Abstract: A test handler is provided, which comprises a test tray, at least one opening unit, and a position changing apparatus. The test tray aligns a plurality of inserts on its side. Each insert loads at least one semiconductor device thereon. The opening unit opens inserts at one part of the one side of the test tray. The position changing apparatus moves at least one opening unit in such a way that the at least one opening units can be located at another part of the one side of the test tray, such that the at least one opening units can open inserts at said another part of the one side of the test tray. The present invention can reduce the number of replaced parts according to change in the semiconductor device size, production cost, and part replacement time.

Abstract: A test handler is disclosed. The test handler includes first to third transfers for transferring a user tray, and first to third horizontal movement units suitable for respectively moving the first to third transfers in a horizontal direction. The first to third horizontal movement units are independently operated such that each of the first to third transfers can perform independently horizontal movements. Each of the first to third transfers performs based on its previously allocated function, thereby enhancing test process speed for devices.

Abstract: An opener for a test handler is provided. Even when holding members of inserts of a carrier board are manipulated to release semiconductor devices that have been in a held state, a predetermined distance can remain between an upper surface of the opening plate and a lower surface of the insert, thus preventing the inserts from becoming defective.

Abstract: A pick and place apparatus includes a plurality of device holing elements in a predetermined arrangement; a power supply mechanism for supplying a power for controlling a horizontal pitch between the plurality of device holding elements; a power transmission mechanism for delivering the power from the power supply mechanism to the plurality of device holding elements as a translational force in a horizontal direction; a first linear motion guide mechanism for guiding horizontal movements of some of the plurality of device holding elements; and a second linear motion guide mechanism disposed below the first linear motion guide mechanism, for guiding horizontal movements of the other device holding elements. The plurality of device holding elements are slidably coupled to the first and the second linear motion guide mechanism alternately.

Abstract: A test handler is disclosed in the present invention. The test handler may include a test tray on which a plurality of inserts are arrayed for loading at least one semiconductor device, at least one opening unit for simultaneously opening one part of the plurality of inserts which are arrayed on one part of the test tray, and a test tray transfer apparatus for allowing the opening unit to simultaneously open other parts of the plurality of inserts which are arrayed on another part of the test tray as the test tray is transferred. Therefore, although semiconductor devices to be tested change their sizes, the replaced parts of the test handler are reduced in number, thereby reducing manufacturing cost and replacement work time. The inventive test handler reduces semiconductor devices loading time, reduces jamming, increases teaching efficiency and improves space utilization efficiency. Furthermore, the test handler can be applied to various types of testers.

Abstract: When a test handler loads semiconductor devices of user trays onto a test tray, the test handler adjusts a front/rear pitch or a right/left pitch between the semiconductor devices, adjusts the right/left pitch or the front/rear pitch, and loads the semiconductor devices. The test handler can sequentially adjust individually the front/rear pitch and the right/left pitch between the semiconductor devices, thereby reducing the apparatus weight and the loading time.

Abstract: A test handler is disclosed. The test handler includes first to third transfers for transferring a user tray, and first to third horizontal movement units suitable for respectively moving the first to third transfers in a horizontal direction. The first to third horizontal movement units are independently operated such that each of the first to third transfers can perform independently horizontal movements. Each of the first to third transfers performs based on its previously allocated function, thereby enhancing test process speed for devices.

Abstract: A pick and place apparatus includes a 1st to an nth device holding element arranged in a lengthwise direction, every one of the 1st to the nth device holding element being connected to its neighboring one(s) of the 1st to the nth device holding element by means of at least one pitch setting ring; a belt having a first coupling part at an upper part thereof for being coupled to the 1st device holding element and a second coupling part at a lower part thereof for being coupled to the nth device holding element; and a driven pulley and a differential pulley. The driven and the differential pulley are rotated by being engaged with the belt to move the 1st and the nth device holding element such that the 1st device holding element moves in a direction opposite to the nth device holding element.

Abstract: A test handler is disclosed. The test handler includes first to third transfers for transferring a user tray, and first to third horizontal movement units suitable for respectively moving the first to third transfers in the horizontal direction. The first to third horizontal movement units are independently operated such that each of the first to third transfers can perform independently horizontal movements. Each of the first to third transfers performs based on its previously allocated function, thereby enhancing test process speed for devices.

Abstract: A test handler includes a loading unit for loading semiconductor devices from customer trays onto a test tray; a test chamber for performing a test for the semiconductor devices loaded on the test tray; a pushing unit having at least one pushing member for pushing the test tray located in the test chamber to be tested, and a press unit for operating the pushing member; a position control unit for adjusting a position of the pushing member to compensate a deviation between the pushing member and the test tray due to a thermal expansion or contraction of any one of the pushing member and the test tray; and an unloading unit for unloading the semiconductor devices loaded on the test tray onto the customer trays after a test for the semiconductor devices is completed.

Abstract: A test handler is disclosed. A posture changing unit for changing a posture of a test tray on which semiconductor devices have been loaded changes the posture of the test tray in a soak chamber. While the posture of the test tray is changed, the devices can be pre-heated/pre-cooled, thereby reducing the soak chamber length and the pre-heating/pre-cooling time.

Abstract: Operation methods of test handler are disclosed. The pick-and-place apparatus picks up semiconductor devices from first loading compartments arrayed in a matrix on a first loading element, moves, and places onto second loading compartments arrayed in a matrix on a second loading element. Pickers of the pick-and-place apparatus pick up the semiconductor devices from the first loading compartments and place them selectively onto a plurality of adjacent odd rows or a plurality of adjacent even rows of the second loading compartments during one operation. The pick-and-place apparatus includes a relatively large number of the pickers, preferably arrayed in a matrix, and thus performs loading and unloading of semiconductor devices at a relatively high speed.

Abstract: A technology related to a pick-and-place apparatus for electronic device inspection equipment is provided. The pick-and-place apparatus includes the guiding unit that can interact with a loading element and can guide the picker to load the electronic devices at a correct position on the loading element. Therefore, the pick-and-place apparatus can allow the electronic devices, for example, semiconductor devices having a ball type of electrical contact lead (BGA, FBGA, etc.), to electrically contact the tester in a stable manner when the tester inspects the electronic devices.

Abstract: An opener and a buffer table for a test handler are disclosed. The opener includes an opening plate, a plurality of pin blocks forming pairs, and at least one or more interval retaining apparatus for retaining an interval between the pin blocks forming a pair. Each of the pin blocks is movably coupled to the opening plate, and includes opening pins for releasing a holding state of a holding apparatus that holds semiconductor devices in a carrier board. Although semiconductor devices to be tested are altered in size and a carrier board loading with the semiconductor devices is thus replaced, the opener does not need to be replaced, thereby reducing the replacement cost and the waste of resources.

Abstract: A pick-and-place module for test handlers is disclosed that includes a main body and a kit. The main body forms vacuum paths therein and the kit also forms vacuum passages therein. The kit is detachably mounted to the main body in a hook coupling manner. The pick-and-place module can be applied to all customer trays having different loading capabilities when only the kit of the pick-and-place module needs to be replaced, so there is no need to manufacture the entire pick-and-place module and this reduces manufacturing costs. The pick-and-place module can reduce the amount of resources to be replaced and reduce the replacement time since the kit can be easily removed from the main body of the pick-and-place module in a hook manner.

Abstract: A system and method is disclosed that transfers carrier boards in a handler that supports the testing of electronic devices. A carrier board can be transferred from the transfer start position to one of the mid transfer positions and the transfer final position. Carrier boards, which are spaced apart from each other in a chamber, can be gathered adjacent to each other in the circulation direction of carrier board. The transfer speed and the total circulation speed of the carrier boards can be enhanced. The transfer speed of carrier board can be easily controlled according to the test conditions.

Abstract: A test handler (122) of the present invention includes a main body, a window (142) formed on a surface of the main body and having a size corresponding to a Hi-Fix board of M×N array (where M and N represent an integer greater than a value of =), a cover (170) detachably fixed to the main body t close a part of the window and convert the window into the test site having a size corresponding to a [M?A)×(n?B)] Hi-Fix board (where A is an integer equal to or greater than 0 but smaller than M, and B is an integer having a value other than 0). In the test handler, the size of window is easily modified to adapt that of the Hi-Fix board of M×N array by closing or opening a part of the window using the cover. Therefore, the test handler is capable of applying Hi-Fix boards having different sizes.

Abstract: A test handler is disclosed. First and second gripping blocks for respective front and rear test trays to be transferred along a circulation path move together in a circulation direction, but move independently in a direction perpendicular to the circulation path and grip and release independently. The test trays can be transferred by a single power source and interference between an assisting a test and a transferring can be minimized.

Abstract: Operation methods of test handler are disclosed. The pick-and-place apparatus picks up semiconductor devices from first loading compartments arrayed in a matrix on a first loading element, moves, and places onto second loading compartments arrayed in a matrix on a second loading element. Pickers of the pick-and-place apparatus pick up the semiconductor devices from the first loading compartments and place them selectively onto a plurality of adjacent odd rows or a plurality of adjacent even rows of the second loading compartments during one operation. The pick-and-place apparatus includes a relatively large number of the pickers, preferably arrayed in a matrix, and thus performs loading and unloading of semiconductor devices at a relatively high speed.

Abstract: The present invention relates to a test tray for a test handler. According to this invention, there is disclosed a technique that an insert loaded in a loading part which is arranged in a matrix pattern in a frame of the test tray allows an amount and direction of free movement thereof to be determined in accordance with a location of the loading part, where the insert is loaded, on the matrix, thereby enabling a thermal expansion or contraction of a match plate or the test tray to be compensated.