on chip (SOC) design are provided herein. For example, a common template mask set is generated based on a first set of polygon positions from a first vendor and a second set of polygon positions from a second vendor. A third party creates a third party SOC design using a set of design rules generated based on the common template mask set. The common template is fabricated based on the third party SOC design using the common template mask set. Because the common template is formed using the common template mask set and because the common template mask set is based on polygon positions from both the first vendor and the second vendor, a part can be connected to the SOC regardless of whether the part is sourced from the first vendor or the second vendor.

Abstract: A system and method for designing integrated circuits is disclosed. An embodiment comprises placing a standard cell with a first cell height into a cell row with a different height. The standard cell may have a height smaller than the cell row or else may have a height that is larger than the cell row. Vertical fillers and horizontal fillers are utilized to extend and connect the standard cell to adjacent cells without having to redesign the entire cell row.

Abstract: A package structure includes a networking unit including a plurality of switches/routers and a plurality of network interface units coupled to the plurality of switches/routers, and an interposer including a plurality of metal connections. The interposer is substantially free from functional elements built therein. A functional element is outside of, and bonded onto, the interposer, wherein the functional element is electrically coupled to the networking unit through the plurality of metal connections.

Abstract: A system and method for designing integrated circuits is disclosed. An embodiment comprises placing a standard cell with a first cell height into a cell row with a different height. The standard cell may have a height smaller than the cell row or else may have a height that is larger than the cell row. Vertical fillers and horizontal fillers are utilized to extend and connect the standard cell to adjacent cells without having to redesign the entire cell row.

Abstract: One or more techniques or systems for incorporating a common template into a system on chip (SOC) design are provided herein. For example, a common template mask set is generated based on a first set of polygon positions from a first vendor and a second set of polygon positions from a second vendor. A third party creates a third party SOC design using a set of design rules generated based on the common template mask set. The common template is fabricated based on the third party SOC design using the common template mask set. Because the common template is formed using the common template mask set and because the common template mask set is based on polygon positions from both the first vendor and the second vendor, a part can be connected to the SOC regardless of whether the part is sourced from the first vendor or the second vendor.

Abstract: A method includes (a) generating timing information of an integrated circuit (IC) floorplan by a processing unit, (b) displaying on a display device a representation of the IC floorplan according to the timing information, (c) receiving user input via an input device, the user input associated with an IC macro of the IC floorplan, (d) updating the timing information associated with the IC macro to generated updated timing information according to the user input, and (e) altering display of the representation according to the updated timing information.

Abstract: A method includes (a) generating timing information of an integrated circuit (IC) floorplan by a processing unit, (b) displaying on a display device a representation of the IC floorplan according to the timing information, (c) receiving user input via an input device, the user input associated with an IC macro of the IC floorplan, (d) updating the timing information associated with the IC macro to generated updated timing information according to the user input, and (e) altering display of the representation according to the updated timing information.

Abstract: Methods and apparatus of performing floorplanning and routing for function blocks within a die and among multiple die are disclosed. Multiple die together with function blocks within each die may be represented by a flexible hierarchical (FH) tree. An initial floorplan for multiple die may be generated and hot spots between die or among function blocks within a die may be identified. Spacer blocks may be inserted between die, and block inflation may be performed, to remove hot spots. More perturbation of the block positions can be performed on the FH tree to rearrange the blocks and die. After the multiple die floorplanning, a plurality of micro bumps may be mapped to a plurality of pins of blocks of the plurality of die, placement and routing may be performed for the plurality of blocks within each die and connections for the plurality of dies.

Abstract: A probe card includes a plurality of probe pins, and a switch network connected to the plurality of probe pins. The switch network is configured to connect the plurality of probe pins in a first pattern, and reconnect the plurality of probe pins in a second pattern different from the first pattern.

Abstract: One or more techniques or systems for incorporating a common template into a system on chip (SOC) design are provided herein. For example, a common template mask set is generated based on a first set of polygon positions from a first vendor and a second set of polygon positions from a second vendor. A third party creates a third party SOC design using a set of design rules generated based on the common template mask set. The common template is fabricated based on the third party SOC design using the common template mask set. Because the common template is formed using the common template mask set and because the common template mask set is based on polygon positions from both the first vendor and the second vendor, a part can be connected to the SOC regardless of whether the part is sourced from the first vendor or the second vendor.

Abstract: Some embodiments relate to a semiconductor module comprising a low-cost integrated antenna that uses a conductive backside structure in conjunction with a ground metal layer to form a large ground plane with a small silicon area. In some embodiments, the integrated antenna structure has an excitable element that radiates electromagnetic radiation. An on-chip ground plane, located on a first side of an interposer substrate, is positioned below the excitable element. A compensation ground plane, located on an opposing side of the interposer substrate, is connected to the ground plane by one or more through-silicon vias (TSVs) that extend through the interposer substrate. The on-chip ground plane and the compensation ground collectively act to reflect the electromagnetic radiation generated by the excitable element, so that the compensation ground improves the performance of the on-chip ground plane.

Abstract: An integrated circuit system comprises an interposer, a first integrated circuit, and at least one voltage regulator module. The first integrated circuit comprises first bond pads, and is electrically connected to the interposer at a first position of the interposer via the first bond pads. The first integrated circuit also comprises second bond pads. The first integrated circuit further comprises at least two circuit blocks. The at least two circuit blocks are configured to operate at different operating voltages. The at least one voltage regulator module is electrically connected to the first integrated circuit via the second bond pads, and the at least one voltage regulator module is configured to convert a received power supply voltage to the respective operating voltage of one of the at least two circuit blocks and supply the respective operating voltage via the second bond pads.