Patents by Inventor Yung-I Yeh

Yung-I Yeh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor packaging device
    Patent number: 5982625
    Abstract: A semiconductor packaging device includes a printed circuit board substrate, a mold gate formed on a periphery of the printed circuit board substrate through which a package encapsulant is poured to enclose electric elements mounted on a side of the printed circuit board, and a layer of non-metallic material covered on the side of the printed circuit board substrate in the mold gate area. The package encapsulant, after hardened, is bonded with the layer of non-metallic material, and the bonded package encapsulant/the layer of non-metallic material is degatable from the mold gate.
    Type: Grant
    Filed: March 19, 1998
    Date of Patent: November 9, 1999
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventors: Kun-Ching Chen, Tao-Yu Chen, Yung-I Yeh, Wu-Chang Wang, Chun-Che Lee, Chun-Hsiung Huang, Shyh-Ing Wu