Abstract: A motor comprising a stator and a rotor; the stator includes a first stator, a second stator, and a third stator; the stators each include at least one stator coil; the rotor includes a magnetic element, a first bearing, a second bearing, and a shaft; the stators generating a superimposed magnetic field together causes the magnetic element to rotate; when the magnetic element rotates in the first plane, the outer ring of the first bearing rotates; the center of the first bearing is located in a plane where the second bearing is located, and when the magnetic element rotates in the second plane, the inner ring of the second bearing rotates; the central axis of the shaft passes through the center of the first bearing; wherein the shaft is rotatably fixed to the first bearing and connected to the second bearing; the magnetic element located in where the central axis of the first bearing meets the central axis of the second bearing, the normal vector of the first plane is parallel to the axial direction of the sh

Abstract: A transparent conductive film is disclosed. The transparent conductive film includes a substrate and a first silver nanowire layer. The transparent conductive film has a first absorption peak at 340 nm to 400 nm and a second absorption peak at 500 nm-650 nm, and a ratio of a maximum peak intensity of the first absorption peak to a maximum peak intensity of the second absorption peak is in a range of 2 to 5.5.

Abstract: A method to from an inductive component, the method including forming a metal structure having a conductor wire and a lead frame having a first part and a second part space spaced apart from the first part and forming a magnetic body encapsulating the conductor wire, a first portion of the first part and a second portion of the second part of the lead frame adjacent to the conductor wire.

Abstract: A method to from an inductive component, the method including forming a metal structure having a conductor wire and a lead frame having a first part and a second part space spaced apart from the first part and forming a magnetic body encapsulating the conductor wire, a first portion of the first part and a second portion of the second part of the lead frame adjacent to the conductor wire.

Abstract: An inductive component is disclosed, the inductive component comprising: a metal structure, the metal structure comprising a conductor wire and a lead frame, wherein the lead frame and the conductor wire are integrally formed, wherein the lead frame comprises a first part and a second part space spaced apart from the first part, wherein a contiguous metal path is formed from the first part of the lead frame to the second part of the lead frame via the conductor wire; a magnetic body encapsulating the conductor wire, and a first portion of the first part and a second portion of the second part of the lead frame adjacent to the conductor wire.

Abstract: A waveguide array module according to some embodiments of the present disclosure includes a lens array and a waveguide component. The lens array is configured to output a plurality of light beams of different wavelengths. The waveguide component includes a plurality of waveguide channels configured to respectively direct the plurality of light beams. Each of the waveguide channels includes an input port on a first surface facing the lens array and configured to receive a respective one of the light beams, and an output port on a second surface non-parallel to the first surface and configured to output the respective one of the light beams.

Abstract: An electronic component comprising: a body; a conductive wire in the body; and a first lead comprising a first part disposed on a first surface of the body and a second part disposed on a second surface of the body, wherein the second part of the first lead comprises a first protrusion portion and a second protrusion portion spaced apart from each other, wherein a first portion of a first terminal part of the conductive wire is disposed between the first protrusion portion and the second part of the first lead disposed on the second surface of the body, and a second portion of the first terminal part of the conductive wire is disposed between the second protrusion portion and the second part of the first lead disposed on the second surface of the body.

Abstract: An electronic component is disclosed, wherein electronic component comprises: a body; a conductive element disposed in the body; a first lead disposed on the body, wherein a first part of the first lead is disposed on a first surface of the body, a second part of the first lead is disposed on a second surface of the body and a third part of the first lead is disposed on a third surface of the body, wherein the first surface, the second surface and the third surface of the body are not coplanar with each other, wherein the first lead is electrically connected to the conductive element.

Abstract: An electronic component is disclosed, wherein electronic component comprises: a body; a conductive element disposed in the body; a first lead disposed on the body, wherein a first part of the first lead is disposed on a first surface of the body, a second part of the first lead is disposed on a second surface of the body and a third part of the first lead is disposed on a third surface of the body, wherein the first surface, the second surface and the third surface of the body are not coplanar with each other, wherein the first lead is electrically connected to the conductive element.

Abstract: A method of fabricating a semiconductor image sensor device is disclosed. A plurality of radiation-sensing regions is formed in a substrate. The radiation-sensing regions are formed in a non-scribe-line region of the image sensor device. An opening is formed in a scribe-line region of the image sensor device by etching the substrate in the scribe-line region. A portion of the substrate remains in the scribe-line region after the etching. The opening is then filled with an organic material.

Abstract: An inductive component is disclosed, the inductive component comprising: a metal structure, the metal structure comprising a conductor wire and a lead frame, wherein the lead frame and the conductor wire are integrally formed, wherein the lead frame comprises a first part and a second part space spaced apart from the first part, wherein a contiguous metal path is formed from the first part of the lead frame to the second part of the lead frame via the conductor wire; a magnetic body encapsulating the conductor wire, and a first portion of the first part and a second portion of the second part of the lead frame adjacent to the conductor wire.

Abstract: A WDM multiplexing/demultiplexing system includes a de-multiplexer configured to separate and guide light beams from an incident ray having a plurality of wavelengths to corresponding lenses on an optical device, a multiplexer configured to guide light beams from optical transmitters having various wavelengths through the corresponding lenses on the optical device and combine the light beams, a lens array including the corresponding lenses to receive and/or transmit the light beams from or to the de-multiplexer and multiplexer, and a light beam collimator configured to function with the multiplexer and de-multiplexer. The light beams received or transmitted by the light beam collimator and the light beams transmitted or received from or to the multiplexer and de-multiplexer are collinear. The light beam collimator and multiplexer/de-multiplexer can be easily positioned to predetermined or designed positions, thereby providing light beams output through the lenses in a plastic optical device.

Abstract: A method of fabricating a semiconductor image sensor device is disclosed. A plurality of radiation-sensing regions is formed in a substrate. The radiation-sensing regions are formed in a non-scribe-line region of the image sensor device. An opening is formed in a scribe-line region of the image sensor device by etching the substrate in the scribe-line region. A portion of the substrate remains in the scribe-line region after the etching. The opening is then filled with an organic material.

Abstract: A method includes providing a substrate having a first surface and a second surface, the first surface being opposite the second surface, forming a light sensing region at the first surface of the substrate, forming a doped layer at the second surface of the substrate using a laser annealing process, and performing a chemical mechanical polishing process on the annealed, doped layer.

Abstract: A method of fabricating a semiconductor image sensor device is disclosed. A plurality of radiation-sensing regions is formed in a substrate. The radiation-sensing regions are formed in a non-scribe-line region of the image sensor device. An opening is formed in a scribe-line region of the image sensor device by etching the substrate in the scribe-line region. A portion of the substrate remains in the scribe-line region after the etching. The opening is then filled with an organic material.

Abstract: The present disclosure relates to a process tool system that utilizes tool sensor data and an embedded or built-in tool model to facilitate semiconductor fabrication. The process tool system includes a sensor data component, the tool model, and an execution system. The sensor data component is configured to provide the tool sensor data. The tool model is built in a process tool and is configured to generate model outputs based on model inputs. The manufacturing execution system is configured to provide tool process data, including actual metrology and previous process data, to the sensor data component. Additionally, the execution system provides the model inputs to the tool model and receives the model outputs from the tool model. The execution system provides one or more execution system outputs based on the sensor data and the model outputs. The sensor data can include measured semiconductor device characteristics.

Abstract: A manufacturing execution system (MES) with virtual-metrology capabilities and a manufacturing system including the MES are provided. The MES is built on a middleware architecture (such as an object request broker architecture), and includes an equipment manager, a virtual metrology system (VMS), a statistical process control (SPC) system, an alarm manager and a scheduler. The manufacturing system includes a first process tool, a second process tool, a metrology tool, the aforementioned MES, a first R2R (Run-to-Run) controller and a second R2R controller.

Abstract: Provided is a semiconductor image sensor device. The image sensor device includes a semiconductor substrate that includes an array region and a black level correction region. The array region contains a plurality of radiation-sensitive pixels. The black level correction region contains one or more reference pixels. The substrate has a front side and a back side. The image sensor device includes a first compressively-stressed layer formed on the back side of the substrate. The first compressively-stressed layer contains silicon nitride. The image sensor device includes a metal shield formed on the compressively-stressed layer. The metal shield is formed over at least a portion of the black level correction region. The image sensor device includes a second compressively-stressed layer formed on the metal shield and the first compressively-stressed layer. The second compressively-stressed layer contains silicon oxide. A sidewall of the metal shield is protected by the second compressively-stressed layer.

Abstract: A method includes providing a substrate having a first surface and a second surface, the first surface being opposite the second surface, forming a light sensing region at the first surface of the substrate, forming a doped layer at the second surface of the substrate using a laser annealing process, and performing a chemical mechanical polishing process on the annealed, doped layer.

Abstract: A WDM multiplexing/demultiplexing system includes a de-multiplexer configured to separate and guide light beams from an incident ray having a plurality of wavelengths to corresponding lenses on an optical device, a multiplexer configured to guide light beams from optical transmitters having various wavelengths through the corresponding lenses on the optical device and combine the light beams, a lens array including the corresponding lenses to receive and/or transmit the light beams from or to the de-multiplexer and multiplexer, and a light beam collimator configured to function with the multiplexer and de-multiplexer. The light beams received or transmitted by the light beam collimator and the light beams transmitted or received from or to the multiplexer and de-multiplexer are collinear. The light beam collimator and multiplexer/de-multiplexer can be easily positioned to predetermined or designed positions, thereby providing light beams output through the lenses in a plastic optical device.