Abstract: A test handler includes a loading unit for loading semiconductor devices from customer trays onto a test tray; a test chamber for performing a test for the semiconductor devices loaded on the test tray; a pushing unit having at least one pushing member for pushing the test tray located in the test chamber to be tested, and a press unit for operating the pushing member; a position control unit for adjusting a position of the pushing member to compensate a deviation between the pushing member and the test tray due to a thermal expansion or contraction of any one of the pushing member and the test tray; and an unloading unit for unloading the semiconductor devices loaded on the test tray onto the customer trays after a test for the semiconductor devices is completed.

Abstract: Operation methods of test handler are disclosed. The pick-and-place apparatus picks up semiconductor devices from first loading compartments arrayed in a matrix on a first loading element, moves, and places onto second loading compartments arrayed in a matrix on a second loading element. Pickers of the pick-and-place apparatus pick up the semiconductor devices from the first loading compartments and place them selectively onto a plurality of adjacent odd rows or a plurality of adjacent even rows of the second loading compartments during one operation. The pick-and-place apparatus includes a relatively large number of the pickers, preferably arrayed in a matrix, and thus performs loading and unloading of semiconductor devices at a relatively high speed.

Abstract: A pusher for a match plate of a test handler is disclosed which assists a tester to test the produced semiconductor devices. The pusher includes: a body part installed to an installation plate; and a pushing part that extends forward from a front side of the body part, for pushing a semiconductor device placed on an insert of a test tray. The pusher forms: an air through hole that extends through from a rear side of the body part to the front side of the pushing part, for guiding air of a certain temperature, supplied to the rear side of the body part from a duct, to be supplied to the semiconductor device; and at least one or more air outflow holes that extend through from at least one side of the pushing part and communicate with the air through hole, for allowing part of the air supplied from the duct through the air through hole to flow out to a test site. The pusher can reduce the temperature deviation of semiconductor devices at the test site.

Abstract: A pick and place apparatus includes a plurality of device holing elements in a predetermined arrangement; a power supply mechanism for supplying a power for controlling a horizontal pitch between the plurality of device holding elements; a power transmission mechanism for delivering the power from the power supply mechanism to the plurality of device holding elements as a translational force in a horizontal direction; a first linear motion guide mechanism for guiding horizontal movements of some of the plurality of device holding elements; and a second linear motion guide mechanism disposed below the first linear motion guide mechanism, for guiding horizontal movements of the other device holding elements. The plurality of device holding elements are slidably coupled to the first and the second linear motion guide mechanism alternately.

Abstract: A test handler is disclosed. First and second gripping blocks for respective front and rear test trays to be transferred along a circulation path move together in a circulation direction, but move independently in a direction perpendicular to the circulation path and grip and release independently. The test trays can be transferred by a single power source and interference between an assisting a test and a transferring can be minimized.

Abstract: A test handler (122) of the present invention includes a main body, a window (142) formed on a surface of the main body and having a size corresponding to a Hi-Fix board of M×N array (where M and N represent an integer greater than a value of =), a cover (170) detachably fixed to the main body t close a part of the window and convert the window into the test site having a size corresponding to a [M?A)×(n?B)] Hi-Fix board (where A is an integer equal to ot greater than 0 but smaller than M, and B is an integer having a value other than 0). In the test handler, the size of window is easily modified to adapt that of the Hi-Fix board of M×N array by closing or opening a part of the window using the cover. Therefore, the test handler is capable of applying Hi-Fix boards having different sizes.

Abstract: A test handler is disclosed. The test handler includes first to third transfers for transferring a user tray, and first to third horizontal movement units suitable for respectively moving the first to third transfers in the horizontal direction. The first to third horizontal movement units are independently operated such that each of the first to third transfers can perform independently horizontal movements. Each of the first to third transfers performs based on its previously allocated function, thereby enhancing test process speed for devices.

Abstract: A clamping apparatus for clamping a plurality of Hi-Fix boards arranged in a row, includes at least one rotational clamping unit installed to clamp facing end sides of the two or more Hi-Fix boards together, and a plurality of clamping units installed to clamp end sides of the Hi-Fix boards other than the facing sides thereof. The rotational clamping unit includes a clamper installed to rotate about a fixed rotation point to clamp or release the claming of the facing end sides of the two or more Hi-Fix boards, and a driving unit for providing a rotational force to the clamper.

Abstract: A test handler is disclosed in the present invention. The test handler may include a test tray on which a plurality of inserts are arrayed for loading at least one semiconductor device, at least one opening unit for simultaneously opening one part of the plurality of inserts which are arrayed on one part of the test tray, and a test tray transfer apparatus for allowing the opening unit to simultaneously open other parts of the plurality of inserts which are arrayed on another part of the test tray as the test tray is transferred. Therefore, although semiconductor devices to be tested change their sizes, the replaced parts of the test handler are reduced in number, thereby reducing manufacturing cost and replacement work time. The inventive test handler reduces semiconductor devices loading time, reduces jamming, increases teaching efficiency and improves space utilization efficiency. Furthermore, the test handler can be applied to various types of testers.

Abstract: A test handler is disclosed. A posture changing unit for changing a posture of a test tray on which semiconductor devices have been loaded changes the posture of the test tray in a soak chamber. While the posture of the test tray is changed, the devices can be pre-heated/pre-cooled, thereby reducing the soak chamber length and the pre-heating/pre-cooling time.

Abstract: When a test handler loads semiconductor devices of user trays onto a test tray, the test handler adjusts a front/rear pitch or a right/left pitch between the semiconductor devices, adjusts the right/left pitch or the front/rear pitch, and loads the semiconductor devices. The test handler can sequentially adjust individually the front/rear pitch and the right/left pitch between the semiconductor devices, thereby reducing the apparatus weight and the loading time.

Abstract: The present invention discloses a test handler comprising a main body, a stocker including a user tray supplier and a user tray deliverer for loading plurality of user trays carrying the semiconductor device during devices tests, a plurality of test trays, a device loading means for transferring the devices in the user tray of the user tray supplier to the test tray, a first tray inverter changing the horizontal posture of the test tray, a soak chamber preparing a desired test temperature condition, a test chamber accomplishing tests, a de-soak chamber restoring the devices temperature, a second tray inverter inverting to the test tray of a horizontal posture, a device unloading means transferring the semiconductor devices on the test tray. The present invention can double the lot size in unit operation to improve equipment operation ratio. In more, the device loading time and unloading can be reduced so that the number of the devices treated in unit operation can be increased.

Abstract: A test tray insert of a test handler is provided including a housing, a locker, and a stopper, where one end side of the stopper is hinged on the inside of the mounting hole and the other end side of the stopper is protruded to the receiving hole so that the stopper fixes the device. The housing includes a receiving hole for loading a device in the enter of the receiving hole, and a mounting hole, extended from both sides of the receiving hole, including a joint jaw. The housing further includes a base protrusion placed n both ends of the bottom of the receiving hole and a supporting protrusion placed in both sides of the base protrusion.

Abstract: The present invention discloses a test handler comprising a main body, a stocker including a user tray supplier and a user tray deliver for loading plurality of user trays carrying the semiconductor device during devices tests, a plurality of test trays, a device loading means for transferring the devices in the user tray of the user tray supplier to the test tray, a first tray inverter changing the horizontal posture of the test tray, a soak chamber preparing a desired test temperature condition, a test chamber accomplishing tests, a de-soak chamber restoring the devices temperature, a second tray inverter inverting to the test tray of a horizontal posture, a device unloading means transferring the semiconductor devices on the test tray. The present invention can double the lot size in unit operation to improve equipment operation ratio. In more, the device loading time and unloading can be reduced so that the number of the devices treated in unit operation can be increased.