Abstract: A display driver integrated circuit chip is provided. The display driver integrated circuit chip may include a source driver circuit configured to process gamma data and generate a driving signal in response to a control signal and a clock signal, a gamma data manager circuit configured to provide the gamma data to the source driver circuit, control logic configured to provide the control signal and the clock signal to the source driver circuit, and a memory configured to store data used to operate the source driver circuit, the gamma data manager circuit and the control logic. A gamma signal line used to transmit the gamma data may include a metal line provided on an area other than an area on which the source driver circuit is disposed.

Abstract: A 3D multifunctional device in which a 3D printer and a 3D scanner are combined and a method for operating the device. The 3D multifunctional device includes a printing unit that includes a nozzle for ejecting material for 3D printing, a scanning unit that includes a light radiation module for radiating light to an object to be scanned and a camera for capturing an image of the object, a head unit for moving the printing unit and the scanning unit in X-axis and Y-axis directions, a bed plate on which the object to be scanned is located or the ejected material is deposited, the bed plate moving in a Z-axis direction, and a control unit for setting a function by selecting 3D scanning or 3D printing, controlling the scanning unit or the printing unit, and controlling the movements of the head unit and bed plate.

Abstract: An apparatus and method for managing a teeth model. The apparatus for managing a teeth model includes a database for storing a 3D intraoral structure image and a 3D teeth model image generated by scanning a healthy intraoral structure and teeth of a user; a generation unit for generating a damaged tooth model image by scanning a damaged tooth when the tooth of the user is damaged; and a modeling unit for modeling any one of a dental prosthesis and an artificial tooth by comparing the damaged tooth model image and the image stored in the database.

Abstract: Vertical high power LEDs are the technological choice for the application of general lighting due to their advantages of high efficiency and capability of handling high power. However, the technologies of vertical LED fabrication reported so far involve the wafer-level metal substrate substitution which may cause large stress due to the mismatch between metal substrate and LED layer. Moreover, the metal substrate has to be diced to separate LED dies which may cause metal contamination and thus increase the leakage current. These factors will lower the yield of LED production and increase the cost as well. The present invention is to disclose a novel method for the fabrication of GaN vertical high power LEDs and/or a novel method for the fabrication of GaN vertical high power LEDs which is compatible to mass production conditions. The novelty of the invention is that the island metal plating is conducted with the help of pattern formation techniques.

Abstract: An organic light-emitting diode including a substrate; a first electrode on the substrate; a second electrode facing the first electrode; and an emission layer between the first electrode and the second electrode, the emission layer including an anthracene-based compound represented by Formula 1, below, and a condensed ring compound represented by Formula 20, below:

Abstract: An organic light-emitting diode, comprising a substrate; a first electrode on the substrate; a second electrode disposed opposite to the first electrode; and an emission layer between the first electrode and the second electrode, the emission layer including an anthracene-based compound represented by Formula 1, below, and a condensed cyclic compound represented by Formula 20, below:

Abstract: A light-emitting device may include an active layer. The light-emitting device may include a first semiconductor layer of a first conductivity type. The first semiconductor layer may be in physical contact with the active layer. The light-emitting device may also include a second semiconductor layer of a second conductivity type. The second semiconductor layer may be in physical contact with the active layer and opposite the first conductive layer. The light-emitting device may further include a first electrode in physical contact with a first side of the first semiconductor layer. The light-emitting device may additionally include a second electrode in physical contact with a second side of the first semiconductor layer. The second side of the first semiconductor layer may be different from the first side of the first semiconductor layer. The light-emitting device may also include a third electrode in physical contact with the second semiconductor layer.

Abstract: An apparatus for transforming image includes: a depth map generating unit generating a depth map of a 2D image; a rendering unit rendering a left-eye image and a right-eye image depending on the depth map; a hole removing unit removing holes of the left-eye image and the right-eye image; and a synthesizing unit synthesizing the left-eye image and the right-eye image to render a 3D image.

Abstract: A chip-on-film (COF) package includes a base film, a semiconductor chip mounted on a chip mounting region of a top surface of the base film, a plurality of top inner output conductive patterns, a plurality of bottom inner output conductive patterns and a plurality of landing vias. The top inner output conductive patterns are formed on the top surface of the base film and respectively connected to chip inner output pads formed on a bottom surface of the semiconductor chip. The bottom inner output conductive patterns are formed on a bottom surface of the base film. The landing vias are formed to vertically penetrate the base film and to respectively connect the top inner output conductive patterns and the bottom inner output conductive patterns. The landing vias are arranged within the chip mounting region to form a two-dimensional shape.

Abstract: A display driver integrated circuit chip is provided. The display driver integrated circuit chip may include a source driver circuit configured to process gamma data and generate a driving signal in response to a control signal and a clock signal, a gamma data manager circuit configured to provide the gamma data to the source driver circuit, control logic configured to provide the control signal and the clock signal to the source driver circuit, and a memory configured to store data used to operate the source driver circuit, the gamma data manager circuit and the control logic. A gamma signal line used to transmit the gamma data may include a metal line provided on an area other than an area on which the source driver circuit is disposed.

Abstract: In accordance with a first exemplary embodiment, there is provided a computing device. The device includes a memory equipped with a program operating a file system supporting ordered mode journaling; and a processor operating the program stored in the memory. Wherein according to execution of the program, when an fsync system call for the file stored in the memory occurs, the processor extracts a block-group-level transaction corresponding to the file from a compound transaction including the file, records the transaction in a data area of the memory, and executes journaling of the transaction in a journal area of the memory.

Abstract: Vertical high power LEDs are the technological choice for the application of general lighting due to their advantages of high efficiency and capability of handling high power. However, the technologies of vertical LED fabrication reported so far involve the wafer-level metal substrate substitution which may cause large stress due to the mismatch between metal substrate and LED layer. Moreover, the metal substrate has to be diced to separate LED dies which may cause metal contamination and thus increase the leakage current. These factors will lower the yield of LED production and increase the cost as well. The present invention is to disclose a novel method for the fabrication of GaN vertical high power LEDs and/or a novel method for the fabrication of GaN vertical high power LEDs which is compatible to mass production conditions. The novelty of the invention is that the island metal plating is conducted with the help of pattern formation techniques.

Abstract: The invention provides an isolated or purified CD8+? T cell which comprises an antigen-specific T cell receptor and an exogenous nucleic acid encoding a microRNA-155 (miR-155) molecule, and methods of preparing the same. The invention also provides a pharmaceutical composition comprising the CD8+ T cell a carrier. Further provided is a method for treating or preventing a medical condition, such as cancer, by adoptively transferring to a mammal an amount of the CD8+? T cells effective to treat or prevent the medical condition.