Patents by Inventor Yung-Hsiang Chen

Yung-Hsiang Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200335340
    Abstract: A method of manufacturing a semiconductor device including operations of forming a first hard mask over an underlying layer on a substrate by a photolithographic and etching method, forming a sidewall spacer pattern having a first sidewall portion and a second sidewall portion on opposing sides of the first hard mask, etching the first sidewall portion, etching the first hard mask and leaving the second sidewall portion bridging a gap of the etched first hard mask, and processing the underlying layer using the second hard mask.
    Type: Application
    Filed: July 6, 2020
    Publication date: October 22, 2020
    Inventors: Shih-Chun HUANG, Chiu-Hsiang CHEN, Ya-Wen YEH, Yu-Tien SHEN, Po-Chin CHANG, Chien Wen LAI, Wei-Liang LIN, Ya Hui CHANG, Yung-Sung YEN, Li-Te LIN, Pinyen LIN, Ru-Gun LIU, Chin-Hsiang LIN
  • Publication number: 20200323790
    Abstract: A method for treatment of acute lung injury by use of kirenol is revealed. The method includes a step of applying an effective dose of kirenol to an individual in need for reducing hyaline membrane formation, neutrophil infiltration, pulmonary edema, and pulmonary oxidative stress so as to treat acute lung injury.
    Type: Application
    Filed: April 12, 2019
    Publication date: October 15, 2020
    Inventors: YU-HSIANG KUAN, CHUN-JUNG CHEN, SHIUAN-SHINN LEE, YUNG-CHYUAN HO
  • Patent number: 10804435
    Abstract: A light-emitting device includes a semiconductor stack including a first semiconductor layer, a second semiconductor layer, and an active layer emitting an UV light, formed between the first semiconductor layer and the second semiconductor layer; a first transparent conductive layer formed on the second semiconductor layer, the first transparent conductive layer including metal oxide; and a second transparent conductive layer formed on the first transparent conductive layer, the second transparent conductive layer including graphene, wherein the first transparent conductive layer is continuously formed over a top surface of the second semiconductor layer, the first transparent conductive layer comprises a thickness smaller than 10 nm.
    Type: Grant
    Filed: August 25, 2017
    Date of Patent: October 13, 2020
    Assignee: EPISTAR CORPORATION
    Inventors: Chang-Tai Hisao, I-Lun Ma, Hao-Yu Chen, Shu-Fen Hu, Ru-Shi Liu, Chih-Ming Wang, Chun-Yuan Chen, Yih-Hua Renn, Chien-Hsin Wang, Yung-Hsiang Lin
  • Publication number: 20200322731
    Abstract: An acoustic transducer includes a base plate, a vibrating membrane and a back plate. The vibrating membrane covers an opening of the base plate and has a plurality of conjoint vibratile portions and a plurality of elastic structures. The elastic structures are concentrically arranged along peripheries of the vibratile portions. The acoustic transducer further has a connecting portion extending from the back plate to a boundary between each two of the adjacent vibratile portions so as to allow the vibratile portions to generate vibration independently. The elastic structures include a first elastic structure and a second elastic structures arranged alongside of the boundary, and a third elastic structure arranged along an outer periphery of the vibrating membrane. The vibratile portions are geometrically different from each other and different in rigidity, and the vibratile portions can vibrate independently to respond to various sound pressure levels.
    Type: Application
    Filed: June 23, 2020
    Publication date: October 8, 2020
    Applicant: Merry Electronics(Shenzhen) Co., Ltd.
    Inventors: Jen-Yi Chen, Chao-Sen Chang, Yung-Hsiang Chang
  • Publication number: 20200307042
    Abstract: An injection molding apparatus including an injection device, a mold, a gas supply device, and a temperature control device is provided. The mold has a mold cavity, wherein the injection device is adapted to inject a material into the mold cavity. The gas supply device is adapted to supply a gas to the mold cavity such that the pressure in the mold cavity is increased. The temperature control device is adapted to control the temperature in the mold cavity. In addition, an injection molding method is also provided.
    Type: Application
    Filed: July 5, 2019
    Publication date: October 1, 2020
    Applicant: Chung Yuan Christian University
    Inventors: Shia-Chung Chen, Yung-Hsiang Chang, Kuan-Hua Lee, Che-Wei Chang
  • Patent number: 10786443
    Abstract: A method for protecting skin is provided, wherein the method comprises administering to a subject in need an effective amount of an orchid callus extract, and the extract is a polar solvent extract of a callus of orchid leaves. The method is especially for moisturizing skin, increasing skin tenderness, increasing skin abundance, increasing skin elasticity, tightening skin, reducing skin textures, delaying skin aging, assisting in increasing content of collagen, repairing skin tissues, preventing skin lesions, and/or promoting wound healing.
    Type: Grant
    Filed: April 4, 2018
    Date of Patent: September 29, 2020
    Assignee: TCI CO., LTD.
    Inventors: Yung-Hsiang Lin, Cheng-Shing Li, Kai-Wen Kan, Ciao-Ting Chen, Fu-Chen Liu
  • Publication number: 20200294915
    Abstract: A package structure includes a semiconductor die and a first redistribution circuit structure. The first redistribution circuit structure is disposed on and electrically connected to the semiconductor die, and includes a first build-up layer. The first build-up layer includes a first metallization layer and a first dielectric layer laterally wrapping the first metallization layer, wherein at least a portion of the first metallization layer is protruded out of the first dielectric layer.
    Type: Application
    Filed: March 14, 2019
    Publication date: September 17, 2020
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yung-Chi Chu, Hung-Jui Kuo, Yu-Hsiang Hu, Wei-Chih Chen
  • Publication number: 20200289454
    Abstract: A method for suppressing tumor metastasis, in which an effective amount of a compound of formula (I) is administered to a subject in need thereof. Also disclosed is a method of treating cancer, in which an effective amount of a chemotherapy agent and an effective amount of a compound of formula (I) is administered to a subject in need thereof. Further disclosed are pharmaceutical compositions for suppressing tumor metastasis and for treating cancer, each of the compositions containing a compound of formula (I).
    Type: Application
    Filed: March 17, 2017
    Publication date: September 17, 2020
    Applicants: ACADEMIA, Sinica
    Inventors: Ning-Sun Yang, Yueh-Hsiung Kuo, Shu-Yi Yin, Yung-Hsiang Chen
  • Publication number: 20200279743
    Abstract: A method for semiconductor manufacturing includes providing a substrate, forming a patterning layer over the substrate, and patterning the patterning layer to form a hole in the patterning layer. The method also includes applying a first directional etching to two inner sidewalls of the hole to expand the hole along a first direction and applying a second directional etching to another two inner sidewalls of the hole to expand the hole along a second direction that is different from the first direction.
    Type: Application
    Filed: May 19, 2020
    Publication date: September 3, 2020
    Inventors: Yu-Tien Shen, Chi-Cheng Hung, Chin-Hsiang Lin, Chien-Wei Wang, Ching-Yu Chang, Chih-Yuan Ting, Kuei-Shun Chen, Ru-Gun Liu, Wei-Liang Lin, Ya Hui Chang, Yuan-Hsiang Lung, Yen-Ming Chen, Yung-Sung Yen
  • Publication number: 20200261979
    Abstract: A system for metal injection and counter pressure has: a particle providing assembly; and a forming unit having a melting module, a counter pressure module and a mold module; wherein, the particle providing assembly provides particles with metal powder and a binding agent to the melting module, the particles are formed into melted flow by the melting module, the melted flow is provided to the mold module, the counter pressure module provides a counter gas with predetermined pressure to the mold module, the melted flow forms into a green part inside of the mold module.
    Type: Application
    Filed: April 21, 2020
    Publication date: August 20, 2020
    Inventors: SHIA-CHUNG CHEN, JEN-AN CHANG, YUNG-HSIANG CHANG, KUAN-HUA LEE
  • Publication number: 20200251171
    Abstract: A circuit to program a programmable memory cell, such as an OTP (One-Time-Programmable) memory cell, by using by using an additional conductive path from a bit line (or a source line) to a source line (or a bit line) of the OTP (One-Time-Programmable) memory cell via an internal parasitic diode for programming the OTP memory cell.
    Type: Application
    Filed: May 28, 2019
    Publication date: August 6, 2020
    Inventors: SHIH-HSIU CHEN, WEI-FAN WU, HSUAN-CHI SU, WEI HUAN CHEN, CHING-HSIANG LIN, YUNG-CHIEN LEE, SHUI-SHOU WANG, WEN-HUA YU
  • Publication number: 20200251166
    Abstract: A circuit to program a programmable memory cell, such as an OTP (One-Time-Programmable) memory cell, by using a current source to output a current to a bit-line of the OTP memory cell, wherein the amount of the current outputted from the current source can be adjusted according to a feedback signal from the OTP memory cell.
    Type: Application
    Filed: April 19, 2019
    Publication date: August 6, 2020
    Inventors: SHIH-HSIU CHEN, WEI-FAN WU, HSUAN-CHI SU, WEI HUAN CHEN, CHING-HSIANG LIN, YUNG-CHIEN LEE, SHUI-SHOU WANG, WEN-HUA YU
  • Publication number: 20200235287
    Abstract: An electrical contact structure and a method for forming the electrical contact structure are provided. The method includes forming a thin film material layer on a substrate, forming a first barrier layer on the thin film material layer and forming a metal layer on the first barrier layer. The method further includes patterning the metal layer to form a metal pattern, forming a spacer on a sidewall of the metal pattern and covering a portion of the first barrier layer. The method further includes etching the first barrier layer, wherein the portion of the first barrier layer located under the spacer is not completely etched. The method further includes removing the spacer and exposing the sidewall of the metal pattern to form an electrical contact structure on the thin film material layer, wherein the first barrier layer has a protrusion part exceeding the sidewall of the metal pattern.
    Type: Application
    Filed: April 1, 2020
    Publication date: July 23, 2020
    Applicant: Vanguard International Semiconductor Corporation
    Inventors: Chien-Hui LI, Chien-Hsun WU, Yung-Hsiang CHEN
  • Publication number: 20200223094
    Abstract: An injection molding apparatus including a ceramic powder material injection device, a mold, and a gas providing device is provided. The ceramic powder material injection device is adapted to contain a ceramic powder material. The mold has a molding concavity, wherein the ceramic powder material injection device is adapted to inject at least the ceramic powder material into the molding concavity. The gas providing device is adapted to provide a gas into the molding concavity to increase a pressure in the molding concavity to increase a density of the ceramic powder material in the molding concavity. In addition, an injection molding method is also provided.
    Type: Application
    Filed: December 5, 2019
    Publication date: July 16, 2020
    Applicant: Chung Yuan Christian University
    Inventors: Shia-Chung Chen, Yung-Hsiang Chang, Kuan-Hua Lee, Che-Wei Chang
  • Patent number: 10707081
    Abstract: A method of manufacturing a semiconductor device including operations of forming a first hard mask over an underlying layer on a substrate by a photolithographic and etching method, forming a sidewall spacer pattern having a first sidewall portion and a second sidewall portion on opposing sides of the first hard mask, etching the first sidewall portion, etching the first hard mask and leaving the second sidewall portion bridging a gap of the etched first hard mask, and processing the underlying layer using the second hard mask.
    Type: Grant
    Filed: November 1, 2018
    Date of Patent: July 7, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Shih-Chun Huang, Chiu-Hsiang Chen, Ya-Wen Yeh, Yu-Tien Shen, Po-Chin Chang, Chien Wen Lai, Wei-Liang Lin, Ya Hui Chang, Yung-Sung Yen, Li-Te Lin, Pinyen Lin, Ru-Gun Liu, Chin-Hsiang Lin
  • Publication number: 20200204986
    Abstract: Various examples and schemes pertaining to uplink data compression (UDC) in mobile communications are described. A processor of an apparatus receives a Packet Data Convergence Protocol (PDCP) Session Data Unit (SDU) and performs uplink data compression (UDC) to compress a data portion of the PDCP SDU to generate a UDC packet. The processor also generates a message authentication code with integrity (MAC-I). The processor also ciphers at least a data portion of the UDC packet to provide a ciphered UDC packet. In case the PDCP SDU contains a Service Data Application Protocol (SDAP) header, the processor extracts the SDAP header from the PDCP SDU prior to performing the UDC, and the processor prepends the SDAP header to the ciphered UDC packet. The processor further constructs a PDCP Protocol Data Unit (PDU) by prepending a PDCP header to either the SDAP header or the ciphered UDC packet.
    Type: Application
    Filed: December 19, 2019
    Publication date: June 25, 2020
    Inventors: Yung-Hsiang Liu, Yih-Shen Chen
  • Publication number: 20200180195
    Abstract: An injection molding apparatus including a mold, a gas supply device, and an injection device is provided. The mold has a molding cavity. The gas supply device is adapted to supply a gas into the molding cavity to adjust a pressure in the molding cavity from a non-pressurized state to a pressurized state by the gas. The injection device is adapted to inject a material into the molding concavity. The material includes a foaming material, the foaming material is prevented from being gasified in the pressurized state, and the foaming material is gasified in the non-pressurized state. In addition, an injection molding method is also provided.
    Type: Application
    Filed: July 18, 2019
    Publication date: June 11, 2020
    Applicant: Chung Yuan Christian University
    Inventors: Shia-Chung Chen, Yung-Hsiang Chang, Kuan-Hua Lee, Che-Wei Chang
  • Publication number: 20200180200
    Abstract: An injection molding apparatus including a mold and an injection device is provided. The mold includes a fixed portion and a movable portion. A molding concavity is formed between the fixed portion and the movable portion, and the movable portion is adapted to move relative to the fixed portion to change a volume of the molding cavity, so that a pressure inside the molding concavity is adjusted between a pressurized state and a non-pressurized state. The injection device is adapted to inject a material into the molding concavity. The material includes a supercritical fluid, the supercritical fluid is prevented from being gasified in the pressurized state, and the supercritical fluid is gasified in the non-pressurized state. In addition, an injection molding method is also provided.
    Type: Application
    Filed: July 5, 2019
    Publication date: June 11, 2020
    Applicant: Chung Yuan Christian University
    Inventors: Shia-Chung Chen, Yung-Hsiang Chang, Kuan-Hua Lee, Che-Wei Chang, Pi-Lin Tsai
  • Patent number: 10675319
    Abstract: A method for at least one of adjusting the biological clock, improving sleep quality, and facilitating sleep is provided, wherein the method comprises administering to the subject an effective amount of a Momordica charantia extract, wherein the extract is obtained by extracting a fruit of Momordica charantia with water.
    Type: Grant
    Filed: October 24, 2018
    Date of Patent: June 9, 2020
    Assignee: TCI CO., LTD.
    Inventors: Yung-Hsiang Lin, I-Hui Chen
  • Publication number: 20200167924
    Abstract: A method, an apparatus and a system for cell detection are provided. In the apparatus, a hyperspectrum module is used to capture information across electromagnetic spectrums from an image, a stereo camera module is used to capture three-dimensional image information, and the hyperspectrum module and the stereo camera module form a trinocular micro spectrometer. A microscopic optical module is provided for the two modules to form hyperspectrum and three-dimensional image information from a cell and its split cells via a lens. In the method, a series of continuous images are obtained within a time period. An observation image array with a plurality of observation image zones are provided to retrieve coordinates of a plurality of feature points at different times. Finally, a holistic cellular activity can be obtained by analyzing continuous hyperspectrum and 3D image information from the images over time.
    Type: Application
    Filed: November 14, 2019
    Publication date: May 28, 2020
    Inventors: WEI-CHUNG WANG, YUNG-HSIANG CHEN, CHUAN-YI TANG, CHING-HUAN KUO