Patents by Inventor Yung-Hsiang Chen

Yung-Hsiang Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190308354
    Abstract: An injection molding apparatus including a mold, an injection device and a specific volume sensing module is provided. The injection device is adapted to inject a material into the mold. At least parts of the specific volume sensing module are disposed at the mold, wherein the specific volume sensing module is adapted to sense an actual specific volume of the material in the mold. In addition, an injection molding method is also provided.
    Type: Application
    Filed: June 25, 2018
    Publication date: October 10, 2019
    Applicant: Chung Yuan Christian University
    Inventors: Shia-Chung Chen, Yung-Hsiang Chang, Ying-Fan Lou
  • Publication number: 20190307827
    Abstract: A method for inhibiting the expression of ICAM-1 gene is provided, wherein the method comprises administering to a subject in need an effective amount of an euryale seed extract. The method is especially for treating, preventing or regulating diseases or physiological functions associated with ICAM-1 gene.
    Type: Application
    Filed: August 14, 2018
    Publication date: October 10, 2019
    Inventors: Yung-Hsiang LIN, Cheng-Shing LI, Kai-Wen KAN, Ciao-Ting CHEN, Fu-Chen LIU
  • Publication number: 20190309744
    Abstract: A miniature cooling system includes a base metal sheet, a flow channel layer, a piezoelectrically actuated metal sheet, a piezoelectric boundary compression layer and two piezoelectric ceramic vibrators. The flow channel layer is located on the base metal sheet and includes a first chamber, a second chamber, an inlet channel, a linking channel and an outlet channel. The inlet channel links the outside environment to the first chamber. The linking channel links the first chamber and the second chamber. The outlet channel links the second chamber to the outside environment. The piezoelectrically actuated metal sheet is located on the flow channel layer. The piezoelectric boundary compression layer is located on the piezoelectrically actuated metal sheet. The piezoelectric boundary compression layer includes two containing areas, and the two containing areas are respectively located above the first chamber and the second chamber.
    Type: Application
    Filed: August 30, 2018
    Publication date: October 10, 2019
    Inventors: Yung TING, Sheuan-Perng LIN, Chien-Ping WANG, Chien-Hsiang WU, Jun-Hao CHEN
  • Patent number: 10437205
    Abstract: A control system and a control method of manufacturing injection molding products are provided. The control system includes an injection molding machine, an information input interface, a computing server and a data conversion device. At first, product information is inputted through the information input interface. The product information is transmitted to the computing server, and then the computing server determines injection molding parameters according to the product information. The injection molding parameters are transmitted to the information input interface. After data conversion through the data conversion device, the injection molding machine is controlled to manufacture the injection molding products according to the converted injection molding parameters.
    Type: Grant
    Filed: October 2, 2015
    Date of Patent: October 8, 2019
    Assignee: CHUNG YUAN CHRISTIAN UNIVERSITY
    Inventors: Shia-Chung Chen, Chia-Yen Tseng, Yung-Hsiang Chang, Kuan-Hua Lee
  • Publication number: 20190223317
    Abstract: An air duct that can be attached to existing grille of an electronic device to improve airflow and reduce overall system impedance/pressure drop without increasing the power to an air mover. The air duct has a wall configuration to smooth-out airflow while simultaneously delivering more airflow to selected portions of the interior of an electronic device, such as a server.
    Type: Application
    Filed: March 29, 2018
    Publication date: July 18, 2019
    Inventors: Chao-Jung CHEN, Yu-Nien HUANG, Herman TAN, Yung-Hsiang LU
  • Publication number: 20190185614
    Abstract: An elastomer is provided, which is a product of reacting C4-12 lactam, poly(C2-4 alkylene glycol), C4-12 diacid, and multi-ester aliphatic monomer. The C4-12 lactam and the poly(C2-4 alkylene glycol) have a weight ratio of 20:80 to 80:20. The total weight of the C4-12 lactam and the poly(C2-4 alkylene glycol) and the weight of the C4-12 diacid have a ratio of 100:0.5 to 100:10. The total weight of the C4-12 lactam and the poly(C2-4 alkylene glycol) and the weight of the multi-ester aliphatic monomer have a ratio of 100:0.01 to 100:5.
    Type: Application
    Filed: December 28, 2017
    Publication date: June 20, 2019
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Sheng-Lung CHANG, Jen-Chun CHIU, Yung-Chan LIN, Chih-Hsiang LIN, Chien-Ming CHEN
  • Publication number: 20190178860
    Abstract: The present invention provides a miniature gas sensor, which comprises a gas sensor chip. The gas sensor chip includes a hollow structure on the back. An insulating layer is disposed below the sensing material. A miniature heating device is disposed surrounding the sensing material. The sensing material is adhered to the sensing electrodes. The sensing material includes two metal oxide semiconductors or a compound structure of the sensing layer having a metal oxide semiconductor and a reaction layer with a rough surface. An interface layer is sandwiched between the two metal oxide layers for increasing the efficiency in sensing gas. The gas sensor according to the present invention can be implemented on silicon substrate with hollow structures. In addition, the size of the chip can be miniaturized.
    Type: Application
    Filed: December 11, 2017
    Publication date: June 13, 2019
    Inventors: TING-JEN HSUEH, YU-JEN HSIAO, YU-TE LIN, YEN-HSI LI, YUNG-HSIANG CHEN, JIA-MIN SHIEH
  • Patent number: 10310390
    Abstract: An apparatus for a chuck having particle recesses is provided. In some embodiments, the chuck includes a plurality of impressions and a particle recess. The impressions of the plurality of impressions are laterally spaced and extend into the chuck from a top surface of the chuck to a base surface of the chuck. The base surface of the chuck defines bottom surfaces respectively of the impressions and is spaced between the top surface of the chuck and a bottom surface of the chuck. The particle recess extends in to the chuck from the top surface of the chuck to a location spaced between the base surface of the chuck and the bottom surface of the chuck. In particular, the particle recess is configured to underlie a workpiece alignment mark of a workpiece.
    Type: Grant
    Filed: August 28, 2017
    Date of Patent: June 4, 2019
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yung-Hsiang Chen, Chung-Yi Ho, David Zhou
  • Patent number: 10303207
    Abstract: An electronic device includes a support element, a second cover, a second guiding element and including a pushing element. The support element includes a first cover and a first guiding element. The first guiding element is connected to the first cover. The second guiding element is slidably jointed to the first guiding element to move relative to the first guiding element in a direction and is connected to the second cover. The pushing element is connected to the second cover and configured to push against the support when the second cover rotates relative to the second guiding element to make the support element move relative to the second guiding element.
    Type: Grant
    Filed: June 7, 2018
    Date of Patent: May 28, 2019
    Assignee: ASUSTEK COMPUTER INC.
    Inventors: Ming-Hsing Yang, Kun-Hsiang Tsai, Yung-Hsiang Chen, Li-Wei Hung
  • Publication number: 20190146362
    Abstract: A lithography system is provided. The lithography system includes a mask and an optical module. The optical module is configured to optically form an invisible pellicle over the mask to protect the mask from contaminant particles.
    Type: Application
    Filed: February 27, 2018
    Publication date: May 16, 2019
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chiu-Hsiang CHEN, Shih-Ming CHANG, Chih-Jie LEE, Han-Wei WU, Yung-Sung YEN, Ru-Gun LIU
  • Publication number: 20190148147
    Abstract: A method of manufacturing a semiconductor device including operations of forming a first hard mask over an underlying layer on a substrate by a photolithographic and etching method, forming a sidewall spacer pattern having a first sidewall portion and a second sidewall portion on opposing sides of the first hard mask, etching the first sidewall portion, etching the first hard mask and leaving the second sidewall portion bridging a gap of the etched first hard mask, and processing the underlying layer using the second hard mask.
    Type: Application
    Filed: November 1, 2018
    Publication date: May 16, 2019
    Inventors: Shih-Chun Huang, Chiu-Hsiang Chen, Ya-Wen Yeh, Yu-Tien Shen, Po-Chin Chang, Chien Wen Lai, Wei-Liang Lin, Ya Hui Chang, Yung-Sung Yen, Li-Te Lin, Pinyen Lin, Ru-Gun Liu, Chin-Hsiang Lin
  • Publication number: 20190141567
    Abstract: A method of uplink data compression (UDC) error handling is proposed to handle UDC error and to maintain compression memory synchronization between a transmitter and a receiver. Specifically, UDC checksum operation is proposed to maintain compression memory synchronization between compressor at the transmitter and decompressor at the receiver. The transmitter attaches a checksum to each UDC packet and keeps processed uncompressed data in a compression memory. The receiver decompresses each UDC packet and keeps processed uncompressed data in a compression memory. If the UDC compression memory is unsynchronized and a checksum mismatch is detected, the receiver sends an error indication to the transmitter, which resets its compression memory. The transmitter sends a reset indication to the receiver to reset its compression memory. The UDC compression memory is re-synchronized and UDC is restarted from the beginning.
    Type: Application
    Filed: November 2, 2018
    Publication date: May 9, 2019
    Inventors: Yung-Hsiang Liu, Chia-Chun Hsu, Yih-Shen Chen
  • Patent number: 10211874
    Abstract: A protective cover comprises a fixing plate, a first folding plate, a second folding plate, and a third folding plate. The fixing plate is fixed connected to a back surface of an electronic device and includes a first magnetic component. The first folding plate is foldably connected to the fixing plate and attaches to the back surface by a first attaching force. The second folding plate is foldably connected to the fixing plate and attaches to the back surface by a second attaching force. The third folding plate is foldably connected to the second folding plate and includes a second magnetic component to attach to the back surface. When the protective cover is folded, the third folding plate, the second folding plate, and the first folding plate leave the back surface in sequence; the fixing plate, the first folding plate, and the second folding plate form a support state.
    Type: Grant
    Filed: December 27, 2017
    Date of Patent: February 19, 2019
    Assignee: ASUSTEK COMPUTER INC.
    Inventors: Erh-Ting Kao, Yung-Hsiang Chen, Jack Lam, Yi-chen Yen
  • Publication number: 20190049849
    Abstract: An apparatus for a chuck having particle recesses is provided. In some embodiments, the chuck includes a plurality of impressions and a particle recess. The impressions of the plurality of impressions are laterally spaced and extend into the chuck from a top surface of the chuck to a base surface of the chuck. The base surface of the chuck defines bottom surfaces respectively of the impressions and is spaced between the top surface of the chuck and a bottom surface of the chuck. The particle recess extends in to the chuck from the top surface of the chuck to a location spaced between the base surface of the chuck and the bottom surface of the chuck. In particular, the particle recess is configured to underlie a workpiece alignment mark of a workpiece.
    Type: Application
    Filed: August 28, 2017
    Publication date: February 14, 2019
    Inventors: Yung-Hsiang Chen, Chung-Yi Ho, David Zhou
  • Publication number: 20190035930
    Abstract: A semiconductor structure includes a substrate, a first source/drain region, a second source/drain region, a channel doping region and a gate structure. The first source/drain region is disposed in the substrate. The first source/drain region includes a first region and a second region under the first region. The second source/drain region is disposed in the substrate. The second source/drain region is disposed opposite to the first source/drain region. The channel doping region is disposed in the substrate between the first source/drain region and the second source/drain region. The gate structure is disposed on the channel doping region. In a projection plane parallel to the top surface of the substrate, the second region of the first source/drain region is separated from the gate structure. The first source/drain region, the second source/drain region and the channel doping region have the same conductive type.
    Type: Application
    Filed: July 31, 2017
    Publication date: January 31, 2019
    Inventors: Yung-Hsiang Chen, I-Chen Yang
  • Publication number: 20180364755
    Abstract: An electronic device includes a support element, a second cover, a second guiding element and including a pushing element. The support element includes a first cover and a first guiding element. The first guiding element is connected to the first cover. The second guiding element is slidably jointed to the first guiding element to move relative to the first guiding element in a direction and is connected to the second cover. The pushing element is connected to the second cover and configured to push against the support when the second cover rotates relative to the second guiding element to make the support element move relative to the second guiding element.
    Type: Application
    Filed: June 7, 2018
    Publication date: December 20, 2018
    Inventors: Ming-Hsing YANG, Kun-Hsiang TSAI, Yung-Hsiang CHEN, Li-Wei HUNG
  • Patent number: 10120412
    Abstract: An electronic device is provided. The electronic device comprises a first body structure; a connecting portion; and a second body structure connected to the first body structure via the connecting portion. The second body structure includes a cover portion, and an end portion connected to an edge of the cover portion. A thickness of the end portion is larger than the thickness of the cover portion. An I/O port is disposed at a side wall of the end portion.
    Type: Grant
    Filed: August 16, 2017
    Date of Patent: November 6, 2018
    Assignee: ASUSTeK COMPUTER INC.
    Inventors: Yung-Hsiang Chen, Li-Wei Hung
  • Patent number: 10114425
    Abstract: A portable electronic device comprises a body, a stationary magnetic element and a base. The stationary magnetic element is disposed at a periphery of the first groove. The connecting element of the base is disposed on the bottom plate of the base and including a second engaging surface and a second groove. An opening of the second groove is formed on the second engaging surface. The rotatable magnetic element is pivotally connected with the second groove. One end of the rotatable magnetic element can rotate in/out the second groove. When a distance between the first engaging surface and the second engaging surface is less than a predetermined value and the opening of the first groove faces to the opening of the second groove, the rotatable magnetic element is attracted by the stationary magnetic element to rotate out of the second groove and get into the first groove.
    Type: Grant
    Filed: December 13, 2017
    Date of Patent: October 30, 2018
    Assignee: ASUSTEK COMPUTER INC.
    Inventors: Jack Lam, Yung-Hsiang Chen
  • Publication number: 20180269380
    Abstract: An electrical contact structure and a method for forming the electrical contact structure are provided. The method includes forming a thin film material layer on a substrate, forming a first barrier layer on the thin film material layer and forming a metal layer on the first barrier layer. The method further includes patterning the metal layer to form a metal pattern, forming a spacer on a sidewall of the metal pattern and covering a portion of the first barrier layer. The method further includes etching the first barrier layer, wherein the portion of the first barrier layer located under the spacer is not completely etched. The method further includes removing the spacer and exposing the sidewall of the metal pattern to form an electrical contact structure on the thin film material layer, wherein the first barrier layer has a protrusion part exceeding the sidewall of the metal pattern.
    Type: Application
    Filed: March 16, 2017
    Publication date: September 20, 2018
    Applicant: Vanguard International Semiconductor Corporation
    Inventors: Chien-Hui LI, Chien-Hsun WU, Yung-Hsiang CHEN
  • Patent number: 10067532
    Abstract: An electronic device includes a first machine body and a second machine body adapted to be detachably assembled to the first machine body. The first machine body includes a first casing, a first hinge fixed to a side of the first casing, a second hinge pivoted to the first hinge along an axis, and a first connecting member disposed at the side and linked to the second hinge. The first and the second hinges are covered by the first casing. The second machine body includes a second casing and a second connecting member. When the first machine body is assembled to the second machine body, the first connecting member is fixed to the second connecting member, the second hinge is fixed jointly so that the first hinge is rotatable related to the second hinge. Accordingly, the first casing is rotatable related to the second casing.
    Type: Grant
    Filed: October 27, 2017
    Date of Patent: September 4, 2018
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Jyh-Chyang Tzou, Tsai-Wen Mao, Yao-Tsung Yeh, Huai-Te Tseng, Chia-Chi Sun, Ming-Chung Peng, Yung-Hsiang Chen, Chien-I Lin, Hsin-Hui Huang, Chien-Chia Huang, Tsung-Han Yang