Abstract: A memory device including a parallel test circuit can overcome a channel deficiency phenomenon of test equipment by reducing the number of input/output pads. The memory device including a parallel test circuit comprises a burst length regulating block, a parallel test block, an output block and a plurality of input/output pads. The burst length regulating block sets a second burst length at a test mode which is longer than a first burst length at a normal mode. The parallel test block compresses data and tests the compressed data by a repair unit. The output block sequentially outputs data outputted from at least two or more parallel test blocks depending on the second burst length. The plurality of input/output pads externally output data outputted from the output block.

Abstract: Disclosed is a method for analyzing a defect of a semiconductor device, and more particularly a method for electrically analyzing a defect of a transistor formed in a cell having a latch structure, such as SRAM or a sense amplifier of DRAM. The defect analyzing method according to the present invention comprises the steps of forming a test SRAM cell array in a scribe lane region of a wafer which is formed with a plurality of SRAM chips, forming a pad portion for testing the SRAM cell array on the scribe lane region, and applying a predetermined test voltage to the SRAM cell array through the pad portion. The respective array cells constituting the SRAM cell array are provide with two word lines, and individual test voltages can be applied through the pad portion to the two word lines, respectively.