Patents by Inventor Yung Cheng Chen

Yung Cheng Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20050197721
    Abstract: A method for controlling exposure energy on a wafer substrate, with a feedback process control signal of wafer thickness critical dimension, and with a feed forward process control signal of a compensation amount that compensates for thickness variations of an interlayer of the wafer substrate.
    Type: Application
    Filed: February 20, 2004
    Publication date: September 8, 2005
    Inventors: Yung-Cheng Chen, You-Wei Shen, Chun-Ming Hu
  • Patent number: 6939220
    Abstract: A control structure is fastened with a housing of the electronic machine or the like for regulating the operation of a cooling device which is contained in the housing. The control structure comprises a control member and an adjustment member. The control member is fastened to an inner end of a vent of the housing and is provided with a regulating end which is connected to the cooling device for regulation the operation of the cooling device. The adjustment member is pivoted to an outer end of the vent of the housing and is connected with the regulating end of the control member. The regulating end of the control member is actuated by the adjustment member in motion. Both the control member and the adjustment member are fastened with the vent of the housing without obstructing the vent.
    Type: Grant
    Filed: August 6, 2003
    Date of Patent: September 6, 2005
    Inventor: Yung Cheng Chen
  • Publication number: 20040041757
    Abstract: A Light Emitting Diode Display Module with high heat-dispersion and the substrate thereof; the Light Emitting Diode Display Module comprises a substrate having high heat-dispersion and a plurality of light emitting diode settled on the substrate; forming an insulating layer on the surface of a metal plate, next to settle the copper circuit layer on the insulating layer, the copper circuit layer could be used on the surface mount light emitting display device, the insulating layer is also a material with fine heat conductivity, especially a metal oxide which conductivity coefficient higher than resin or cellulose, thus the display module will diffuse the produced heat onto the whole circuit board and the heat could be dispersed into the air.
    Type: Application
    Filed: September 4, 2002
    Publication date: March 4, 2004
    Inventors: Ming-Hsiang Yang, Yung-Cheng Chen
  • Publication number: 20030150595
    Abstract: The present invention of a structure and manufacture of a heat sink with high heat transmission mainly uses a shear stress caused by stirring to break or crush the solidified arborescent primary crystal at a solid/liquid two-phase area of a aluminum alloy to form a slag fluid with ball-filled solid crushed grit; then ceramic grains are added in and dispersed by the solid grains scattered in the liquid-phase metal; through continuous stirring, the aluminum alloy becomes a fine mixed fluid of ceramic and aluminum alloy without arborescent forms; finally, the external configuration of a heat sink is accomplished through directly compression casting by using the special nature of the aluminum alloy to mold the entire heat sink and to enhance the effect of heat dissipation of the heat sink of the same structure through the high heat transmission efficiency of the ceramic grains.
    Type: Application
    Filed: February 12, 2002
    Publication date: August 14, 2003
    Inventors: Yung-Cheng Chen, Chuan-Cheng Huang, Chuan-Ching Tung, Jia-Jen Yeh
  • Patent number: 6148838
    Abstract: The present invention discloses an automated processing liquid drain system that utilizes a series of processing liquid drain tanks and at least two waste collection tanks that are in fluid communication with the processing liquid drain tanks such that when a high liquid level sensor mounted on the drain tank is activated, the spent processing liquid collected from processing machines can be transferred to one of the waste collection tanks and thus preventing overflow in the processing liquid drain tanks.
    Type: Grant
    Filed: May 28, 1997
    Date of Patent: November 21, 2000
    Assignee: Vanguard International Semiconductor Corporation
    Inventors: Jyh-Yeong Tsay, Yung-Cheng Chen
  • Patent number: D509774
    Type: Grant
    Filed: December 28, 2004
    Date of Patent: September 20, 2005
    Inventor: Yung Cheng Chen
  • Patent number: D509775
    Type: Grant
    Filed: December 28, 2004
    Date of Patent: September 20, 2005
    Inventor: Yung Cheng Chen