Abstract: A display device includes a light emitting diode electrically connected between a driving voltage line and a common voltage line; a driving transistor electrically connected between the driving voltage line and the light emitting diode; a second transistor electrically connected between a first electrode of the driving transistor electrically connected to the driving voltage line and a data line; a first scan line electrically connected to a gate electrode of the second transistor; a third transistor electrically connected between a second electrode of the driving transistor electrically connected to the light emitting diode and a gate electrode of the driving transistor; and a connection electrode that connects the gate electrode of the driving transistor and the third transistor, wherein at least a part of a contact portion where the connection electrode contacts the third transistor does not overlap the first scan line.

Abstract: A color conversion panel includes a first color filter and a second color filter that are disposed on a substrate, a low refractive index layer disposed on the substrate, the first color filter, and the second color filter, the low refractive index layer including at least one of a first blue pigment and a first blue dye, a first color conversion layer overlapping the first color filter and including a semiconductor nanocrystal, a second color conversion layer overlapping the second color filter and including a semiconductor nanocrystal, and a transmissive layer that overlaps the low refractive index layer.

Abstract: A display device includes a light emitting diode electrically connected between a driving voltage line and a common voltage line; a driving transistor electrically connected between the driving voltage line and the light emitting diode; a second transistor electrically connected between a first electrode of the driving transistor electrically connected to the driving voltage line and a data line; a first scan line electrically connected to a gate electrode of the second transistor; a third transistor electrically connected between a second electrode of the driving transistor electrically connected to the light emitting diode and a gate electrode of the driving transistor; and a connection electrode that connects the gate electrode of the driving transistor and the third transistor, wherein at least a part of a contact portion where the connection electrode contacts the third transistor does not overlap the first scan line.

Abstract: Disclosed are an apparatus and a method for Internet of Things (IoT) device security. The method includes unifying a port in a first IoT device for communication, receiving, by the first IoT device, a packet from a second IoT device through the port, identifying whether the packet in the first IoT device is in a preset packet form, verifying content of the packet in the first IoT device when the packet is in the preset packet form, and opening the port for providing a service in the first IoT device when the verifying of the packet content is successful.

Abstract: Provided are a driving assistance system and method. The driving assistance system is for interfacing with an individual vehicle and includes: a camera system that generates image information about the surroundings of the vehicle; a vehicle controller that generates driving information about the vehicle; and a communication port. The driving assistance system includes a driving assistance terminal and/or mobile device that are/is connected to the communication port, acquire(s) image information and/or driving information by using the communication port, and execute(s) at least a portion of a travel program for the driving assistance terminal and/or mobile device on the basis of an image and/or driving information for controlling the vehicle with respect to one or more of auxiliary travels and/or autonomous operations of the vehicle through a control signal generated by the driving assistance terminal or the mobile device and provided to the vehicle.

Abstract: The present disclosure relates to a semiconductor package including a first semiconductor chip having a first surface on which first connection pads are disposed, and a second surface on which second connection pads are disposed, and including through-vias connected to the second connection pads; a connection structure disposed on the first surface and including a first redistribution layer; a first redistribution disposed on the second surface; and a second semiconductor chip disposed on the connection structure. The first connection pads are connected to a signal pattern of the first redistribution layer, and the second connection pads are connected to at least one of a power pattern and a ground pattern of the second redistribution layer.

Abstract: A semiconductor package includes: a semiconductor chip including a front end of line (FEOL) layer and a first back end of line (BEOL) layer disposed on the FEOL layer; and a printed circuit board including a wiring layer and a second BEOL layer disposed on the wiring layer, wherein the semiconductor chip is mounted on the printed circuit board so that the first and second BEOL layers are connected to each other while facing each other, and the second BEOL layer includes a wiring for power transmission.

Abstract: A bridge embedded interposer and a package substrate and a semiconductor package including the same includes: a connection structure including one or more redistribution layers, a first bridge disposed on the connection structure and including one or more first circuit layers electrically connected to the one or more redistribution layers, a frame disposed around the first bridge on the connection structure and including one or more wiring layers electrically connected to the one or more redistribution layers, and an encapsulant disposed on the connection structure and covering at least a portion of each of the first bridge and the frame.

Abstract: A semiconductor package includes: a first semiconductor package including: a first frame having a first through portion, a first semiconductor chip in the first through portion and having a first surface on which a first connection pad is disposed and a second surface on which a second connection pad is disposed, and a through via connected to the second connection pad, a first connection structure on the first surface and including a first redistribution layer, and a backside redistribution layer on the second surface; and a second semiconductor package on the first semiconductor package and including: a second connection structure including a second redistribution layer, a second frame on the second connection structure and having a second through portion, and a second semiconductor chip in a second through portion and having a third surface on which a third connection pad is disposed.

Abstract: The present disclosure relates to a semiconductor package including a first semiconductor chip having a first surface on which first connection pads are disposed, and a second surface on which second connection pads are disposed, and including through-vias connected to the second connection pads; a connection structure disposed on the first surface and including a first redistribution layer; a first redistribution disposed on the second surface; and a second semiconductor chip disposed on the connection structure. The first connection pads are connected to a signal pattern of the first redistribution layer, and the second connection pads are connected to at least one of a power pattern and a ground pattern of the second redistribution layer.

Abstract: A terminal may include: a sensor unit including a microphone configured to acquire a surrounding sound, and a position sensor configured to identify a position of the terminal; a processor configured to learn the position of the terminal and the surrounding sound to identify characteristics of a dangerous sound depending on the position of the terminal, and determine a setting value of a hearing aid depending on the identified characteristics of the dangerous sound; and a communicator configured to transmit the setting value to the hearing aid.

Abstract: An actuator includes a magnet, a driving coil facing the magnet, a driver, and a position calculation processor. The driver is configured to move the magnet in at least one of an optical axis direction and a direction perpendicular to the optical axis by applying a driving signal to the driving coil. The position calculation processor includes sensing coils, and is configured to calculate a position of the magnet according to inductance levels of an inductor of the sensing coils. The inductance levels vary according to movements of the magnet.

Abstract: The present disclosure relates to a semiconductor package including a first semiconductor chip having a first surface on which first connection pads are disposed, and a second surface on which second connection pads are disposed, and including through-vias connected to the second connection pads; a connection structure disposed on the first surface and including a first redistribution layer; a first redistribution disposed on the second surface; and a second semiconductor chip disposed on the connection structure. The first connection pads are connected to a signal pattern of the first redistribution layer, and the second connection pads are connected to at least one of a power pattern and a ground pattern of the second redistribution layer.

Abstract: A camera for a vehicle includes: an imaging unit configured to image an exterior of the vehicle; and a controller configured to enlarge a region of interest of the imaging unit in response to a driving speed of the vehicle being higher than a reference speed, and reduce the region of interest of the imaging unit in response to the driving speed being lower than the reference speed.

Abstract: A multilayer ceramic electronic component and a mounting board thereof include a reinforcing member that is disposed on upper and lower surfaces of a ceramic body of the multilayer ceramic electronic component and that is bonded to the first and the second external electrodes. The reinforcing member provides reduced occurrence of cracking and reduced stress applied to the component. The reinforcing member may have a coefficient of thermal expansion (CTE) that is within a range of 1 to 4 times a coefficient of thermal expansion of a dielectric layer of the ceramic body, and/or may have a modulus that is 0.5 or more times a modulus of the dielectric layer.

Abstract: Provided are a driving assistance system and method. The driving assistance system is for interfacing with an individual vehicle and includes: a camera system that generates image information about the surroundings of the vehicle; a vehicle controller that generates driving information about the vehicle; and a communication port. The driving assistance system includes a driving assistance terminal and/or mobile device that are/is connected to the communication port, acquire(s) image information and/or driving information by using the communication port, and execute(s) at least a portion of a travel program for the driving assistance terminal and/or mobile device on the basis of an image and/or driving information for controlling the vehicle with respect to one or more of auxiliary travels and/or autonomous operations of the vehicle through a control signal generated by the driving assistance terminal or the mobile device and provided to the vehicle.

Abstract: A terminal may include: a sensor unit including a microphone configured to acquire a surrounding sound and a position sensor configured to detect a position of the terminal; a processor configured to identify characteristics of a voice of a specific person designated by a user of the terminal through learning, and determine a setting value determining operating characteristics of a hearing aid based on the characteristics of the voice of the specific person; and a communicator configured to transmit the setting value to the hearing aid.

Abstract: A semiconductor package includes a frame having a recess on which a stopper layer is disposed, a semiconductor chip including a body having a first surface on which a connection pad is disposed and a second surface opposing the first surface, and a through-via penetrating through at least a portion of a region between the first surface and the second surface, the second surface facing the stopper layer, an encapsulant covering at least a portion of each of the frame and the semiconductor chip and filling at least a portion of the recess, a first connection structure disposed on a lower side of the frame and on the first surface of the semiconductor chip and including a first redistribution layer, and a second connection structure disposed on an upper side of the frame and on the second surface of the semiconductor chip and including a second redistribution layer.

Abstract: A package-on-package includes a first semiconductor package including a first semiconductor chip and a second semiconductor package, disposed on the first semiconductor package, including a second semiconductor chip electrically connected to the first semiconductor chip. Each of the first and second semiconductor chips includes one or more units. The number of units of the first semiconductor chip is greater than the number of units of the second semiconductor chip. The one or more units of the first semiconductor chip and the one or more units of the second semiconductor chip implement a function of an application processor chip.

Abstract: A connection system of semiconductor packages includes: a printed circuit board; a first semiconductor package disposed on a first surface of the printed circuit board and connected to the printed circuit board through first electrical connection structures; a second semiconductor package disposed on a second surface of the printed circuit board and connected to the printed circuit board through second electrical connection structures; and a third semiconductor package disposed on the first 10 semiconductor package and connected to the first semiconductor package through third electrical connection structures. The first semiconductor package includes an application processor (AP), the second semiconductor package includes a memory, and the third semiconductor package includes a power management integrated 15 circuit (PMIC).