Abstract: An electrical connector includes an insulation body, a terminal assembly fastened in the insulation body, a middle grounding plate and a detecting structure. The middle grounding plate is mounted in a middle of the terminal assembly. One side of the middle grounding plate has an elastic arm. The middle grounding plate has a main portion. Two rear ends of two opposite side edges of the main portion transversely extend outward to form two extending portions. A rear end of the elastic arm is connected with one extending portion. The detecting structure is disposed to the other side of the middle grounding plate. The detecting structure is fastened in the insulation body. A front end of the detecting structure is exposed out of the insulation body. The other extending portion is disconnected from a rear end of the detecting structure.

Abstract: An electrical connector includes an insulating housing, an insulation body, an upper terminal assembly and a lower terminal assembly. The insulating housing has a plurality of fastening blocks and a plurality of fastening slots. Several portions of a lower end of a rear surface of the insulating housing extend rearward to form the plurality of the fastening blocks. Each fastening slot is formed between two adjacent fastening blocks. The insulation body is fastened in the insulating housing. The upper terminal assembly is fastened in an upper portion of the insulation body. The lower terminal assembly is fastened in a lower portion of the insulation body. The upper terminal assembly and the lower terminal assembly are disposed opposite to each other.

Abstract: In some embodiments, the present disclosure relates to a semiconductor device. The semiconductor device includes a channel layer over a base substrate and an active layer over the channel layer. A source and a drain are over the active layer. A gate is over the active layer and laterally between the source and the drain. A dielectric is over the active layer and laterally surrounds the source, the drain, and the gate. A cap structure laterally contacts the source and is disposed laterally between the gate and the source. The source vertically extends to a top of the cap structure.

Abstract: The present disclosure provides systems and methods for hydrogen production as well as apparatuses useful in such systems and methods, including steam generation systems and methods. Hydrogen is produced by reforming of a hydrocarbon in a plurality of reformers to achieve improved reforming efficiency. A CO2 convective reformer (CCR) and an oxygen secondary reformer (OSR) are used in series to convert hydrocarbon and steam to synthesis gas with substantially complete carbon capture. Steam generation is provided along separate pathways to provide separate steam streams of different composition.

Abstract: The present invention provides a photovoltaic panel packaging structure and method for the same. The packaging structure comprises a frame and a solar photovoltaic panel. The solar photovoltaic panel includes a first frame surface and a second frame surface with a receiving space and grooves formed therein. The a solar photovoltaic panel is installed in the receiving space and stacked on top of a first stop portion. The solar photovoltaic panel includes a first encapsulating layer, a second encapsulating layer. The first encapsulating layer includes a plurality of engaging strips extending along the edges of the solar photovoltaic panel, the engaging strips are respectively embedded in the corresponding grooves to hold the solar photovoltaic panel in place in the frame. Meanwhile, a third encapsulating layer extends to connect to the second frame surface. As a result, weight and thickness can be reduced while reducing multiple packaging passes and simplifying the assembly process.

Abstract: Embodiments of present disclosure provide a MIM capacitor device structure including a first conductive layer and a dielectric stack disposed on the first and second portions of the first conductive layer. The dielectric stack includes a first dielectric layer disposed on the first conductive layer, a high-k dielectric layer disposed on the first dielectric layer, and a second dielectric layer disposed on the high-k dielectric layer. The structure further includes a second conductive layer disposed on the dielectric stack, a first conductive feature extending through the first conductive layer and a first portion of the dielectric stack, and a second conductive feature extending through a second portion of the dielectric stack and the second conductive layer.

Abstract: Bonding a full-bridge device and an LLC device in a stack, or forming the full-bridge device and the LLC device on a same substrate, rather than connecting the devices, reduces a chip area associated with a power converter including the full-bridge device and the LLC device. Additionally, the full-bridge device and the LLC device consume less power because parasitic inductance and capacitance are reduced. Additionally, raw materials and production time are conserved that would otherwise have been used to connect the full-bridge device and the LLC device (e.g., via wires).

Abstract: A grip strength training and measuring device includes a main body configured for fingers to abut against and press, a penetrating hole penetrating through the main body to define a accommodating space, a pressure sensor arranged in the accommodating space and including a pressure sensing unit to detect a pressure magnitude and a pressing time transmitting from the main body to the pressure sensor when fingers press the main body and to output pressure measurement data, a processor electrically connected to the pressure sensing unit to receive the pressure measurement data, and a feedback device electrically connected to the processor to generate a first feedback, under a control of the processor, when the pressure measurement data does not reach a predetermined value, and to generate a second feedback differing from the first feedback, under the control of the processor, when the pressure measurement data reaches the predetermined value.

Abstract: The present invention provides an adjustable upper limb wearable device including: a main body having a first surface and a second surface, and the first surface is connected to the second surface to form a wearable structure. A positioning hole located on a connection line between the first surface and the second surface. A first sensor fixing bracket configured on the connection line adjacent to the positioning hole, and a first sensor is detachably configured within the first sensor fixing bracket. The adjustable upper limb wearable device can not only be worn easily, but also allow users to quickly position the sensor fixing brackets by aligning the positioning hole with the user's acromion to ensure the sensors are correctly positioned.

Abstract: A lightweight automobile brake disc (10) and a preparation method therefor. A disc cap (110) of the lightweight automobile brake disc (10) is prepared from a first aluminum-based material with good processibility, and a disc body (120) is prepared from a second aluminum-based material with good wear resistance and heat resistance. By controlling the alloy element content of an aluminum alloy matrix in the first aluminum-based material to be smaller than or equal to the alloy element content of an aluminum alloy matrix in the second aluminum-based material, the sintering shrinking percentages of the two materials during a preparation process, in which a powder metallurgy method is used, are matched.

Abstract: A method includes: forming a redistribution layer (RDL) comprising metal material over a substrate; forming an oxidation layer of the metal material on sidewalls of the RDL; and depositing a passivation layer over the RDL and the oxidation layer, wherein the oxidation layer is formed between the RDL and the passivation layer; wherein the oxidation layer strengthens bonding between the RDL and the passivation layer to resist hydrogen induced voids from forming. The method may allow for performing a hydrogen plasma annealing treatment without hydrogen-induced voiding in top or bottom corners of the RDL. A device includes: an RDL comprising metal material formed over a substrate; a passivation layer formed over the RDL; and an oxidation layer of the metal material formed on sidewalls of the RDL between the RDL and the passivation layer. The device may be formed without voids in top or bottom corners of the RDL.

Abstract: The present invention relates to an apparatus and method for mass producing hydrogen by reforming plastic waste by means of an electromagnetic plasma torch and, more specifically, to an apparatus and method for mass producing hydrogen by injecting steam or carbon dioxide to an electromagnetic plasma torch system to reform, with high efficiency, a plastic waste compound in a high-temperature reforming chamber by means of active particles which may be generated in a torch flame such as oxygen atoms, hydrogen oxide molecules, hydrogen atoms, carbon monoxide molecules and the like. Synthesis gases generated by reforming in the reforming chamber are mainly carbon monoxide and hydrogen. Carbon monoxide is converted to hydrogen by a water gas reaction, and hydrogen is refined by pressure swing adsorption (PSA). Therefore, vinyl waste and plastic waste which are most fatal to the Earth's environment are eliminated while hydrogen, which is one of the most environment-friendly energy sources, is produced.

Abstract: Bonding a full-bridge device and an LLC device in a stack, or forming the full-bridge device and the LLC device on a same substrate, rather than connecting the devices, reduces a chip area associated with a power converter including the full-bridge device and the LLC device. Additionally, the full-bridge device and the LLC device consume less power because parasitic inductance and capacitance are reduced. Additionally, raw materials and production time are conserved that would otherwise have been used to connect the full-bridge device and the LLC device (e.g., via wires).

Abstract: A integrated circuit includes a first, a second, a third, and a fourth gate, a first input pin and a first conductor. The first and third gate are on a first level. The second and fourth gate are on a second level. The second gate is coupled to the first gate. The fourth gate is coupled to the third gate. The first input pin extends in a second direction, is on a first metal layer above a front-side of a substrate, is coupled to the first gate, and configured to receive a first input signal. The first input pin is electrically coupled to the third gate by the first, second or fourth gate. The first conductor extends in the first direction, is on a second metal layer below a back-side of the substrate, and is coupled to the second and fourth gate.

Abstract: A bearing device in a radial flow adsorber with a gas flow guide function includes a bearing platform, a supporting cylinder, a flow guide pipe, an annular bottom plate, a limiting block and a supporting frame, wherein an upper portion of the bearing platform is filled with adsorbent, an interior of a lower portion of the bearing platform is connected with the annular bottom plate through the supporting cylinder, a backing plate is arranged between the bearing platform and the supporting cylinder, on the supporting cylinder or the annular bottom plate is opened a hole and arranged a plurality of flow guide pipes for guiding gas flow, the annular bottom plate is placed on the supporting frame, the limiting block is arranged on the supporting frame, and the supporting frame is fixed on a cylinder body or a lower head of the adsorber by welding.

Abstract: In an embodiment, a device includes: a first transistor including a first gate structure; a second transistor including a second gate structure, the second gate structure disposed above and coupled to the first gate structure; a third gate structure; a fourth gate structure, the fourth gate structure disposed above and coupled to the third gate structure; a gate isolation region between the first gate structure and the third gate structure, the gate isolation region disposed between the second gate structure and the fourth gate structure; and a cross-coupling contact extending beneath the gate isolation region, the first gate structure, and the third gate structure, the cross-coupling contact coupled to the first gate structure.

Abstract: A vehicle includes a seat assembly. The seat assembly includes a seat cushion, a cushion insert frame rotatably coupled to the seat cushion, and a locking device for engaging the cushion insert frame to the seat cushion and for disengaging the cushion insert frame from the seat cushion to allow for adjusting an angle of the cushion insert frame with respect to the seat cushion.

Abstract: A wearable device an intelligent health promotion service system (IHPSS) is disclosed. One embodiment of the wearable device (10) is configured to interface plurality groups of skin-mounted sensor pads (130) over a body part (140) of a wearer, and comprises: a modular brace (110) structurally separated from the sensor pads, and a plurality of sensor modules (120). The modular bracing is provided with a plurality groups of orienting slots (111) arranged thereon configured to maintain intra-group orientation between the sensor pads, and is configured to allow inter-group distance adjustment between the groups of the sensor pads over the body part of the wearer. The plurality of sensor modules is configured to be detachably coupled to the groups of sensor pads through the orienting slots in the modular bracing member. The sensor modules are provided with physiological sensing circuits wirelessly communicative with the intelligent health system.